The SEMI Advanced Semiconductor Manufacturing Conference continues to fill a critical need in our industry. The conference provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. The conference is co-chaired by Stefan Radloff, Intel Corporation; and Russell Dover, Brion Technologies (an ASML Company).
Who Attends ASMC?
ASMC 2013 schedule includes keynotes, tutorials, a panel, 15 technical sessions, including the popular interactive poster session/reception. On-site registration opens May 13 at 6:30pm. After picking up your conference materials, join your fellow attendees at the ASMC 2013 Welcome Reception for an excellent networking opportunity prior to the conference.
|Keynote: Assessing the Threats to Semiconductor Growth: Technology Limitations versus Economic Realities
Subramani Kengeri, Vice President, Advanced Technology Architecture, Office of the CTO GLOBALFOUNDRIES
|Keynote: Fab Materials Next Generation Challenges: Affordability & Quality
Tim Hendry, Vice President, Technology and Manufacturing Group, Director of Fab Materials Operation
|Keynote: IC Market Trends and Forecast
Bill McClean, President
|Keynote Tutorial: Computational Lithography
Dr. Vivek Singh, Intel Fellow, Technology and Manufacturing Group Director, Intel Corporation
|Tutorial: 3D IC
Sarasvathi Thangaraju, Package Technology and Integration, GLOBALFOUNDRIES
450 mm Wafers - Super Size me!
Paul A. Farrar, Jr., General Manager, G450C
Kirk Hasserjian, Applied Materials
Dr. Brian Trafas, KLA-Tencor
Mark Fissel, Lam Research
Dr. John Lin, TSMC
|Best Paper Awards
SEMI thanks the ASMC committee members, who volunteer countless hours in support of our annual conference.
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Authors presenting a technical paper at ASMC 2013, please visit the author instructions for due dates, templates and additional information.