ASMC 2018

 

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2018 SEMI Advanced Semiconductor Manufacturing Conference (ASMC) 

April 30 - May 3, 2018
Saratoga Hilton 
Saratoga Springs, New York
 


 

 

Congratulations to 2017 Best Paper Award Winners

2017 Best Paper Award  Sponsored by Entegris

Chasing Ghosts:  How an SRAM Detected the Subtle Impact of Stray Light 
Stephen Lucarini, Bachir Dirahoui, Richard Hafer, Weihao Weng, Laura Safran, Sweta Pendyala, Karl Barth, Timothy Brunner, Zhigang Song, Brett Engel, David Clark, Keliang He, Cathy Gow, Anne Friedman, GLOBALFOUNDRIES

 

2017 Best Student Paper Award   Sponsored by GLOBALFOUNDRIES

Enhanced Voltage Silicon NFET-MESFET Cascode Amplifiers Integrated on a 45nm SOI CMOS Technology for RFIC Applications
Payam H. Mehr, W. Lepkowski, S. Moallemi, J. Kitchen and T. J. Thornton, Arizona State University

The ASMC 2018 Call for Papers is now closed. Please refer to the Author Kit for 'Late Breaking' news.

ASMC is the leading international technical conference for exploring solutions to improve the collective micro-electronics manufacturing expertise. The conference, with technical sponsorship from IEEE EDS and CPMT provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies.  ASMC 2018 will address the following topics:

  • AM: Advanced Metrology
  • AEPM: Advanced Equipment Processes and Materials
  • AP/DFM: Advanced Patterning / Design for Manufacturability
  • APC: Advanced Process Control
  • CFM: Contamination Free Manufacturing
  • DM: Big Data Management and Mining
  • DI: Defect Inspection and Reduction
  • DP: Discrete and Power Devices
  • ET/ ID: Enabling Technologies and Innovative Devices
  • ER: Equipment Reliability and Productivity Enhancements
  • FA: Factory Automation
  • FE: The Fabless Experience
  • GF: Green Factory
  • IE: Industrial Engineering
  • LM: Lean Manufacturing
  • MJ:  MOL and Junction Interfaces
  • SM: Smart Manufacturing
  • YE: Yield Enhancement/Learning
  • YM: Yield Methodologies
  • 3D/TSV: Packaging and Through Silicon Via

 

 

 

 

 

 

 

 

The ASMC 2018 agenda is developed by a technical committee representing a large cross section of the device, equipment/materials industry, and academia. Technical presentations are a result of an industry-wide call for papers, and accepted abstracts reflect manufacturing issues which are significant and current. Select ASMC manuscripts are republished in a Special Section of the IEEE Transactions on Semiconductor Manufacturing.   ASMC 2018 will include the Women in Semiconductors (WiS). Thank you to all who participated in ASMC 2017.  

Special thanks to our speakers/presenters and committee members for making this year's conference sold out success.  If you were unable to join us in May 2017, here's what you missed....

Keynotes and Tutorial

   

 

 Roberto Rapp
Director, Manufacturing Process Integration
"Future Trends of Smart Car & Associated Electronics "

  

William Miller
Vice President, Engineering
"Technology and Data in the Fabless World"

 

Robert Maire
President
"A New Paradigm in the Tech Sector:
Bids, Booms or Bust?"

 

Tutorial: Overview of Piezoelectric MEMS
Prof. Gianluca Piazza
ECE Department; Director of Nanofabrication Facility 

      
 

 Thank you to our ASMC 2017 Sponsors

   

 

 

Sponsorship Opportunities
Reach out to decision makers involved in all aspects of semiconductor manufacturing, and the microelectronics supply chain by sponsoring ASMC. To find out about the available promotional opportunities contact: Shane Poblete, spoblete@semi.org / Tel: +1.202.847.5983

 Mail list
Make sure you receive the latest information about ASMC.  Add your name to the ASMC distribution list.
 

Conference Questions
Margaret Kindling
mkindling@semi.org
Tel: +1.202.393.5552