Flexible, Printed Photovoltaics Workshop



Flexible, Printed Photovoltaics Workshop

Hosted by Hewlett Packard Labs, Palo Alto, California

SAVE THE DATE: November 18, 2008

The FlexTech Alliance (formerly known as USDC) is pleased to announce its Fall Quarterly Technology Flexible Printed Electronics Workshop, scheduled for Tuesday, November 18th, hosted by Hewlett Packard Labs, in Palo Alto, CA.

The brightest spot in the economy today is green energy, and thin film and flexible photovoltaics are the fastest growing subsector of green energy. The Flexible, Printed Photovoltaics Workshop will identify opportunities to develop solutions to bring higher quality flexible and printed photovoltaics to market faster, easier and at lower cost by addressing and identifying key challenges in substrate technology, barriers, materials, and process integration for flexible and printed electronics with a specific emphasis on photovoltaic applications.

Please join leading technologists from photovoltaics producers, materials and tool manufacturers, as well as prominent universities and laboratories for a great networking event, a chance to collaborate with other experts in your field, and the opportunity to make a significant contribution towards moving the emerging flexible printed electronics industry closer to commercialization.

On Monday, November 17th, there will be a late afternoon tour at Applied Materials and a networking dinner afterwards. The Workshop on Tuesday will conclude with a tour of HP Labs.

Attendance at the workshop is limited, so please contact Kay Mascoli (kay.mascoli@flextech.org) as soon as possible to confirm your attendance.


8:00 – 8:30 am

Continental Breakfast


8:30 - 8:45 am

Welcome & Introductions

Michael Ciesinski, FlexTech

8:45 - 9:15 am

Market Analysis/Update

Daniel Cline, Lux Research

9:15 - 9:30 am

FlexTech Programs in Photovoltaics

Mark Hartney, FlexTech

9:30 - 9:50 am



9:50 - 10:10 am

HP’s Advances in Flexible, Printed Electronics

Carl Taussig, HP

10:10 - 10:30 am

Photovoltaic Approaches and Challenges


10:30 – Noon

Breakout Groups:

Group Leaders


Substrate and Barrier Challenges for PV


Materials, Ink, and Printing Challenges for PV


Process Integration Challenges for PV


Noon – 1:00 pm



1:00 – 2:00 pm

Wrap-up Breakout Group Outcomes

Group Leaders

2:00 – 2:45 pm

Reports from Breakout Groups

Group Leaders

2:45 – 3:00 pm

Next Steps & 2009 Meeting Plans

Mark Hartney, FlexTech

3:00– 4:30 pm

Tour of HP Labs

Carl Taussig, HP