The 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2018)
Tuesday, May 1, 2018
Session 4 - Advanced Metrology I (sponsored by Nova Measuring Instruments)
Chairs: Delphine LeCunff, STMicroelectronics; Franz Heider, Infineon; Ido Holcman, Applied Materials; Matt Sendelbach, Nova Measuring Instruments
This session is focused on advanced metrology methods that are not traditional "workhorse" metrology techniques, but are growing in importance for the semiconductor industry. The
topics relate to X-ray metrology, both XPS and XRD, as well as optical and ultrasonic techniques. Applications include FEOL and MOL semiconductor devices as well as RF MEMS.
4.1 Picosecond Ultrasonics: Characterization of Single Crystal Piezoelectric Materials for Advanced RF Filters
S. Gibb, Akoustis Technologies, Inc.; R. Mair, J. Dai, P. Mukundhan, Rudolph Technologies
4.2 In-line XPS to quantify the changes in interfacial layers of Advanced node gate stacks
M. Medikonda, B. Kannan, B. Cohen, V. Chabra, G. Dilliway, K. Onishi, A.F. Bello, GLOBALFOUNDRIES, Inc., Mark Klare, Nova Measuring Instruments
4.3 A Novel High-Resolution XRD Apparatus for Patterned Epitaxial Films in a 50μm Pad Area with a Convergent Micro X-ray Beam
Y. Ito, H. Motono, K. Omote, K. Ogata, S. Yoshihara, and N. Matsushima, Rigaku Corporation
4.4 Full Field and Full Tensor Stress Metrology for Flexible Electronics, Packaging, and Opto-electronic Applications
Wojtek Walecki, Wei-Chun Hung, Frontier Semiconductor
4.5 Detection of Thermal Donors from Electrically Active Interstitial Oxygen by Optical Second Harmonic Generation
Ming Lei, John Changala, Brian Larzelere, Justin Lee, Jacqueline ZouAlon Raphael, Femtometrix Inc.
3:35 Networking Break (Sponsored by Edwards)
4:00 Tutorial: 'Big Data Analytics and the Smart Factory in Microelectronics Manufacturing'
Professor James Moyne, Associate Research Scientist, Mechanical Engineering, University of Michigan; Applied Materials - Global
5:15-6:45 Session 5 - Poster Session (Co-sponsored KLA-Tencor)