Six Volume Memory Fabs to Begin Operation in 2008 says SEMI Fab Database Report

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Six Volume Memory Fabs to Begin Operation in 2008 says SEMI Fab Database Report

Share of Memory Capacity will increase from 38% in 2007 to 41% in 2008

SAN JOSE, Calif. – November 14, 2007 – In a recent analysis of its Fab Database reports, the outlook on new fab starts appears weaker, as many companies have cut back on spending to wait for the market to improve. After a forecasted eight percent year-over-year (YoY) increase in fab construction spending in 2007, levels are expected to be flat in 2008.

Although many companies announced lower capital expenditure plans, 300mm memory fabs will continue to fuel the market next year. In Taiwan Rexchip will start with Fab R2, a 70,000 wpm wafers per month (wpm) fab and the second of four planned 300mm Megafabs. Winbond is expected to begin with their Fab 6 (module 2), a 54,000 wpm fab. In South Korea, Hynix will begin with Fab M11 and Samsung, which actually increased capex, may begin operation on Line 16, a 100,000 wpm fab. IM Flash will start with its 300mm in Singapore and Numonyx may begin equipping with Fab M6 in Catania.

A closer look at fab capacity trends shows a nearly 20 percent increase this year, and another 11 percent increase in 2008. The memory share of worldwide wafer capacity is expected to increase from 38 percent this year to 41 percent in 2008. Regionally, Japan is the leader in installed fab capacity with over 3.5 million wpm and over 3.8 million wpm, in 2007 and 2008 respectively, (in 200 mm equivalents). Taiwan and South Korea follow, with capacities of 2.5 million wpm and 2.6 million, respectively, in 2007 and 2.8 million to 2.7 million in 2008. The US is the region with the fourth largest installed capacity base with 2.4 million wpm in 2007 and 2.7 million wpm forecasted for 2008.

For more information about SEMI’s fab database products, please visit for additional information on these reports.

‘Fab Capacity Report’:

Provides a comprehensive listing of over 1,000 fabs worldwide and features details by company and by fab in over 12 categories (including capacity ramps, geometries, wafer sizes, product types and regions) and covers three years – the past six quarters and the next six quarters. This report is in an easy to use Excel format and lists by quarter and by fab capital expenditure for fabs constructing and equipping, capacities, geometries, product types, and wafer sizes and more. NEW features include: Capital expenditures of fabs equipping and includes fabs with construction projects.

The Next Six Quarters lists fab details of two years: for the past two quarters and the next six quarters for more than 200 fabs in which major expenditures are taking place. The report is in an easy to use Excel format and lists by quarter cost of construction and equipment spending by fab, the capacities, geometries and wafer sizes, key milestone dates and more.

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1971, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit

Scott Smith/SEMI
Ph: 408.943.7957

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