3D IC Opens the New Era of IC Packaging and Testing

With the growing popularity of smart phones, e-book readers and other mobile devices, manufacturers have placed a stronger focus on heterogeneous integration through SiP to enhance user experience.  IEK recently forecasted production value of 3D ICs for mobile phone applications will hit US$3.65 billion by 2015.  Topology Research Institute, meanwhile, has pointed out 3D ICs will be the mainstream in the post-PC era!

SiP Global Summit—

Brought to you by SEMI Taiwan Packaging & Testing Committee

Given the growing importance of packaging and testing in the global semiconductor supply chain, SEMI will hold the first-ever SiP Global Summit from Sept. 7 to 9 under the auspices of SEMI’s Taiwan Packaging and Testing Committee as well as major international enterprises and research organizations.

This 3-day SiP Global Summit 2011 will consist of 3 major forums: 3D IC Technology, 3D IC Test and Embedded Substrate with representatives from 25 of the world’s top-notch IT firms slated to share insights into the 3D IC, TSV, silicon interposer and embedded substrate technologies.  Participants in the summit will include ASE, Elpida, Formfactor, KYEC, Nokia, Qualcomm, Powertech Technology, Sony, SPIL, TSMC, Verigy; and R&D and market research organizations including Gartner, Fraunhofer IZM, IMEC, Industrial Technology Research Institute (ITRI) and TechSearch International.

Polish your industry knowledge through the systematic session arrangement and the most inspiring speeches from the CTOs from above global leading companies! Free registration is now open. Save your seats today!

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