How Do You Spell Smart? Industry 4.0 and the Future of Commercial Semiconductor Device Manufacturing
Just how “smart” are the smartest factories in semiconductor manufacturing today? How much smarter do our wafer fabs need to become? How much smarter will they become? How much will that cost? How long will it take? And how much will we benefit? And if we were to look over our shoulders at other manufacturing industries, what answer would we find to the question (in the words of author Michael Lewis, from his book “The Big Short”), “Why isn’t someone smarter than us doing this already?”
By way of background, from the Applied Materials Blog:
The concept of Industrie 4.0 was first coined by the German government to describe the fourth industrial revolution enabled by new technologies like artificial intelligence (AI), big data, cloud computing and the Industrial Internet of Things (IIoT). [Industrial Revolution 1.0 was powered by the use of steam and water power; IR 2.0 by the use of electricity; and IR 3.0 by computerization.] Implementing Industry 4.0 concepts is often referred to as “smart manufacturing” and gives us what is often called a “smart factory.” Key characteristics of Industry 4.0 are:
• Vertical integration of manufacturing systems -In factories, the production systems with networking connectivity are called Cyber Physical Production Systems (CPPS). With Industry 4.0, the CPPS are integrated and interfaced vertically so that any changes in the environment and in the value chain are reflected in the manufacturing process.
• Horizontal integration across the enterprise and value chain -Integrating manufacturing units horizontally into the value chain along with partners, suppliers, sub-cons, etc.
• Enabling and accelerating the integrations through next-generation technologies like cloud, big data, mobility and AI/analytics.
Topics of discussion will include: leveraging big data infrastructures; integrating the supply chain network; leveraging advanced analytics; improving use of cyber-physical systems (CPS); and improving the use of real-time simulation through realizing the “digital twin”.
Please join us in Saratoga Springs, NY on 2 May 2018 for the SEMI ASMC 2018 Panel Discussion, where five diverse panelists representing capital equipment, IDMs, academia, the semiconductor supply chain, and “someone smarter,” will engage and discuss with ASMC attendees about where “smart” is in our industry, where it’s headed, and what that’s going to mean for us, the professionals who got semiconductor manufacturing to the state of smart we currently enjoy today, and who are looking to implement an ever-smarter future tomorrow. Panel discussion moderator, Paul Werbaneth, Global Product Marketing Director, Intevac, Inc., will lead panelists through the discussion. Panelists include:
- Nancy Greco, Distinguished Engineer and Director, Research IoT, IBM Watson Research
- Carson Henry, Fab Director, Micron Technology
- Julie Jacob, Executive Director, Ernst & Young
- Prof. James Moyne, Associate Research Scientist, Mechanical Engineering, University of Michigan; Applied Materials
- Dave Mayewski, Regional Industry Director, Rockwell Automation