China Semiconductor Packaging Market Outlook 2012/2013
China Semiconductor Packaging Market Outlook - Single-User
Publication Date: January 2013
Principal Analyst: Yuri Cai, SEMI Shanghai
Format: .pdf and .xls
China is a key region for the semiconductor packaging and assembly market with a number of dynamic trends in play, including on-going expansion of manufacturing by overseas companies; emergence of domestic companies providing equipment and materials; and top Chinese companies expanding capabilities for wafer bumping, wafer-level packaging, and through-silicon via (TSV) technologies. In addition, packaging capability is an increasingly key index of discrete and power device manufacturers in China so to minimize device sizes to improve the integration with other IC chips of a system.
The expansion of semiconductor packaging and assembly in China has resulted in this market being the fastest growing in terms of packaging materials market and one of the largest markets for equipment spending. Central government support and local government promotion are significant drivers for the packaging and assembly investments, and for packaging and testing enterprises, continuous communication with related associations and government departments is very necessary to develop more attention and supporting policies.
This report provides an outlook of the semiconductor packaging industry in China as well as a summary of the packaging materials and equipment for this important market. The report also highlights the material and equipment supply chain in China, including which domestic companies supplying materials and equipment are emerging in the market place. Domestic semiconductor equipment suppliers who previously focused on front end tool development and promotion also find application of their products in wafer level and TSV packaging. The report covers market data and a supplier list, including total 87 material plants and 20 equipment companies in China.
Excel file: Contains list of semiconductor manufacturers in China and data for all the figures and tables in the report.
In-depth personal, telephone, and email interview were conducted with over 60 semiconductor manufacturers, packaging subcontractors, assembly equipment manufacturers, and material vendors, as well as with government officials and professionals from industry associations in China. While the majority of the information contained in this report was derived from interviews, a thorough literature search was also conducted. All of this information was analyzed and the findings are summarized in this report.
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