Dan Berrigan - Closed-Loop Template-free printing of Passive Components

Session 19: 3D Printing

Closed-Loop Template-free printing of Passive Components
Thursday, June 22, 2017 
8:00 AM - 8:25 AM

Template-free 3D printing of electronic devices by direct ink writing has the potential to broaden electronics integration to include complex integrated form factors, but success requires precise, adaptive control over materials and interfaces. The multi-layer capacitor serves as an effective model system for process development because small defects on the order of several microns (e.g., surface roughness, pinholes, or impurities) lead to device failure, and energy density is dictated by processing precision (e.g., dielectric thickness). In this work, we demonstrate the materials and closed-loop control required to print multi-layer capacitors of programmable capacitance in an automated fashion. Polymer dielectric and conductive composite inks based on PMMA are developed to deposit films with programmable thicknesses and comparable dielectric breakdown strength (816 ± 95 V/µm) relative to films deposited using standard lab-scale casting procedures (e.g., spin cast, doctor blade). An in-line metrology feedback-loop was developed to measure layer thicknesses during the build and feed-forward parameters for automated printer adjustment. Resulting single- and double-layer high-voltage capacitors are 3D printed with capacitances as large as 322 pF (at 1 kHz) and breakdown voltages over 1,000 V. This closed-loop control scheme is a significant step towards automated, template-free, 3D printing of high-performance electronics.

 

Speaker's Biography

Dan Berrigan serves as the lead for Additive Manufacturing of Functional Materials at the Air Force Research Laboratory. Dr. Berrigan responsibilities span applied research to investigating the fundamental science needed to further advance additive manufacturing techniques. As a member of the soft electronics research team at AFRL, his focus is to develop the materials and manufacturing methods that facilitate the production of soft, flexible electronics. He holds B.S. from the University of Illinois, Urbana-Champaign, and graduated with a Ph.D. in Materials Science and Engineering from Georgia Tech in 2012.

 


SPEAKER
Dan Berrigan
Air Force Research Laboratory