SEMI Publishes Eight New Technical Standards


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SEMI Publishes Eight New Technical Standards

Documents Include Two MEMS Manufacturing Standards

SAN JOSE, Calif. – October 15, 2007 – SEMI has published eight new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org.

SEMI Standards are published three times a year. The new standards, part of the November 2007 publication cycle, join more than 770 standards that have been published by SEMI during the past 34 years.

“These new SEMI Standards include two MEMS related documents, joining three other MEMS standards that have been available since Spring 2007,” said Bettina Weiss, SEMI director of International Standards. “As the MEMS industry grows and technical requirements become clearer, it is important for suppliers and MEMS producers to collaborate in developing these important documents.”

The standards released today include guidelines for precursors used in low-K CVD processes, a guide for equipment training best practices, and a test method to determine the strength of wafer-wafer bonds.

The full list of SEMI Standards released today include:

SEMI C62
Guideline for Porogen Precursors Used in Low K CVD Processes

SEMI C63
Guideline for Organosilicate Precursors Used in Low K CVD Processes

SEMI E54.20
Standard for Sensor/Actuator Network Communications for EtherCAT

SEMI E150
Guide for Equipment Training Best Practices

SEMI F104
Particle Test Method Guidelines for Evaluation of Components Used In Ultrapure Water and Liquid Chemical Distribution Systems

SEMI F105
Guide for Metallic Material Compatibility in Gas Distribution Systems

SEMI MS4
Standard Test Method for Young’s Modulus Measurements

SEMI MS5
Test Method to Determine Strength of Wafer-Wafer Bonds

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). About 1,100 volunteers worldwide participate in the program, which is made up of 17 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.

Association Contacts

Bettina Weiss/SEMI
Tel: 1.408.943.6998
E-mail: bweiss@semi.org

Scott Smith/SEMI
Tel: 1.408.943.7957
E-mail: smith@semi.org

(Editor's Note: Following is more detailed information about the new SEMI standards).

SEMI C62
Guideline for Porogen Precursors Used in Low K CVD Processes

SEMI C62 provides consistent quality guidelines for porogen precursors that will minimize the risk of supplying inconsistent material to the industry. Inconsistent material between various suppliers impacts the end user process which could result in increased costs for material re-qualification and contamination to equipment.

The implementation of these quality guidelines for the semiconductor industry will ensure consistent supply between various precursor suppliers. This is valuable to the industry because it offers end users multiple supply options that provide comparable material quality, minimizing the costs associated with material qualifications.

SEMI C63
Guideline for Organosilicate Precursors Used in Low K CVD Processes

SEMI C63 provides consistent quality guidelines for organosilicate precursors that will minimize the risk of supplying inconsistent material to the industry. As with SEMI C62, inconsistent materials may impact the end user process which can increase the cost of material re-qualification and contamination to equipment.

SEMI E54.20
Standard for Sensor/Actuator Network Communications for EtherCAT

EtherCAT is a high speed, low cost Ethernet based Sensor/Actuator Network suitable for any kind of tool control, material handling, data acquisition or measurement application. EtherCAT breaks performance and topology barriers imposed by legacy field bus systems, while supporting their seamless integration into the system if desired.

Due to its functional principle called “processing on the fly”, it utilizes the Ethernet bandwidth in such a way that it is 50-100 times faster than many fieldbus systems. Up to 65,535 nodes can be connected in each segment using line, ring, star or tree topology, or any combination hereof.

EtherCAT provides the means to combine measurement, motion control, safety and I/O networks into one system, while supporting simplified vertical integration. As well as being a SEMI and IEC standard, EtherCAT is on its way to become the de-facto standard for the semiconductor, FPD and MEMs industries, supported by large OEMs and device vendors in North America, Asia and Europe.

SEMI E150
Guide for Equipment Training Best Practices

SEMI E150 supports all manufacturing processes by recommending best training practices for improving the performance of the industry workforce. It is recognized that effective training practices can improve the equipment purchaser’s ability to install, use, maintain, and repair equipment resulting in higher productivity, increased equipment uptime, reduced costs, and improved safety. The intent of this guideline is to facilitate the gap between awareness of performance-based equipment training and realizing its benefits through practice.

If the process and characteristics of performance-based equipment training described in this standard are implemented, more effective training will result. These guidelines are not unique to the semiconductor industry. Rather, they represent best practices within the performance improvement profession as represented by the American Society of Training and Development (ASTD) and the International Society for Performance Improvement (ISPI).

The value of the E150 guide to the semiconductor manufacturing industry is to increase accessibility to this type of training information, thus enabling better performance throughout the industry.

SEMI F104
Particle Test Method Guidelines for Evaluation of Components Used In Ultrapure Water and Liquid Chemical Distribution Systems

SEMI F104 applies to any manufacturing process requiring liquid chemicals that either remain as liquid for process or are used as precursors.

Chemical purity standards are getting more and more stringent every year. By using this test method and particle specification (to be introduced at a later date), chemical distribution manufacturers will be able to select fluid handling components that contribute the least amount of particles to the chemical stream during use. This combined with higher purity chemicals allows manufacturers to meet higher purity demands.

New fluid handling components installed in systems introduce contaminants into the fluid stream in the early stages of use. Therefore, liquid distribution systems are usually run for a significant amount of time before being used in actual process conditions. By using the best performing components found through particle testing, startup time is reduced, and costs associated with running the system are reduced as well.

In the past, liquid distribution system manufacturers did not test components for particle cleanliness, and if they did, it was on a haphazard basis with no performance criteria for qualification. With this standard, manufacturers can verify component performance at test agencies by referring to this test method. Customers now can generate performance comparisons to ensure that their systems contribute the least amount of contaminants as possible to process chemicals. Also, customers can continually monitor the particle performance of vendors’ liquid components by particle testing on a regular basis.

SEMI F105
Guide for Metallic Material Compatibility in Gas Distribution Systems

SEMI F105 relates to any semiconductor wafer process step that requires equipment with a chemical delivery system, including PVD, CVD, and Etch systems.

Previously, chemical compatibility was only defined for 316 stainless steel. Many other metallic materials are being used in chemical delivery systems but their compatibility with the gases has never been documented. This document will help reduce contamination due to chemical incompatibilities which can lead to wafer defects and yield loss. It will also provide the opportunity for more cost effective materials to be used in certain applications, thus lowering the overall cost of the system. This standard is applicable to any semiconductor device or equipment manufacturer, or component supplier working with chemical delivery systems.

SEMI MS4
Standard Test Method for Young’s Modulus Measurements

The SEMI MS4 applies to the MEMs manufacturing process, specifically material property quality testing. It provides a uniform test method where none or not many were available before. The adoption of MS4 reduces manufacturing cost because it helps improve quality control and increases reliability of MEMS products.

SEMI MS5
Test Method to Determine Strength of Wafer-Wafer Bonds

SEMI MS5 is a variation of MS4, with both standards applying to the MEMs manufacturing process, specifically material property quality testing. MS5 also provides a uniform test method where none or not many were available before. MS5 increases the reliability of MEMS product. In particular, it is applicable and useful to the automotive, navigational, and medical devices.