SEMI® China Semiconductor Packaging Market Outlook, 2016 edition

SEMI® China Semiconductor Packaging Market Outlook

A comprehensive study that examines the semiconductor packaging market in China

Publication Date: February 24, 2016
Principal Analyst: ShanShan Du, senior analyst, Industry Research & Consulting, SEMI China
Number of pages: 28
Format: Microsoft® Excel® file (.xls) and Adobe® .pdf

Overview

The China Semiconductor Packaging Market Outlook examines market forces impacting the packaging market in China, including the impact of domestic policy on the industry. The report details and provides an outlook for the packaging industry in China, as well as packaging and assembly materials and equipment suppliers. The report also features a database of over 145 packaging faciltiies located in China with recent activities including latest advanced packaging developments, websites, location and type of products processed.

     Request a Sample (Report Introduction, Table of Contents, and Summary)

    Product Information

    This comprehensive market research study covers but is not limited to:

    • Impact of global economy and China industry environment on China package market
    • China government’s policy on semiconductor industry and on Packaging and Test industry
    • Packaging and testing market size and industry trends in China
    • China key semiconductor packaging and assembly company list and recent activities
    • Advanced package development in China
    • China Semiconductor Packaging Materials
    • Key packaging material suppliers in China
    • Leadframe market in China
    • Substrate market in China
    • Mold Compound in China
    • Bonding wire market in China
    • China Semiconductor Packaging Equipment
    • Semiconductor packaging equipment market overview
    • China manufactured packaging equipment suppliers

     

    Purchase SEMI China Semiconductor Packaging Market Outlook

    Product ID#Product DescriptionMember*Non-Member 
    3679SEMI China Semiconductor Packaging Market Outlook, 2016/2017 - Single-User License$1,500$2,300
    3680

    SEMI China Semiconductor Packaging Market Outlook, 2016/2017 - Multi-User License

    $3,000$4,600

    *Pricing does not apply to Individual Members.
    For product related inquiries or questions regarding Enterprise pricing, please email mktstats@semi.org or call 1.800.746.7788.

    Methodology

    In-person interviews with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth.

    Other Resources

    Material Market Data Subscription (MMDS) 
    World Fab Forecast
    World Fab Watch