Global Semiconductor Packaging Materials Outlook 2009/2010 Edition

[Single-user version]

Publication Date: November 2009
Authors: SEMI and TechSearch International
Format: .pdf, .xls, .ppt

Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Packaging materials markets are quantified, new opportunities are highlighted, and forecasts through 2013 are presented.

Global Semiconductor Packaging Materials Outlook is an essential business tool for anyone interested in the plastic packaging materials arena. Packaging materials directly affect the performance, reliability and cost of semiconductors, and offer significant improvement potential.

Sample Report Download

Material segments covered include:

• Organic substrates
• Leadframes
• Mold compounds
• Bonding wire
• Underfill materials
• Die attach adhesives
• Liquid encapsulants
• Solder balls
• Wafer level package (WLP) dielectrics
• Thermal interface materials

Features:

• Technology trends
• Regional market size
• Five-year market forecast
• Supplier market share
• Market size in revenue and units
• Capacity and utilization trends
• Average selling prices and trends

This study has a user-friendly electronic format and includes:

• Concise executive summary
• Adobe Acrobat chapters for each materials segment
• Excel workbook file summarizing market information
• PowerPoint charts, ideal for presentations

Methodology
In-person interviews with material suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth.

About SEMI
SEMI is a global industry association serving companies that develop and provide manufacturing technology, materials and services used to make semiconductors, flat panel displays (FPDs) microelectromechanical systems (MEMS) and related microelectronics. SEMI maintains offices and hosts programs and activities in every major microelectronics and display manufacturing region around the world. SEMI maintains offices in Austin, Bangalore, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C.

For more information, please contact Dan P. Tracy, Ph.D, director of Industry Research and Statistics, SEMI at dtracy@semi.org or at 1.408.943.7987.

About TechSearch International, Inc.
Founded in 1987, TechSearch International (Austin, Texas) is a technology licensing and consulting company specializing in accurate, relevant, and timely information on advanced packaging technology and market developments.

For more information, please contact Ms. E, Jan Vardaman, president and founder, TechSearch International, Inc. at jan@techsearchinc.com or at 1.512.372.8887.

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