24th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2013)

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ASMC 2013
AGENDA REGISTER TRAVEL SPONSORSHIP CONTACT US

The SEMI Advanced Semiconductor Manufacturing Conference continues to fill a critical need in our industry.  The conference provides a venue for industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. The conference is co-chaired by Stefan Radloff, Intel Corporation; and Russell Dover, Brion Technologies (an ASML Company).

Who Attends ASMC?

  • IC Manufacturers
  • Equipment Manufacturers
  • Materials Suppliers
  • Chief Technology Officers
  • Operations Managers
  • Process Engineers
  • Product Managers
  • Academia

Schedule

ASMC 2013 schedule includes keynotes, tutorials, a panel, 15 technical sessions, including the popular interactive poster session/reception.  On-site registration opens May 13 at 6:30pm.  After picking up your conference materials, join your fellow attendees at the ASMC 2013 Welcome Reception for an excellent networking opportunity prior to the conference. 

Sponsors

AMAT Logo

ASML logo
ATMI
ChemTrace Logo
CNW
 DAS logo

Edwards logo

 FEI logo

GlobalFoundries


KLA Tencor logo

Marcy Nanocenter


MSP

NY Loves Nanotech


Synopsys Logo

Valqua America

Sponsorship opportunities for this event are available.  Please contact Marlene Sibley at msibley@semi.org or 1.408.943.6988

Subramani Kengeri Keynote: Assessing the Threats to Semiconductor Growth: Technology Limitations versus Economic Realities 
Subramani Kengeri
, Vice President, Advanced Technology Architecture, Office of the CTO GLOBALFOUNDRIES
Tim Hendry Keynote: Fab Materials Next Generation Challenges: Affordability & Quality
Tim Hendry, Vice President,
Technology and Manufacturing Group,  Director of Fab Materials Operation
Intel Corporation
Bill McClean Keynote: IC Market Trends and Forecast
Bill McClean
, President
IC Insights
  Keynote Tutorial: Computational Lithography 
Dr. Vivek Singh
, Intel Fellow, Technology and Manufacturing Group Director, Intel Corporation
 
  Tutorial: 3D IC 
Sarasvathi Thangaraju
, Package Technology and Integration, GLOBALFOUNDRIES
450 mm Wafers Panel:
450 mm Wafers - Super Size me!

Moderator:
Paul A. Farrar, Jr., General Manager, G450C
Panelists:
Kirk Hasserjian, Applied Materials
Dr. Brian Trafas, KLA-Tencor
Mark Fissel, Lam Research
Dr. John Lin, TSMC
 
Best Paper Awards
  • ASMC 2012 Entegris Best Paper is awarded to"Identifying Systematic Critical Features Using Silicon Diagnosis Data" by Chris Schuermyer, Mentor Graphics; Shobhit Malik, Thomas Herrmann, GLOBALFOUNDRIES
  • ASMC 2012 GLOBALFOUNDRIES Best Student Paper is awarded to “A Predictive Maintenance System based on Regularization Methods for Ion-Implantation” by Gian Antonio Susto, Alessandro Beghi, University of Padova; Andrea Schirru, Simone Pampuri, University of Pavia
Justify Your Attendance
Use the testimonial above and our justification letter template to show why your participation ASMC 2013 will benefit you and your organization.
ASMC Committee

SEMI thanks the ASMC committee members, who volunteer countless hours in support of our annual conference.

Mail list
Make sure you receive the latest information about ASMC 2013.  Add your name to the ASMC distribution list.


Author Instructions

Authors presenting a technical paper at ASMC 2013, please visit the author instructions for due dates, templates and additional information.

Technical Sponsors

IEEE

CMPT

EDS