MEMS Standards Committee Information
About the SEMI MEMS / NEMS Technical Committee
The charter of the MEMS / NEMS Technical Committee is to develop standards for MEMS & NEMS devices that cannot be handled by existing technical committees. Current topics include Wafer Bonding Alignment Targets; Step-Height Measurements of Thin, Reflecting Films using an Optical Interferometer; and Ultra High Purity Microscale Fluidic Systems for Use in Scalable Process Environments.
|.||SEMI MS1-0307||Guide to Specifying Wafer-Wafer Bonding Alignment Targets|
|.||SEMI MS2-1109||Test Method for Step Height Measurements of Thin Films|
|.||SEMI MS3-0307||Terminology for MEMS Technology|
|.||SEMI MS4-1109||Standard Test Method for Young's Modulus Measurements of Thin, Reflecting Films Based on the Frequency of Beams in Resonance|
|.||SEMI MS5-1211||Test Method for Wafer Bond Strength Measurements Using Micro-Chevron Test Structures|
|.||SEMI MS6-0308||Guide for Design and Materials for Interfacing Microfluidic Systems|
|.||SEMI MS7-0708||Specification for Microfluidic Interfaces to Electronic Device Packages|
|.||SEMI MS8-0309||Guide to Evaluating Hermeticity of MEMS Packages|
|.||SEMI MS9-0611||Specification for High Density Permanent Connections Between Microfluidic Devices|
The MEMS / NEMS Committee is organizing a MEMS and NEMS road mapping activity. The committee is placing a formal call for participation to engage industry experts to join the committee and review future standardization activities. Please contact Paul Trio at email@example.com for more details.
Click here to find out more about SEMI’s relationship with MEMS and the Global MEMS / NEMS Standards Technical Committee.
How to Participate
SEMI Standards Program Membership is required to participate. Registration is free and quick. Join Now!
Task Force Name: MEMS Packaging
Determine properties of MEMS Packaging for which standardization will improve manufacturability, reliability and design quality. Determine appropriate metrics for dimensions, physical, chemical, electrical and interface properties, and other packaging properties of MEMS devices as required.
Task Force Name: MEMS Microfluidics
Develop guidelines for generic fluidic I/O design and fabrication that can reduce redundant engineering effort and lead to increased manufacturability, testing and operation. This should include standards for performance, practices, and assembly of microscale fluidic components.
Task Force Name: MEMS Material Characterization
Develop Test Methods and related documents for characterizing properties of materials used in MEMS devices.
Task Force Name: Terminology
Assemble the various terms, abbreviations, acronyms, and symbols used in MEMS Technology into a comprehensive terminology standard.
Task Force Name: Wafer Bond
Investigate and develop standards for application of wafer-bonding for MEMS. Define dimensions, tolerances, locations and other attributes of on-wafer bonding targets employed in direct-wafer and other wafer bonding applications in MEMS manufacturing. Create related bond test methods.
- Microfluidics—Why Your Next IC Packaging Project May Require More Than Your Known Electronics/Materials Methods and Practices
- Hermeticity Evaluation of MEMS
- An Airtight Case for Evaluating Hermeticity, Quarter Report to Members, Page 3
- MEMS Provides New Growth Opportunities, SEMI News and Views, Page 1
Contact SEMI Standards at firstname.lastname@example.org to learn more about SEMI & MEMS.
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