Authors

Submit your paper to TestVision

TestVision 2020 Logo
Test Vision 2020 is today's premier workshop for semiconductor and system test experts to look into the future of test and discuss coming trends and requirements.  It's a highly anticipated gathering of providers and users of test IP and equipment - all converging to hear and engage with leaders in the field.  The conference typically has 100+ participants and is held in conjunction with Semicon West, assuring access to a wide range of expertise and experience.  

To present at the workshop, authors are invited to submit presentation proposals. The proposals may be draft presentations, extended abstracts (500 words), or full papers. Each submission should include: title, full name and affiliation of all authors, a short abstract of 50 words, and keywords. Identify a contact author and include a complete mailing address, phone, and e-mail. In addition to traditional 20 minute presentations we are also looking this year for some presentations for the poster session held during the reception.  Submit a copy of your presentation proposal by Postscript, or PDF, via E-mail.    

Paper submissions are due no later than April 4, 2016. Submit your proposals to Program Chair Stacy Ajouri, at sajouri@ti.com. Authors will be notified of the disposition of their presentation by May 2, 2016 and must submit the final presentation by June 23, 2016 for inclusion in the Workshop Notes, which will be provided to the attendees on a memory stick. Optionally, an extended abstract/paper can be included in the notes.

Poster submissions of abstract must be received no later than April 18, 2016.  Authors will be notified of the disposition of their poster by May 9, 2016.

Poster Session
The poster material must fit 1m x 1m area. The presenting author should be underlined in the poster text. Please set up your poster on July 13, 2015 between 4-5 pm and be ready to present the content during the reception.

Download 2016 Test Vision 2020 Call for Papers PDF

2016 Hot Topics

  • Application Level Testing
  • R & D Tools
  • RF and SOC testing trends
  • Critical “future-proof” ATE capabilities
  • MEMs Device Testing
  • Autonomous Automotive Testing
  • High Site Count test challenges & opportunities
  • Test methods for future defects
  • New ideas in manufacturing flow optimization
  • 2.5/3D device testing ideas and techniques
  • Power testing needs for ‘green’ technology·
  • Adaptive & concurrent testing challenges
  • Automated test program generation
  • Impact of IC power management on test
  • High-speed IO Test
  • Low cost application focused testers
  • Standards
  • Calibration and Repair Techniques
  • Software for ATE
  • Impact of new fab processes on test/manufacturing
  • Wafer probing technologies
  • Security Impacts on Test (cyber security/test, etc.)