Chris Stoessel - Advanced Co-Polymers as Innovative Substrates

Session 16: Encapsulation & Coating

Advanced Co-Polymers as Innovative Substrates and Encapsulants for Flexible Hybrid Electronics
Wednesday, June 21, 2017 
4:40 PM - 5:00 PM

The emerging field of Flexible Hybrid Electronics (FHE) aims at combining printed electronics with higher-functionality semiconductor components in flexible, stretchable, and conformable application formats for a wide range of applications. Conventional substrate materials for FHE are largely carried over from legacy flex electronics such as RFID or flexible circuit boards, but limit FHE’s desired functionality particularly for stretchability, flexibility and conformality. Commercially mature copolymers that are used for non-FHE applications may offer such added functionality when they are considered as substrates or encapsulants for FHE. We will discuss a case scenario where an advanced co-polymer used for shrink packaging of consumer goods was the basis of an innovative solution to lightweight structural components, and will examine the necessary polymer know-how that enabled design tools such as Finite Element Modeling (FEM), structural analysis and prototyping to engineer creative new applications. The example suggests that mature advanced co-polymers exist at attractive Technology Readiness Levels (TRL) and Manufacturing Readiness Levels (MRL) that may enable desirable new functionalities for FHE, and we will propose approaches to customize, characterize, and functionally enhance such new copolymers for successful FHE integration.


Speaker's Biography

Dr. Chris Stoessel leads product and process development projects at Eastman Chemical Co's Corporate Innovation group. His primary technology focus is on thin film deposition processes on polymer substrates for a broad range of applications such as telecommunications, optics, photovoltaics, energy conservation, displays, and flexible electronics. He holds a doctorate in Mechanical Engineering / Materials Science from the University of Technology, Aachen (Germany), and conducted post-doctoral research at the University of California, Los Angeles.


Chris Stoessel
Eastman Chemical Co.