SEMI Highlights Five Hot Topics at SEMICON Taiwan 2007
DFM, SiP and Photovoltaic Announcements Top List of New Innovations
TAIPEI, Taiwan – September 11, 2007 – SEMICON Taiwan 2007, the largest microelectronics event in Taiwan, offers expo visitors critical insight on key topics that are shaping the local semiconductor and solar industries. SEMICON Taiwan is being held 12-14 September at the Taipei World Trade Center.
“Industry leaders require the most up-to-date information to make informed business decisions,” said Terry Tsao, president of SEMI Taiwan. “SEMICON Taiwan 2007 is the biggest and most comprehensive event of its type in our region, and it brings all of these topics together under one roof, giving visitors the opportunity to capitalize on new trends.”
According to the association, key topics of interest at this year’s SEMICON Taiwan include:
1. Defining the Next Generation Fab: 300 mm Prime and 450 mm – Suppliers and chipmakers are looking to tackle key productivity bottlenecks and improving overall 300 mm fab productivity. Many experts believe that a much-publicized initiative—300 mm Prime—can push out or eliminate the argument for larger wafers by bolstering the use of efficient, high-mix manufacturing operations, while others believe a larger wafer size offers more opportunity to improve.
2. Solar Industry Executive Forum – Since year 2002, the solar industry in Taiwan has been quietly but aggressively expanded. Overall investment has been dramatically increasing and revenue has increased from 0.2 billion NTD in 2003 to 21.2 billion in 2006. Around the world, the Taiwan solar industry has invested aggressively and delivered great results. However, in the solar industry supply chain, Taiwan has faced some significant barriers. This session will provide the overall picture of the direction of the world wide solar industry, with the emphasis on the development of the Taiwan solar market. Furthermore, it will also provide insight on how the Taiwan solar industry will respond to the challenges and issues facing it.
3. SiP and Low Cost Technology – Visitors to the Packaging and Testing Forum at SEMICON Taiwan will hear the latest market outlook for the SiP market, and learn more about the challenges around implementing SiP into the product supply chain. In addition, executives will provide perspective on how test, assembly, equipment and materials suppliers can come to a total cost effective solution concept for SiP.
4. Seismic Risk Management – Taiwan is located at the active arc-continent collision region between the Luzon arc of the Philippine Sea Plate and the Eurasian Plate, and in the past, the hi-tech industry in Taiwan has suffered from the great seismic hazard. This half-day workshop will offer details on how to reduce the seismic loss during an earthquake on the basis of engineering and non-engineering methods.
5. Used Equipment: The Global Secondary Market – The secondary market for surplus semiconductor manufacturing equipment and related services continues to globally evolve, both in size and by region. This seminar will provide attendees with an overview of that market, the opportunities and challenges involved, and a view of what the future might hold.
The fact is that most unsuccessful used equipment transactions could be prevented if buyers were better informed and did not let their decisions become overly influenced by cheapest price.
For more detailed program information, please visit www.semicontaiwan.org
SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin (Texas), Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.
Karen Lo/SEMI Taiwan