SAN JOSE, Calif. — June 14, 2016 — Today, SEMI announced that the latest packaging solutions will be the topic of an in-depth session at the SEMICON West 2016 Advanced Packaging Forum ─ and on display on the exhibition floor. Rapidly changing technologies and accelerated product life cycles are driving the need for new assembly and packaging solutions suited for next-generation products such as Internet of Things (IoT) devices and wearables. To meet these packaging needs, semiconductor technologies with smaller form factors, lower power consumption, and flexible designs are increasingly in demand.
Six complimentary packaging sessions are offered at the Advanced Packaging Forum at SEMICON West’s TechXPOT North stage. Pre-registration is required. Sessions explore what’s ahead in the world of packaging and assembly. The three-day forum will explore the challenges posed by new and emerging devices and offer solutions capable of enabling them. Technical sessions include:
- SiP Next 1: Processor ─ Memory/Analog Integration
- SiP Next 2: IoT & Smart Things ─ SiP Integration
- Sensing the Future: Enabling Applications for a Smarter World
- Packaging Developments for Flexible, Hybrid Electronics
- Packaging Power: Enabling a Variety of Applications and Efficiency
- Packaging Photonics for Speed & Bandwidth
Sessions feature speakers from Analog Devices, ASE Group, Cisco, General Electric, Mentor Graphics, NVIDIA, Texas Instruments, TSMC, Xilinx, and more. Attendees will learn about the latest in electronic packaging, thermal management, additive manufacturing, simulation, and reliability assessment; system optimization and differentiation through heterogeneous integration and SiP; sensor technologies for monitoring and analyzing complex data streams; and other advanced developments.
This year’s SEMICON West exposition also features packaging solutions on the show floor. Attendees can view more than sixty new products from some 200 exhibitors.
The industry is seeing dramatic changes and SEMICON West 2016 has expanded its technical programming by nearly 50 percent to help attendees get a clear view of the road ahead. To learn more about SEMICON West 2016’s eight new forums (Extended Supply Chain, Advanced Manufacturing, Advanced Packaging, Test, Silicon Innovation, Flexible Hybrid Electronics, and World of IoT), visit www.semiconwest.org.
SEMI® connects more than 2,000 member companies and more than a quarter-million professionals worldwide to advance the science and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, and services that enable smarter, faster, more powerful, and more affordable electronic products. Since 1970, SEMI has built connections that have helped its members grow, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information about SEMI, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Phone: +1 408.943.7988
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