European SEMI Award for 2007 Bestowed Upon Dr. Michael Toepper for Leadership in BCB-based Technology in Advanced Wafer Level Packaging
Frankfurt, Germany – 29 May 2007 – Dr. Michael Toepper of Fraunhofer Institute “Reliability and Microintegration” (Fraunhofer Institut Zuverlaessigkeit und Mikrointegration IZM), Berlin, Germany, was honoured with the European SEMI Award for 2007 for his leadership in the BCB-based redistribution technology in advanced wafer level packaging. The award was presented 23 May during the SEMI Europe Member Forum, the annual meeting of SEMI Members in Europe.
Dr. Toepper played a key role in implementing the concept of wafer level packaging into manufacturing. Wafer level packaging consists of finalizing of the packaging sequence as possible on the complete wafer rather than on the die. This ensures that the increasing inefficiency of the packaging process of single chips as a result of too many interconnections between the bond pads and the frame is avoided. This technology can be combined with ‘wafer bumping’ technology, which distributes bonding sites evenly over the wafer surface, rather than just at the chip periphery.
Implementing these technologies requires significant research on materials and process technology, in which Dr. Toepper and his team demonstrated their success.
“Today, the chip package is no longer a commodity, it is an enabler for the interconnectivity of integrated systems, as a result of a number of bright ideas and innovations,” said Heinz Kundert, president, SEMI Europe. “SEMI is honoured to grant the European SEMI Award to one of the greatest innovators in the field of packaging.”
Dr. Toepper received a PhD in material science from the Technical University of Berlin in 2003, and subsequently joined the Packaging Research Team of Professor Reichl. In 1999 he became the head of a research group at the Fraunhofer IZM Institute, which specializes in advanced packaging. Since 2006 he has also served as a Research Associate Professor of Electrical and Computing Engineering at the University of Utah. He has authored and co-authored more than 130 papers related to electronic packaging, and is a co-founder of the SECAP International Consortium for Advanced Packaging, and currently chairing the IEEE Technical Committee of Wafer Level Packaging.
SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, Silicon Valley, Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org
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Vincent Dubois/SEMI Europe
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