MEMS Webinar Series: Energy Harvesting Technologies
Power consumption, as forecasted by the International Technology Roadmap of Semiconductors (ITRS), presents long-term technical challenges for the semiconductor industry. Energy harvesting is a technique by which energy is absorbed from external sources (e.g., solar power, thermal energy, and kinetic energy), captured and stored.
Current technologies like photovoltaic cell and wind energy harvesting have several technical barriers that need to be resolved, including low efficiency, large size, and high cost. MEMS energy harvesting approach can be used to power sensor networks and mobile devices without batteries. By employing MEMS energy harvesting technology, several advantages can be achieved over traditional batteries or power supplies, which include small size (micro-meter scale), low cost, high reliability, and the capability of integrating with portable devices and wireless sensors.
The SEMI MEMS Webinar Series on Energy Harvesting Technologies aims to:
1. Review the fundamentals of MEMS energy harvesting, along with recent advancements
2. Provide an overview of strategies for generating power using MEMS technologies
3. Discuss future trends and applications for MEMS energy harvesting technology.
I. Fundamentals and Advancements of MEMS Energy Harvesting
II. Strategies for Generating Power Using MEMS Technologies
III. Future Trends and Applications for MEMS Energy Harvesting Technology
Register now for the Fundamentals and Advancements of MEMS Energy Harvesting webinar.
Dr. Ravi Doraiswami is a research scientist at CALCE, University of Maryland at College Park, Maryland. He earned his Ph.D in Mechanical Engineering with Mechatronics specialization at the Indian Institute of Technology in New Delhi, India. Prior to his Ph.D., he got his degree in M.Tech. (Lasers and Electroptical Engineering) and M.Sc. (Materials Science) at the College of Engineering in Chennai, India. He has over 10 years of experience in the areas related to applied SOC, SIP and SOP systems, design, materials process, fabrication, test and evaluation and reliability as an assembly technologies lead engineer at the Packaging Research Center, Georgia Institute of Technology in Atlanta, Georgia. Novel technologies that he developed (like fabrication of 5 to 10 microns pitch nano nickel-tin flip chip interconnect, shape memory organic capacitors and nano electrode systems inside microtube) have found applications in biosensors, MEMS, microelectronics fabrication and packaging technologies. He has executed several industry projects using his experience in flip chip/SMTA assembly/embedded high density wired substrates, passives, lead free and MEMS technologies. His strong understanding of MIL, JEDEC and ISO standards has produced very reliable consultancy and outstanding publications for evaluating Opto, digital and RF system packages using VNA parametric analysis, thermal, humidity and environmental reliability test and failure analysis. He has over eight yrs of management experience and is published in over 45 research publications in international conferences and reputed technical journals. He has recently co-authored a book on “NanoBIO Fluidic MEMS Sensors.”
April 6, 2010