Ten Hot Topics of Interest at SEMICON West 2007


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SEMI Highlights Ten Hot Topics of Interest at SEMICON West 2007

Hi-K Metal Gates and Photovoltaic Announcements Top List of New Innovations

SAN JOSE, Calif. – July 16, 2007 – SEMI today offered SEMICON West visitors useful insights into some of the key topics to pay attention to during the upcoming exposition, taking place July16-20 at the Moscone Center in San Francisco.

"SEMICON West is the flagship annual event for the global microelectronics manufacturing industry. It is the premier showcase for technologies focused on the design and manufacture of micro- and nanoelectronics, including semiconductors, MEMS/microsystems and renewable energy applications," said Victoria Hadfield, president of SEMI North America. "The exposition provides a vital forum for to see and experience current and critical technology developments, exchange information, validate customer and supplier requirements, and demonstrate industry and technology leadership."

According to the association, the top ten topics of interest at this year’s SEMICON West include:

    1. High-K metal gate technologies – Intel co-founder Gordon Moore has called this development "the biggest change in transistor technology since the introduction of polysilicon gate MOS transistors in the late 1960s." In addition to SEMICON West keynote and TechXPOT presentations on this topic, innovative equipment and materials suppliers will be positioning themselves for this important industry development will new ideas, new products and new technologies.

    2. Test Summit – as semiconductor geometries shrink to 45 nm and beyond, the need for new test technologies, including automated test equipment (ATE) is increasingly critical in ensuring the continued production of high-quality ICs. SEMICON West 2007 marks the debut of the SEMI Test Summit, where the leaders of the leading semiconductor ATE companies Advantest America, Credence, Nextest, Teradyne and Verigy will join together to discuss industry-critical design, test and yield requirements for advance semiconductor manufacturing.

    3. Next Generation Fab: Defining 300 mm Prime – Suppliers and chipmakers are looking to drive Moore’s Law by tackling key productivity bottlenecks and improving overall 300 mm fab productivity. Many observers believe that a much-publicized initiative—300 mm prime—can push out or eliminate the argument for larger wafers by bolstering the use of efficient, high-mix manufacturing operations. A panel discussion on Thursday, July 18 is geared at generating productive discussion and industry comments on the next steps in implementing 300 mm Prime.

    4. Photovoltaic Manufacturing– The market for photovoltaic cells has exploded and poised for long-term, high growth rates. The Emerging Technologies TechXPOT is expanding in 2007 to incorporate a greater emphasis on renewable energy initiatives with sessions focusing on solar and fuel cells and nano energy. Rhone Resch of Solar Energy Industry Association and T.J. Rogers of Sun Power/Cypress Semiconductor will deliver keynotes.

    5. Technology Innovation Showcase – 18 jury-selected winners across the categories of Device Scaling; Emerging Technologies; and Test, Assembly and Packaging will present a wide array of industry-shaping new technologies and products to SEMICON West visitors.

    6. Semiconductor Packaging- Innovations in semiconductor packaging are occurring almost daily. Investigate the latest advances in new materials, new packages, and new equipment in the IMAP-sponsored TechXPOT and with the largest collection of equipment and materials suppliers in North America.

    7. New Companies, New Ideas- Innovation is on display at SEMICON West with over 170 new exhibitors, and more than 500 new products on display.

    8. Bulls and Bears Investor Session - This forum provides attendees with an overview and perspective on the first six months of the year, as well as a real-time look at SEMICON West 2007 and what lies ahead.

    9. Design for Manufacturing – In a Thursday morning session at the Device Scaling TechXPOT session, industry experts will discuss issues and methods to determine an effective design for manufacturing strategy and evaluate the impact of design trade-offs through meaningful measures. On the center stage, Dr. Aart de Geus, Chairman and CEO of Synopsys, will present a keynote on the economic and technical complexities that designers encounter, with a particular focus on what it takes to bridge the gap between design and manufacturing.

    10. Big Advances in Small Things- the latest advanced nano-scale manufacturing technologies, including carbon nanotubes, printed electronics, device modeling, and nanoenergy will be showcased in the Emerging Technology TechXPOT and greater than 100 exhibitors featuring nanotechnology.

For more detailed program information, or to register for the show, please visit www.semi.org.

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin (Texas), Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.

ASSOCIATION CONTACT:

Scott Smith/SEMI

Tel: 408.943.7957

Email: ssmith@semi.org

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