SEMI® China Semiconductor Packaging Market Outlook
A comprehensive study that examines the semiconductor packaging market in China
Publication Date: February 24, 2016
Principal Analyst: ShanShan Du, senior analyst, Industry Research & Consulting, SEMI China
Number of pages: 28
Format: Microsoft® Excel® file (.xls) and Adobe® .pdf
The China Semiconductor Packaging Market Outlook examines market forces impacting the packaging market in China, including the impact of domestic policy on the industry. The report details and provides an outlook for the packaging industry in China, as well as packaging and assembly materials and equipment suppliers. The report also features a database of over 145 packaging faciltiies located in China with recent activities including latest advanced packaging developments, websites, location and type of products processed.
Request a Sample (Report Introduction, Table of Contents, and Summary)
This comprehensive market research study covers but is not limited to:
- Impact of global economy and China industry environment on China package market
- China government’s policy on semiconductor industry and on Packaging and Test industry
- Packaging and testing market size and industry trends in China
- China key semiconductor packaging and assembly company list and recent activities
- Advanced package development in China
- China Semiconductor Packaging Materials
- Key packaging material suppliers in China
- Leadframe market in China
- Substrate market in China
- Mold Compound in China
- Bonding wire market in China
- China Semiconductor Packaging Equipment
- Semiconductor packaging equipment market overview
- China manufactured packaging equipment suppliers
Purchase SEMI China Semiconductor Packaging Market Outlook
|Product ID#||Product Description||Member*||Non-Member|
|3679||SEMI China Semiconductor Packaging Market Outlook, 2016/2017 - Single-User License||$1,500||$2,300|
SEMI China Semiconductor Packaging Market Outlook, 2016/2017 - Multi-User License
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In-person interviews with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth.