Industry News Archive Provided by SEMI

Industry News Archive

SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

China’s Global Dealmaking Spree Sparks Opposition at Home, Too
(Bloomberg - 30 Nov 2016)

China will take up15% of worldwide wafer fab capacity by 2018, says VLSIresearch
(Display Plus - 29 Nov 2016)

Diamonds - the ultimate semiconductors
(Nanowerk - 29 Nov 2016)

Lattice Deal May Hit A Snag
(Electronic Engineering Times - 28 Nov 2016)

Epiworks quadruples wafer production
(Display Plus - 28 Nov 2016)

North American semiconductor equipment industry posts October 2016 book-to-bill ratio of 0.91
(Solid State Technology - Blog - 28 Nov 2016)

Disco launches fully automatic polisher for CMP of difficult-to-process materials including sapphire
(Semiconductor Today - 28 Nov 2016)

Leti and Grenoble Partners Demonstrate World’s 1st Qubit Device Fabricated in CMOS Process: Paper by Leti, Inac and University of Grenoble Alpes Published in Nature Communications
(Nanotechnology Now - 28 Nov 2016)

Squeezing light into new miniature devices
(Nanowerk - 28 Nov 2016)

7nm Design Success Starts With Multi-Domain Multi-Physics Analysis
(Semiconductor Engineering - 28 Nov 2016)

Multi-Patterning Problems Grow
(Semiconductor Engineering - 28 Nov 2016)

 

 

DIsco announces new dicing saws »
(Silicon Semiconductor - 22 Nov 2016)

Northern Japan Tsunami Threat Has Largely Passed
(Bloomberg - 21 Nov 2016)

Taiwan's Economy Shifts Towards Southeast Asia
(Bloomberg - 21 Nov 2016)

Registration Open for SEMICON Korea 2017’s Special 30-Year Anniversary
(EMS Now - 21 Nov 2016)

Changes In China
(Semiconductor Engineering - 21 Nov 2016)

Can We Measure Next-Gen FinFETs?
(Semiconductor Engineering - 21 Nov 2016)

Innovation Village at SEMICON Japan will introduce startups to investors and industry
(Display Plus - 15 Nov 2016)

Era of Silicon 4.0: TSIA chairman talks about virtual Moore's Law
(Digitimes - 15 Nov 2016)

Fueling the industry with innovation at SEMICON Japan 2016
(Solid State Technology - Blog - 15 Nov 2016)

The Future of Fingerprint Scanning
(EE Times Blogs - 15 Nov 2016)

Registration Open for SEMICON Korea 2017’s Special 30-Year Anniversary
(EMS Now - 21 Nov 2016)

Changes In China
(Semiconductor Engineering - 21 Nov 2016)

Can We Measure Next-Gen FinFETs?
(Semiconductor Engineering - 21 Nov 2016)

Innovation Village at SEMICON Japan will introduce startups to investors and industry
(Display Plus - 15 Nov 2016)

Era of Silicon 4.0: TSIA chairman talks about virtual Moore's Law
(Digitimes - 15 Nov 2016)

Fueling the industry with innovation at SEMICON Japan 2016
(Solid State Technology - Blog - 15 Nov 2016)

The Future of Fingerprint Scanning
(EE Times Blogs - 15 Nov 2016)

 

Samsung pays $8bn for connected car tech firm
(Electronics Weekly - 14 Nov 2016)

Three major China firms gearing up to enter DRAM market
(Digitimes - 14 Nov 2016)

HIV test performed on USB stick
(Electronics Weekly - 10 Nov 2016)

Third quarter 2016 silicon wafer shipments set a new record
(Solid State Technology - 9 Nov 2016)

Trump Win Roils Technology Sector
(EE Times Blogs - 9 Nov 2016)

Third Quarter 2016 Silicon Wafer Shipments Increase Quarter-Over-Quarter; Sets a New Record »
(Silicon Semiconductor - 9 Nov 2016)

Saving Energy In The Fab
(Semiconductor Engineering - 9 Nov 2016)

The silicon photonics industry is ready for take-off
(Solid State Technology - Blog - 8 Nov 2016)

China Unveils Three Major Decisions Within Three Minutes
(Bloomberg - 7 Nov 2016)

WORLD OF IOT grows with 30 new exhibitors at SEMICON Japan
(Solid State Technology - 3 Nov 2016)

SMIC constructing 12-inch IC production Line in Shenzhen
(Digitimes - 3 Nov 2016)

Learning to Drive -- A Rite of Passage?
(Design News - 3 Nov 2016)

Healthcare IoT: Promise And Peril
(Semiconductor Engineering - 3 Nov 2016)

ASML Invests $1.9B in Next-Gen EUV
(Electronic Engineering Times - 3 Nov 2016)

SMIC to Build South China’s First 12-Inch Fab
(Electronic Engineering Times - 2 Nov 2016)

The Chinese advanced packaging ecosystem: What will happen
(Solid State Technology - 2 Nov 2016)

Gordon and Betty Moore Foundation Announces Inaugural Moore Inventor Fellows
(TMCnet.com - 2 Nov 2016)

As Chinese Investment In U.S. Increases So Too Does Scrutiny
(Forbes.com - 2 Nov 2016)

You Say Tomato, and I say Chocolate
(Design News - 2 Nov 2016)

U.S. Needs Big Bet on Chips
(EE Times Blogs - 2 Nov 2016)

Moore’s Law Debate Continues
(Semiconductor Engineering - 2 Nov 2016)

Samsung to invest $1bn in Austin fab
(Electronics Weekly - 2 Nov 2016)

Germany Shouldn’t Stop Chinese Investors, Opposition Leader Says
(Bloomberg - 1 Nov 2016)

Samsung Austin Semiconductor announces more than US$1 billion investment
(Digitimes - 1 Nov 2016)

Three Things That Business Leaders Should Know About Industry 4.0
(Forbes.com - 1 Nov 2016)

President Obama sets up semiconductor working group
(Electronics Weekly - 31 Oct 2016)

Obama administration launches semiconductor study group
(CNET News - 31 Oct 2016)

Artificial muscles show more flex
(Phys.org - 31 Oct 2016)

Researchers surprised at the unexpected hardness of gallium nitride: A Lehigh University team discovers that the widely used semiconducting material is almost as wear-resistant as diamonds
(Nanotechnology Now - 31 Oct 2016)

Silicon Photonics Comes Into Focus
(Semiconductor Engineering - 31 Oct 2016)

$35B Qualcomm Question: What Next?
(Electronic Engineering Times - 28 Oct 2016)

Overcoming The Limits Of Scaling
(Semiconductor Engineering - 27 Oct 2016)

US warned against Chinese takeover of German firm: report
(Phys.org - 26 Oct 2016)

NextFlex Partners with California Manufacturing Technology Consulting
(Printed Electronics Now - 26 Oct 2016)

NBMC Hosts Third Blood, Sweat & Tears Workshop on Nov. 2-3, 2016
(Printed Electronics Now - 25 Oct 2016)

TSMC says ‘good progress’ with EUV
(New Electronics - 25 Oct 2016)

Air Liquide continues investing in Asia »
(Silicon Semiconductor - 24 Oct 2016)

Messe München and SEMI Europe announce new alliance
(Solid State Technology - Blog - 24 Oct 2016)

SEMICON Europa opens tomorrow in Grenoble, France
(Solid State Technology - Blog - 24 Oct 2016)

Germany stalls Chinese takeover of tech firm Aixtron
(Phys.org - 24 Oct 2016)

Watch Out For 200mm Fabs: Fab Outlook To 2020
(Semiconductor Engineering - 24 Oct 2016)

Semiconductor equipment bookings continue to outpace equipment billings in September 2016 book-to-bill report
(Solid State Technology - Blog - 21 Oct 2016)

China’s Bold Strategy for Semiconductors
(Chip Design Blogs - 20 Oct 2016)

Return to sequential growth at Taiwan foundries
(Electronics Weekly - 20 Oct 2016)

China Ramps Up Power IC Manufacturing
(Semiconductor Engineering - 20 Oct 2016)

Will There Be Enough Silicon Wafers?
(Semiconductor Engineering - 20 Oct 2016)

SMIC, eMemory extend collaboration to 28nm
(Digitimes - 19 Oct 2016)

SMIC TianJin launches capacity expansion project
(Solid State Technology - Blog - 18 Oct 2016)

SEMI Announces Retirement of Denny McGuirk
(EMS Now - 18 Oct 2016)

Air Liquide continues innovating with new family of etch materials »
(Silicon Semiconductor - 18 Oct 2016)

Manufacturing Bits: Oct. 18
(Semiconductor Engineering - 18 Oct 2016)

The Future of Electronics at SEMICON Europa 2016
(EMS Now - 17 Oct 2016)

SMIC breaks ground for new 12-inch fab in Shanghai
(Digitimes - 13 Oct 2016)

TSMC Grows Share of Foundry Business
(Electronic Engineering Times - 13 Oct 2016)

Nordson MARCH receives global technology award for FlexTRAK-CDS high-volume plasma system
(Display Plus - 12 Oct 2016)

200mm fab capacity still growing
(Electronics Weekly - 12 Oct 2016)

200mm fabs on the rise
(Solid State Technology - Blog - 11 Oct 2016)

Gartner Says Worldwide Semiconductor Capital Spending to Decline 0.3 Percent in 2016
(Press Release Point - 11 Oct 2016)

China Inc. going all in on chips
(Nikkei Asian Review - 9 Oct 2016)

A layer of diamond can prevent high-power electronic devices from overheating
(Phys.org - 7 Oct 2016)

Why 2016 Is a Little Like 1984
(EE Times Blogs - 6 Oct 2016)

Applied Materials intros e-beam review system for OLED and LCD manufacturing
(Digitimes - 6 Oct 2016)

Keynotes announced, registration open for SEMICON Japan 2016
(Solid State Technology - 5 Oct 2016)

'Atomic sandwiches' could make computers 100X greener
(Nanowerk - 4 Oct 2016)

Fujitsu to sell 'smart' factory systems in China
(Nikkei Asian Review - 4 Oct 2016)

TSMC Staffing R&D for 3nm Process
(Electronic Engineering Times - 4 Oct 2016)

X-Fab to Swallow Altis Semiconductor
(Electronic Engineering Times - 4 Oct 2016)

Sony-Inside Huami Watch: Is It Time for FD-SOI?
(Electronic Engineering Times - 4 Oct 2016)

'Atomic sandwiches' could make computers 100X greener
(Science Daily - 3 Oct 2016)

August Global Semi Sales Show 1st YoY Growth since June 2015
(Printed Circuit Design & Fab Magazine - 3 Oct 2016)

Rise of IoT may revitalize Japanese hardware makers
(Nikkei Asian Review - 3 Oct 2016)

5G Powered by MEMS
(Electronic Engineering Times - 3 Oct 2016)

AUO shifts focus of competition from capacity to commercial value, says chairman
(Digitimes - 3 Oct 2016)

CEA LETI and Taiwan’s III Sign IoT and 5G MOU
(LEDInside - 3 Oct 2016)

X-Fab to swallow Altis Semiconductor
(EETE Automotive - 3 Oct 2016)

Taiwan IC industry to increase 7% in 2016, says TSIA chairman
(Digitimes - 29 Sep 2016)

New research could help build better hearing AIDS
(Phys.org - 29 Sep 2016)

Globalfoundries to Deliver 7nm FinFET Technology »
(Silicon Semiconductor - 29 Sep 2016)

Top 5 takeaways from SEMI Strategic Materials Conference
(Solid State Technology - Blog - 29 Sep 2016)

Leti and Taiwanese Tech Organizations Sponsoring Workshop in Taipei on MEMS, IoT, Smart Lighting Applications, System Reliability & Security
(Nanotechnology Now - 28 Sep 2016)

Applied Materials to grow in 3DNAND, Logic and Materials based patterning »
(Silicon Semiconductor - 28 Sep 2016)

Chip trader UKC expands electronics manufacturing in Vietnam
(Nikkei Asian Review - 28 Sep 2016)

Making Chip Manufacturing Sustainable
(Semiconductor Engineering - 28 Sep 2016)

Blog Review: Sept. 28
(Semiconductor Engineering - 28 Sep 2016)

North American semiconductor equipment industry posts August 2016 book-to-bill ratio of 1.03
(Solid State Technology - Blog - 27 Sep 2016)

Allied with Intel, CEA-Leti Shoots for Moon
(Electronic Engineering Times - 27 Sep 2016)

Globalfoundries Emerges From The Shadows
(Forbes.com - 27 Sep 2016)

Process Watch: Salami slicing your yield
(Solid State Technology - Blog - 26 Sep 2016)

MEMS & Sensors Industry Group highlights near-term and future connected tech at annual Executive Conference
(Solid State Technology - Blog - 26 Sep 2016)

SEMI European 3D Summit 2017: Creating high-density systems
(Solid State Technology - Blog - 26 Sep 2016)

Chip Market to Go Down, says Future Horizons
(Electronic Engineering Times - 26 Sep 2016)

EV Group Extends Volume Manufacturing Expertise to Biotechnology and Medical Device Applications »
(Silicon Semiconductor - 26 Sep 2016)

China Tries New U.S. Chip Buy With Analogix
(Forbes.com - 26 Sep 2016)

SEMI European 3D Summit 2017: Creating High-Density Systems
(EMS Now - 26 Sep 2016)

China HLMC to build new 12-inch fab
(Digitimes - 26 Sep 2016)

Applied Materials Details Strategy to Drive Sustainable Growth
(Printed Electronics Now - 22 Sep 2016)

2016 M&A second only to 2015 thanks to Q3 deals
(Electronics Weekly - 22 Sep 2016)

Sorting Out Next-Gen Memory
(Semiconductor Engineering - 22 Sep 2016)

Grappling With Chip Manufacturing Data
(Semiconductor Engineering - 22 Sep 2016)

Mask Maker Worries Grow
(Semiconductor Engineering - 22 Sep 2016)

Deploying Multi-Beam Mask Writers
(Semiconductor Engineering - 22 Sep 2016)

North American semiconductor equipment industry posts August 2016 book-to-bill Ratio of 1.03
(Display Plus - 16 Sep 2016)

SEMI and MSIG join together in strategic association partnership
(Display Plus - 16 Sep 2016)

This flexible semiconductor has the double-helix structure of DNA
(Electronic Products Magazine - 16 Sep 2016)

GlobalFoundries to invest over $2B to make new computer chip
(Phys.org - 15 Sep 2016)

7nm Market Heats Up
(Semiconductor Engineering - 15 Sep 2016)

The Future of Europe Pitch their Startups at SEMICON Europa's INNOVATION VILLAGE
(EMS Now - 15 Sep 2016)

Korea's LED Industry Developments
(LEDInside - 14 Sep 2016)

SEMI’s new interactive mobile fab forecast: SEMI FabView
(Solid State Technology - 13 Sep 2016)

SEMI Reports Second Quarter 2016 Worldwide Billings $10.5 Billion »
(Silicon Semiconductor - 13 Sep 2016)

Farewell Intersil as Renesas takes over in $3bn deal
(EETE Power Management Design - 13 Sep 2016)

Qualcomm Opens test facility in Shanghai for Semiconductor Test Manufacturing »
(Silicon Semiconductor - 13 Sep 2016)

Manufacturing Bits: Sept. 13
(Semiconductor Engineering - 13 Sep 2016)

Speeding Up Mask Production
(Semiconductor Engineering - 12 Sep 2016)

IBM Gave Birth To Disk Drives 60 Years Ago: This Week In Tech History
(Forbes.com - 12 Sep 2016)

Chip Process War Heats Up
(Electronic Engineering Times - 12 Sep 2016)

China surpasses US, Europe markets in electromobility
(EE Times India: Electronics Design & Engineering - 12 Sep 2016)

Rudolph Unveils New Inspection Suite »
(Silicon Semiconductor - 12 Sep 2016)

SEMI European MEMS Summit Brings Industry Leaders to Stuttgart
(EMS Now - 9 Sep 2016)

Globalfoundries unveils 12nm FD-SOI process
(Digitimes - 8 Sep 2016)

BASF's China Strategy: The Plans and Possibilities
(Bloomberg - 8 Sep 2016)

What is Your China Strategy?
(Blogs - Semiconductor Manufacturing & Design Community - 7 Sep 2016)

SEMI recognizes UMC CEO Po Wen Yen for sustainable semiconductor manufacturing leadership
(Solid State Technology - 7 Sep 2016)

Joint R&D Has Its Ups And Downs
(Semiconductor Engineering - 7 Sep 2016)

TSMC set to move 7nm to volume production in 1Q18
(Digitimes - 6 Sep 2016)

SEMICON Taiwan 2016: Advanced packaging remains in the spotlight
(Digitimes - 6 Sep 2016)

SEMICON Taiwan 2016 opens tomorrow; 43,000 attendees expected
(Solid State Technology - 6 Sep 2016)

SEMI European MEMS Summit brings industry leaders to Stuttgart
(Solid State Technology - Blog - 6 Sep 2016)

TSMC, Renesas Partner in 28nm for Robotic Cars
(Electronic Engineering Times - 5 Sep 2016)

UMC forges strategic partnership with APM to enhance MEMS Service capabilities
(Digitimes - 5 Sep 2016)

Top four companies dominate as GaN market booms
(EETE Power Management Design - 5 Sep 2016)

Are carbon nanotubes the next in-line for the manufacture of wearable electronics?
(Nanowerk - 5 Sep 2016)

Industry Veteran Lung Chu Named President of SEMI China
(EMS Now - 5 Sep 2016)

Semiconductor Manufacturing: ASMC 2017 "Call for Papers" Deadline is October 17
(EMS Now - 5 Sep 2016)

ASMC 2017 “Call for Papers” deadline is October 17
(Solid State Technology - 1 Sep 2016)

Flex Tech Debuts in Silicon Valley
(EE Times Blogs - 1 Sep 2016)

Industry veteran Lung Chu named president of SEMI China
(Solid State Technology - 30 Aug 2016)  

A device to control 'color' of electrons in graphene provides path to future electronics
(Science Daily - 29 Aug 2016)  

28nm Was Last Node of Moore's Law
(EE Times Blogs - 29 Aug 2016)

The Sad State of Mics Is Holding Back Siri and Alexa
(Bloomberg - 25 Aug 2016)

Surprises At Hot Chips 2016
(Semiconductor Engineering - 25 Aug 2016)

Innolux, AUO chairmen urge government to financially support panel makers
(Digitimes - 24 Aug 2016)

Full program for SEMI European MEMS Summit announced
(Solid State Technology - 24 Aug 2016)

North American semiconductor equipment industry posts July 2016 book-to-bill ratio of 1.05
(Solid State Technology - Blog - 24 Aug 2016)

A chip that checks for sabotage
(New Electronics - 24 Aug 2016)

Semiconductor Horizon Gets Wider
(EE Times Blogs - 24 Aug 2016)

The Future Of Memory
(Semiconductor Engineering - 24 Aug 2016)

Will fan-out packaging be sustainable long-term?
(Solid State Technology - 23 Aug 2016)

Laser Slicing to Slash SiC Wafer Costs, Boost Yield
(Electronic Engineering Times - 22 Aug 2016)

Deeper Inside Intel
(Semiconductor Engineering - 22 Aug 2016)

It's A Jungle Out There In Wearable Technology
(Forbes.com - 18 Aug 2016)

Meet The Four Start-Ups Helping Ford Develop A Robo-Taxi By 2021
(Forbes.com - 18 Aug 2016)

KLA-Tencor announces new suite of reticle inspection technologies
(Display Plus - 18 Aug 2016)

Chinese Manufacturers Catch up in GaN Technology
(LEDInside - 18 Aug 2016)

Trade War Looms Over Materials
(Semiconductor Engineering - 18 Aug 2016)

What Transistors Will Look Like At 5nm
(Semiconductor Engineering - 18 Aug 2016)

China’s Capital Equipment Market To Boom
(Semiconductor Engineering - 18 Aug 2016)

Intel's Big Factory Problem
(Forbes.com - 17 Aug 2016)

​Intel: Our laser chips will make sites like Google and Facebook faster
(CNET News - 17 Aug 2016)

Focus Shifting To Photonics
(Semiconductor Engineering - 17 Aug 2016)

Advanced packaging: Hot topic at SEMICON Taiwan 2016
(Solid State Technology - 17 Aug 2016)

Advanced packaging: hot topic at SEMICON Taiwan 2016
(Display Plus - 17 Aug 2016)

Professor wants to send our digital selves to the stars
(Phys.org - 17 Aug 2016)

Taiwan to actively invest in flexible OLED technologies, aims to help the country's OLED developers collaborate
(OLED Info - 17 Aug 2016)

China market: Nantong Fujitsu reportedly to acquire Amkor, says paper
(Digitimes - 17 Aug 2016)

Tokyo Electron Joins Semiconductor Research Corporation »
(Silicon Semiconductor - 16 Aug 2016)

Ensuring safety in the sub-fab
(Solid State Technology - Blog - 16 Aug 2016)

Seven Top-20 Semiconductor Suppliers Show Double-Digit Gains in 2Q16
(EMS Now - 16 Aug 2016)

Taiwan's Government to Inject NT $100B in OLED Technology
(LEDInside - 16 Aug 2016)

FO-WLP Packs Eye Panel Process
(EE Times Blogs - 15 Aug 2016)

Expanded Focus Areas and Opportunities to Exhibit at SEMICON Europa
(EMS Now - 15 Aug 2016)

As Japan seizes lead in growing semiconductor segments, industry leaders exhibit at SEMICON Japan
(Display Plus - 12 Aug 2016)

Quantum dots with impermeable shell: A powerful tool for nanoengineering
(Nanowerk - 11 Aug 2016)

Expanded focus areas and opportunities to exhibit at SEMICON Europa
(Solid State Technology - 10 Aug 2016)

Lam Research, KLA-Tencor Say Deal Faces Regulatory Hold Ups
(Bloomberg - 10 Aug 2016)

The Bandwidth Bottleneck That Is Throttling the Internet
(Scientific American - 10 Aug 2016)

Toward clothes that fix their own rips (w/ Video)
(Phys.org - 10 Aug 2016)

Is Security A Priority?
(Semiconductor Engineering - 10 Aug 2016)

Chinese Client Demands Squeezes Samsung Display OLED Supply
(LEDInside - 9 Aug 2016)

27 China chip operations form HECA
(Electronics Weekly - 8 Aug 2016)

Big Three Chipmakers Likely to Boost Capex
(Electronic Engineering Times - 8 Aug 2016)

Experiments point toward memory chips 1,000 times faster than today's
(Phys.org - 8 Aug 2016)

Complete Control Through Software
(Semiconductor Engineering - 8 Aug 2016)

Next-Gen IoT Consortium Launches
(Electronic Engineering Times - 5 Aug 2016)

Making artificial cells like soap bubbles
(Nanowerk - 5 Aug 2016)

Silicon Researcher Scans Horizon
(Electronic Engineering Times - 4 Aug 2016)

Kulicke & Soffa continues to gain traction with its advanced packaging solutions
(Display Plus - 4 Aug 2016)

Behind The ARM-SoftBank Deal
(Semiconductor Engineering - 4 Aug 2016)

What’s Important For IoT—Power, Performance Or Integration?
(Semiconductor Engineering - 4 Aug 2016)

Big 3 to splurge on capex
(Electronics Weekly - 4 Aug 2016)

'Second skin' protects soldiers from biological, chemical agents
(Science Daily - 3 Aug 2016)

'Second skin' protects soldiers from biological and chemical agents
(Nanowerk - 3 Aug 2016)

SEMICON West 2016 Interviews Available
(U.S. Tech Interactive - 2 Aug 2016)

GLOBALFOUNDRIES appoints Wallace Pai as General Manager to oversee China business development
(Solid State Technology - 2 Aug 2016)

Top MEMS sensor suppliers of 2015
(Solid State Technology - 2 Aug 2016)

Ultratech receives ‘Outstanding Supplier Award’ from SJ Semiconductor
(Solid State Technology - 2 Aug 2016)

Manufacturing Bits: Aug. 2
(Semiconductor Engineering - 2 Aug 2016)

10 predictions for the next 60 years in analog electronics | EDN
(EDN - 1 Aug 2016)

Lab-on-a-Chip breakthrough aims to help physicians detect cancer and diseases at the nanoscale
(Nanowerk - 1 Aug 2016)

Stanford’s Hennessy: STEM to CPU
(Electronic Engineering Times - 1 Aug 2016)

TSMC capex hike to prompt capacity ramps by foundry houses in Taiwan and China
(Digitimes - 1 Aug 2016)

Industry Award for Coventor »
(Silicon Semiconductor - 28 Jul 2016)

New cluster technology for surface polishing of materials
(Nanowerk - 28 Jul 2016)

Time To Pay The Piper
(Semiconductor Engineering - 28 Jul 2016)

New Drivers For Test
(Semiconductor Engineering - 28 Jul 2016)

Apple has sold 1 billion iPhones
(Computer World Singapore - 27 Jul 2016)

Gene therapy in a droplet could treat eye diseases, prevent blindness
(Science Daily - 27 Jul 2016)

Second quarter 2016 silicon wafer shipments increase quarter-over-quarter; sets a new record
(Solid State Technology - 27 Jul 2016)

Atomic blimp stretches a crystal
(Nanowerk - 27 Jul 2016)

China Likely to Narrow Chip Gap, IC Insights Says
(Electronic Engineering Times - 27 Jul 2016)

Think Small, China
(Bloomberg - 26 Jul 2016)

China’s final chance to achieve its IC industry ambitions is now underway
(Display Plus - 26 Jul 2016)

Chemical etching method helps transistors stand tall
(Solid State Technology - Blog - 26 Jul 2016)

North American Semiconductor Equipment Industry Posts June 2016 Book-to-Bill Ratio of 1.00
(EMS Now - 26 Jul 2016)

The tyranny of numbers: Sensors in the next 60 years | EDN
(EDN - 25 Jul 2016)

Nanomaterials Begin to Blur the Lines Between Industrial and Hobbyist 3D Printing
(IEEE Spectrum - 25 Jul 2016)

Blog Review – Monday, July 25, 2016
(Chip Design Blogs - 25 Jul 2016)

Coming to a monitor near you: Notorious 'perfection'
(Nanowerk - 25 Jul 2016)

Registration Open with New Exhibition Features at SEMICON Europa
(EMS Now - 25 Jul 2016)

RF GaN Gains Steam
(Semiconductor Engineering - 25 Jul 2016)

North American semiconductor equipment industry posts June 2016 book-to-bill ratio of 1.00
(Solid State Technology - 22 Jul 2016)

Future of Electric Bikes: Forget Tour de France
(EE Times Blogs - 21 Jul 2016)

Mark R. Templeton, Noted Venture Capitalist and Technology Company Executive, Dies in Boating Accident
(SYS-CON INDIA - 21 Jul 2016)

Gartner Raises 2016 Forecast for Semi Capital Spending
(Printed Circuit Design & Fab Magazine - 21 Jul 2016)

International Technology Roadmap for Semiconductors examines next 15 years of chip innovation
(Solid State Technology - 21 Jul 2016)

Material And Process Challenges In A Changing Memory Landscape
(Semiconductor Engineering - 21 Jul 2016)

The danger that lurks below
(Solid State Technology - Blog - 19 Jul 2016)

[SEMICON West 2016] Fab Owners Association joins SEMI as strategic association partner
(Display Plus - 18 Jul 2016)

Why Japan’s SoftBank Is Spending $32 Billion on a U.K. Chipmaker
(Bloomberg - 18 Jul 2016)

Easier, faster, cheaper: A full-filling approach to making nanotubes of consistent quality
(Nanowerk - 15 Jul 2016)

Toshiba and Western Digital celebrate opening of new Fab 2 semiconductor fabrication facility in Yokkaichi, Japan
(Display Plus - 15 Jul 2016)

The Week In Review: Manufacturing
(Semiconductor Engineering - 15 Jul 2016)

TSMC to Adopt Extreme Ultraviolet at 5nm
(Electronic Engineering Times - 14 Jul 2016)

[SEMICON West 2016] Standards industry leaders are honored
(Display Plus - 13 Jul 2016)

[SEMICON West 2016] Edwards gains seat as ‘expert witness’ on UN Intergovernmental Panel on Climate Change (IPCC)
(Display Plus - 13 Jul 2016)

Multipatterning Poses Process Challenges
(EE Times Blogs - 8 Jul 2016)
  Tesla's Fatal Crash: 6 Unanswered Questions
(Electronic Engineering Times - 7 Jul 2016)
  Rethinking The Sensor
(Semiconductor Engineering - 7 Jul 2016)
  Securing Chips During Manufacturing
(Semiconductor Engineering - 7 Jul 2016)
  Suction cup mat based on octopus's suckers developed to build flexible pressure sensors
(Phys.org - 6 Jul 2016)

Building a better (nano) bowtie
(Nanowerk - 5 Jul 2016)

New discovery could better predict how semiconductors weather abuse
(Phys.org - 5 Jul 2016)

Amkor opens MEMS packaging line in China
(Digitimes - 4 Jul 2016)

MEMS & Sensors Industry Group Invites Collaboration in MEMS, Sensors and ICs at SEMICON West 2016
(Bloomberg - 29 Jun 2016)

Blog Review: June 29
(Semiconductor Engineering - 29 Jun 2016)

In the space of five years, it looks like 450mm manufacturing has become surplus to current requirements
(New Electronics - 28 Jun 2016)

ASM examines the role of material management in a SMART SMT manufacturing environment
(EMS Now - 28 Jun 2016)

SMIC acquires 70% stake in LFoundry for EUR49m
(Bloomberg - 27 Jun 2016)

Interconnect Challenges Grow
(Semiconductor Engineering - 27 Jun 2016)

Fab Tool Book-to-Bill Remains Above Parity
(Electronic Engineering Times - 23 Jun 2016)

Successful FlexTech Integration Providing New Opportunities for SEMI Members
(Semiconductor Engineering - 23 Jun 2016)

Building U.S. manufacturing ecosystems for emerging advanced packaging technologies
(Solid State Technology - 22 Jun 2016)

The next wave in sensors for IoT
(Electronic Products Magazine - 22 Jun 2016)

EVG achieves fourth consecutive triple win in VLSIresearch customer satisfaction survey
(Semiconductor Today - 21 Jun 2016)

SEMI and Solid State Technology announce the 2016 “Best of West” award finalists
(Solid State Technology - Blog - 21 Jun 2016)

SEMI and Solid State Technology announce the 2016 “Best of West” Award finalists
(Solid State Technology - 21 Jun 2016)

Smart Manufacturing Leadership Coalition Will Lead the New Smart Manufacturing Innovation Institute
(Bloomberg - 21 Jun 2016)

STMicroelectronics Collaborates with Qualcomm on Sensors for Smart Mobile Devices
(Bloomberg - 20 Jun 2016)

Taiwan IC design sector should open doors to China capital, says MediaTek chairman
(Digitimes - 20 Jun 2016)

China Tops U.S. in Supercomputers
(Electronic Engineering Times - 20 Jun 2016)

Efficient hydrogen production made easy: Sticking electrons to a semiconductor with hydrazine creates an electrocatalyst
(Nanotechnology Now - 17 Jun 2016)

Companies Relocating to Vietnam Will Significantly Propel the Semiconductor Market in Vietnam Until 2020, Says Technavio
(TMCnet.com - 17 Jun 2016)

ASML microchips to buy Taiwan's HMI for 2.7 bn euros
(Phys.org - 16 Jun 2016)

Progress in the application of spin effects in graphene: from the metal to the semiconductor world
(Nanowerk - 16 Jun 2016)

Electronic Nose Using CMOS Integrated Circuits Analyzes Breath
(TMCnet.com - 16 Jun 2016)

Chip Makers Grapple with Self-Driving Cars
(EE Times Blogs - 15 Jun 2016)

CEA-Leti shows off world-class reliability & security solutions at Leti Innovation Day on June 23
(Display Plus - 14 Jun 2016)

Advanced Packaging Forum provides answers at SEMICON West 2016
(Solid State Technology - 14 Jun 2016)

Nineteen new fabs and lines to begin construction in 2016-17, says SEMI
(Digitimes - 13 Jun 2016)

Changing markets drive smarter manufacturing by IC sector
(Solid State Technology - 13 Jun 2016)

Pathfinding Beyond FinFETs
(Semiconductor Engineering - 13 Jun 2016)

Air Products Offers Free Webinar to Help Processors Conquer Particle Size Reduction Challenges
(PR Newswire - 13 Jun 2016)

Blog Review – Monday, June 13, 2016
(Chip Design Blogs - 13 Jun 2016)

Keeping cool with a black semiconductor
(Nanowerk - 13 Jun 2016)

FD SOI Benefits Rise at 14nm
(EE Times Blogs - 13 Jun 2016)

US DOE investing $10.5m in nine solid-state lighting R&D projects
(Semiconductor Today - 13 Jun 2016)

Samsung, TSMC to compete in 7nm
(Digitimes - 13 Jun 2016)

Plotting The Next Semiconductor Road Map
(Semiconductor Engineering - 13 Jun 2016)

DOE Offers US $10.5M Funding to Advance SSL Technologies
(LEDInside - 12 Jun 2016)

Countdown to Node 5: Moving beyond FinFETs
(Solid State Technology - 10 Jun 2016)

Equipment spending up: 19 new fabs and lines to start construction
(Solid State Technology - Blog - 10 Jun 2016)

The Week In Review: Manufacturing
(Semiconductor Engineering - 10 Jun 2016)

Taking microelectronics research to the atomic size future and beyond
(Phys.org - 9 Jun 2016)

DAC Day Four: Excitement And Risk In Today’s Program
(Semiconductor Engineering - 9 Jun 2016)

An interview with Dr. Dongkai Shangguan
(Solid State Technology - Blog - 8 Jun 2016)

ASMC 2016 Conference Has Highest Attendance Ever, Chipworks Achieves Twelfth Paper
(Semiconductor Manufacturing & Design - 8 Jun 2016)

Forces Driving Semi Mergers & Acquisitions
(EE Times Blogs - 8 Jun 2016)

SEMI reports first quarter 2016 worldwide semiconductor equipment figures; billings $8.3B
(Solid State Technology - 7 Jun 2016)

Leading Russian semiconductor foundry Angstrem-T has developed a design using a Cortus APS core; Cortus processor IP core incorporated in integrated circuit manufactured by Angstrem-T
(Bloomberg - 7 Jun 2016)

DAC Day Two: Down To Business
(Semiconductor Engineering - 7 Jun 2016)

Formal Confusion
(Semiconductor Engineering - 7 Jun 2016)

Latest on EUVL Development to be Discussed in EUVL Workshop in Berkeley
(Semiconductor Manufacturing & Design - 6 Jun 2016)

Forces Driving Semi Mergers & Acquisitions
(EE Times Blogs - 8 Jun 2016)

SEMI reports first quarter 2016 worldwide semiconductor equipment figures; billings $8.3B
(Solid State Technology - 7 Jun 2016)

Leading Russian semiconductor foundry Angstrem-T has developed a design using a Cortus APS core; Cortus processor IP core incorporated in integrated circuit manufactured by Angstrem-T
(Bloomberg - 7 Jun 2016)

DAC Day Two: Down To Business
(Semiconductor Engineering - 7 Jun 2016)

Formal Confusion
(Semiconductor Engineering - 7 Jun 2016)

Latest on EUVL Development to be Discussed in EUVL Workshop in Berkeley
(Semiconductor Manufacturing & Design - 6 Jun 2016)

DAC Day One: EDA Through Different Glasses
(Semiconductor Engineering - 6 Jun 2016)

Exar to Sell Display IC Subsidiary to Chinese Firm
(Electronic Engineering Times - 3 Jun 2016)

DAC On Cars
(Semiconductor Engineering - 2 Jun 2016)

3D Printing of patterned membranes opens door to rapid advances in membrane technology
(Nanowerk - 2 Jun 2016)

Fab Investment Increases In China
(Semiconductor Engineering - 2 Jun 2016)

SEMICON Southeast Asia 2016: The future of smart manufacturing in Malaysia
(EMS Now - 1 Jun 2016)

Blog Review: June 1
(Semiconductor Engineering - 1 Jun 2016)

Finding the Killer App for Graphene
(Bloomberg View - 31 May 2016)

GLOBALFOUNDRIES to expand presence in China with 300mm fab in Chongqing
(Solid State Technology - Blog - 31 May 2016)

DAC Day One: EDA Through Different Glasses
(Semiconductor Engineering - 6 Jun 2016)

Exar to Sell Display IC Subsidiary to Chinese Firm
(Electronic Engineering Times - 3 Jun 2016)

DAC On Cars
(Semiconductor Engineering - 2 Jun 2016)

3D Printing of patterned membranes opens door to rapid advances in membrane technology
(Nanowerk - 2 Jun 2016)

Fab Investment Increases In China
(Semiconductor Engineering - 2 Jun 2016)

SEMICON Southeast Asia 2016: The future of smart manufacturing in Malaysia
(EMS Now - 1 Jun 2016)

Blog Review: June 1
(Semiconductor Engineering - 1 Jun 2016)

Finding the Killer App for Graphene
(Bloomberg View - 31 May 2016)

GLOBALFOUNDRIES to expand presence in China with 300mm fab in Chongqing
(Solid State Technology - Blog - 31 May 2016)

The Internet of Animals Is Here
(Design News - 31 May 2016)

Manufacturing Bits: May 31
(Semiconductor Engineering - 31 May 2016)

Globalfoundries Forms Joint Venture to Make More Chips in China
(Bloomberg - 30 May 2016)

China-based FGC investment fund to acquire Aixtron
(OLED Info - 30 May 2016)

SEMICON West 2016 Expands Technical Programming by nearly 50%
(EMS Now - 30 May 2016)

Plasmonic pixels could be used to make non-fading paint
(Phys.org - 30 May 2016)

The Internet Gains A Sixth Sense
(Forbes.com - 30 May 2016)

After blaze, world’s largest solar power plant offline for up to three weeks
(Computerworld Malaysia - 27 May 2016)

SEMICON West 2016 expands technical programming by nearly 50%
(Solid State Technology - 26 May 2016)

TSMC to spend US$2.2 billion on R&D in 2016, says co-CEO
(Digitimes - 26 May 2016)

First strategic materials conference is held in Korea
(Display Plus - 25 May 2016)

Globalfoundries Working on Next-Gen FDSOI Process
(Electronic Engineering Times - 25 May 2016)

Ultra-Dense 3-D Packaging for IoT
(Electronic Engineering Times - 25 May 2016)

US fab-tool book-to-bill stays above parity, says SEMI
(Digitimes - 25 May 2016)

North American semiconductor equipment industry posts April 2016 book-to-bill ratio of 1.10
(Solid State Technology - 24 May 2016)

IBM's 3D Memory Chip: A New Era Or Another Noble Failure?
(Forbes.com - 24 May 2016)

Moore on his Law and More
(Electronic Engineering Times - 24 May 2016)

Drug delivery that hits the dot
(Phys.org - 24 May 2016)

First Strategic Materials Conference in Korea - a Success
(EMS Now - 24 May 2016)

First Strategic Materials Conference in Korea: A success
(Solid State Technology - 23 May 2016)

Factbox: China develops an appetite for German technology firms
(Business News & Financial News - Reuters - 23 May 2016)

Foundries' Sales Show Hard Times Continuing
(Electronic Engineering Times - 23 May 2016)

Graphene: Progress, not quantum leaps
(Nanotechnology Now - 23 May 2016)

Chinese investment fund to launch offer for Aixtron
(Compound Semiconductor - 23 May 2016)

Semiconductor Merger Mania: A Change From Historical Norms?
(EE Times Blogs - 19 May 2016)

Russian Market Overview
(Semiconductor Engineering - 19 May 2016)

What’s The Outlook For ICs?
(Semiconductor Engineering - 19 May 2016)

What Happened To DSA?
(Semiconductor Engineering - 19 May 2016)

What’s Next For NAND?
(Semiconductor Engineering - 19 May 2016)

One-On-One: Dave Hemker
(Semiconductor Engineering - 19 May 2016)

IBM keynoter outlines disruptive “Economy of Things” at SEMI’s ASMC 2016
(Solid State Technology - 18 May 2016)

First quarter 2016 silicon wafer shipments increase quarter-over-quarter
(Solid State Technology - 17 May 2016)

EUVL: Taking it down to 5nm
(Solid State Technology - 17 May 2016)

Rare-earth-free magnet made from cheap materials
(Electronics Weekly - 17 May 2016)

MEMS Broadens Its Horizons
(EE Times Blogs - 17 May 2016)

Thin film semiconductors could be deposited on rolled up flexible surfaces
(New Electronics - 16 May 2016)

Evidence Mounts of Chip Sales Decline
(Electronic Engineering Times - 16 May 2016)

Sony to Resume Wafer Processing at Kumamoto After Earthquake
(Bloomberg - 13 May 2016)

18 Views of an IoT World
(Electronic Engineering Times - 12 May 2016)

Seven Top-20 semiconductor suppliers show double-digit declines
(Solid State Technology - 12 May 2016)

SEMICON Southeast Asia 2016: Connecting in Penang
(Solid State Technology - 12 May 2016)

LEDs Spur Growth in Power ICs
(Electronic Engineering Times - 12 May 2016)

China's Flood Of Cheap Flying Cameras Is Little Threat To Dajiang
(Forbes.com - 11 May 2016)

Taiwan Shaken by Magnitude 5.8 Earthquake Off Northeastern Coast
(Bloomberg - 11 May 2016)

TSMC says it sees no impact from earthquake at Hsinchu
(Business News & Financial News - Reuters - 11 May 2016)

SEMICON West Expands to Take on the Extended Supply Chain Forum
(EMS Now - 11 May 2016)

Sony to Resume Wafer Processing at Kumamoto After Earthquake
(Bloomberg - 13 May 2016)

18 Views of an IoT World
(Electronic Engineering Times - 12 May 2016)

Seven Top-20 semiconductor suppliers show double-digit declines
(Solid State Technology - 12 May 2016)

SEMICON Southeast Asia 2016: Connecting in Penang
(Solid State Technology - 12 May 2016)

LEDs Spur Growth in Power ICs
(Electronic Engineering Times - 12 May 2016)

China's Flood Of Cheap Flying Cameras Is Little Threat To Dajiang
(Forbes.com - 11 May 2016)

Taiwan Shaken by Magnitude 5.8 Earthquake Off Northeastern Coast
(Bloomberg - 11 May 2016)

TSMC says it sees no impact from earthquake at Hsinchu
(Business News & Financial News - Reuters - 11 May 2016)

SEMICON West Expands to Take on the Extended Supply Chain Forum
(EMS Now - 11 May 2016)

Could a 1mm thick solid state battery drive the development of the IoT?
(New Electronics - 11 May 2016)

TSMC board approves capacity expansion
(Evertiq - 11 May 2016)

STATS ChipPAC fan-out wafer-level packaging shipments exceed 1 billion units
(Digitimes - 11 May 2016)

SEMICON West expands to take on the Extended Supply Chain Forum
(Solid State Technology - 10 May 2016)

SEMICON West expands to take on extended supply chain forum
(Display Plus - 10 May 2016)

SEMI reports 2015 semiconductor photomask sales of $3.3B
(Solid State Technology - 9 May 2016)

Studying post-etching silicon crystal defects on 300mm wafers by automatic defect review AFM
(Solid State Technology - 9 May 2016)

Quantum swing—a pendulum that moves forward and backwards at the same time
(Phys.org - 9 May 2016)

Grappling With IoT Security
(Semiconductor Engineering - 9 May 2016)

The Week In Review: Manufacturing
(Semiconductor Engineering - 6 May 2016)

Why Roadmaps Matter
(Semiconductor Engineering - 5 May 2016)

Melissa Grupen-Shemansky Appointed SEMI’s CTO for Flexible Electronics and Advanced Packaging
(Printed Electronics Now - 5 May 2016)

North America vital to advanced semiconductor manufacturing
(Solid State Technology - 5 May 2016)

First quarter 2016 European semiconductor sales
(Evertiq - 5 May 2016)

Tech Firms Urge Candidates To Embrace Trade, High-Tech Visas
(International Business Times - 4 May 2016)

Melissa Grupen-Shemansky appointed SEMI’s CTO for flexible electronics and advanced packaging
(Solid State Technology - 4 May 2016)

Sony: damage investigation is complete
(Evertiq - 4 May 2016)

Imec honors Dr. Gordon Moore with “Lifetime of Innovation Award”
(Solid State Technology - 3 May 2016)

SEMICON West 2016 delivers new programs; Free registration ends May 6
(Solid State Technology - Blog - 3 May 2016)

Outside of Mark Zuckerberg, nobody wants to be CEO of a tech company – 4 step down from position in just 24 hours
(Electronic Products Magazine - 3 May 2016)

SEMICON West 2016 Delivers New Programs – Free Registration Ends May 6
(EMS Now - 3 May 2016)

Chip Sales Edge Up Slightly
(Electronic Engineering Times - 2 May 2016)

Solar Plane Takes Off on Next Leg
(EE Times Blogs - 2 May 2016)

From catching up to forging ahead: China’s new role in the semiconductor industry
(Solid State Technology - 2 May 2016)

Researchers Develop Dissolvable Memristor
(Electronic Engineering Times - 2 May 2016)

MEDIA ALERT: Advantest's VOICE 2016 Developer Conference Opens May 10 in San Diego, CA and May 18 in Taiwan, Offering Technical Sessions, Keynote Speakers, Interactive Kiosks and Networking Activities
(Bloomberg - 2 May 2016)

Indian Fabs, the Free Market and Central Planning
(EE Times Blogs - 29 Apr 2016)

Crowd funding changing the game for chip firms
(Electronics Weekly - 29 Apr 2016)

Chips for Energy Harvesting: The Next Billion-Dollar Market
(Electronic Engineering Times - 28 Apr 2016)

A tiny switch for a few particles of light
(Nanowerk - 28 Apr 2016)

Taiwanese government should provide more support for solar panel industry
(Phys.org - 28 Apr 2016)

High volume 450mm IC wafer fabs not before 2020
(Evertiq - 28 Apr 2016)

Deep Space Design Considerations
(Semiconductor Engineering - 28 Apr 2016)

Rhines Expounds on the Deconsolidation of the Semiconductor Industry
(Blogs - Semiconductor Manufacturing & Design Community - 27 Apr 2016)

Blog Review: April 27
(Semiconductor Engineering - 27 Apr 2016)

Intersolar North America Expands Conference Offerings, Off-site Tours, Networking Opportunities
(Bloomberg - 26 Apr 2016)

Latest Advancements in Sensor Technology Examined at SEMI European MEMS Summit
(EMS Now - 26 Apr 2016)

Carbon nanotube semiconductors are well-suited for photovoltaics
(Nanowerk - 26 Apr 2016)

Has the moment finally arrived for AR and VR
(New Electronics - 26 Apr 2016)

BRIEF-Taiwan's TSMC orders equipment for T$2.6 bln
(Business News & Financial News - Reuters - 25 Apr 2016)

SV150: Chip industry saw another year of consolidation [Mercury News]
(Bloomberg - 25 Apr 2016)

Latest advancements in sensor technology examined at SEMI European MEMS Summit
(Solid State Technology - Blog - 25 Apr 2016)

Air Products Again Named to Corporate Responsibility Magazine's 100 Best Corporate Citizens List
(Bloomberg - 25 Apr 2016)

IoT Security Spending to Skyrocket
(Electronic Engineering Times - 25 Apr 2016)

NREL theory overcomes barrier to using 2D semiconductors in electronic and optoelectronic devices
(Semiconductor Today - 25 Apr 2016)

Roll-to-Roll Flexible Electronics to Hit 100GHZ?
(Electronic Engineering Times - 25 Apr 2016)

10nm Versus 7nm
(Semiconductor Engineering - 25 Apr 2016)

Korea to Boost OLED Development with Increased Subsidies in 2017
(LEDInside - 25 Apr 2016)

North American semiconductor equipment industry posts March 2016 book-to-bill ratio of 1.15
(Solid State Technology - 22 Apr 2016)

China's Licensing Thrill
(Bloomberg - 21 Apr 2016)

TSMC orders equipment for NT$2.29 billion
(Digitimes - 21 Apr 2016)

O2O Leads Chinese Startups' Boom And Bust Cycle
(Forbes.com - 21 Apr 2016)

Next-Generation Chips Hit a Snag
(Bloomberg - 21 Apr 2016)

The Big Race
(Semiconductor Engineering - 21 Apr 2016)

China’s Chip Patent Growth May Be Short Lived
(EE Times Blogs - 21 Apr 2016)

Samsung Foundry’s Business Strategy
(Semiconductor Engineering - 21 Apr 2016)

2015: A Year In Review
(Semiconductor Engineering - 21 Apr 2016)

With simple process, engineers fabricate fastest flexible silicon transistor
(Phys.org - 20 Apr 2016)

imec opens new cleanroom to advance GaN-on-silicon, MEMs,silicon photonics innovation »
(Silicon Semiconductor - 11 Mar 2016)

Slow but positive 2016 followed by double digits in 2017
(Solid State Technology - Blog - 10 Mar 2016)

Thailand’s semiconductor sector on-track to tap $280B global automotive electronics industry
(Solid State Technology - 9 Mar 2016)

IoT Planet to co-locate with SEMICON Europa in 2016
(Solid State Technology - 9 Mar 2016)

Applied Materials honored as a 2016 World’s Most Ethical Company
(Solid State Technology - 8 Mar 2016)

EVG's executive technology director Paul Lindner receives European SEMI Award
(Semiconductor Today - 8 Mar 2016)

Advice for Silicon Startups
(Electronic Engineering Times - 8 Mar 2016)

Manufacturing Bits: March 8
(Semiconductor Engineering - 8 Mar 2016)

Creation of first practical silicon-based laser: Researchers take giant step towards 'holy grail' of silicon photonics
(Phys.org - 7 Mar 2016)

FlexTech Presents FLEXI Awards for Flexible Electronics Innovation, R&D, and Leadership
(Printed Electronics Now - 7 Mar 2016)

2016FLEX Features Innovative Manufacturing Trends, New Products and a Bright Industry Future
(EMS Now - 7 Mar 2016)

Four Reasons Today's Disruptive Innovations Are Better And Cheaper, And What To Do About It
(Forbes.com - 7 Mar 2016)

The Future Is Flexible and Printed
(Blogs - Semiconductor Manufacturing & Design Community - 4 Mar 2016)

58 percent of Pure-Play Foundry Capacity Under High Risk for Seismic Activity »
(Silicon Semiconductor - 4 Mar 2016)

E.U. Tackles III-V on CMOS
(Electronic Engineering Times - 4 Mar 2016)

Outstanding Group of Companies and Individuals Receive FlexTech's FLEXI Awards for Flexible Electronics Innovation
(EMS Now - 4 Mar 2016)

Chip Sales Off to Slow Start to 2016
(Electronic Engineering Times - 4 Mar 2016)

Safe But Boring
(Semiconductor Engineering - 3 Mar 2016)

Panel equipment vendors see booming orders from China
(Digitimes - 3 Mar 2016)

IFTLE 276 SEMI ISS 2016: The Focus Shifts to Packaging
(Semiconductor Manufacturing & Design - 2 Mar 2016)

Blog Review: March 2
(Semiconductor Engineering - 2 Mar 2016)

Cisco buying Israel's Leaba Semiconductor for $320 million
(Business News & Financial News - Reuters - 2 Mar 2016)

TSMC to double 16nm chip production, says report
(Digitimes - 1 Mar 2016)

Future Billionaires
(Forbes.com - 1 Mar 2016)

System Bits: March 1
(Semiconductor Engineering - 1 Mar 2016)

NextFlex, America's First-Ever Flexible Hybrid Electronics Manufacturing Institute, Names Founding Members
(PR Newswire - 29 Feb 2016)

The Taiwanese Earthquake That Nearly Cancelled the Apple iPhone 7
(Forbes.com - 29 Feb 2016)

Preparing For The IoT Data Tsunami
(Semiconductor Engineering - 29 Feb 2016)

Bipartisan customs bill combats counterfeit semiconductors
(Solid State Technology - Blog - 26 Feb 2016)

Physicists prove new potential for silicon chips
(Phys.org - 26 Feb 2016)

ASML Details Advances in DUV, Metrology, EUV
(Blogs - Semiconductor Manufacturing & Design Community - 25 Feb 2016)

What’s the Next-Gen Litho Tech? Maybe All of Them
(Blogs - Semiconductor Manufacturing & Design Community - 25 Feb 2016)

EUV 2.0 Decision Needed
(Electronic Engineering Times - 25 Feb 2016)

Sharp accepts $5.9bn Foxconn takeover bid
(International Business Times UK - 25 Feb 2016)

Talk Fast And Stop
(Semiconductor Engineering - 25 Feb 2016)

North American semiconductor equipment industry posts January 2016 book-to-bill Ratio of 1.08
(Solid State Technology - 24 Feb 2016)

How IBM Plans To Innovate Past Moore's Law
(Forbes.com - 24 Feb 2016)

Call for Papers Open for SEMICON Europa 2016 and 2016FLEX Europe
(U.S. Tech Interactive - 24 Feb 2016)

Using STEM to Make a Difference in Their Communities, 15 Public Schools are Named National Finalists in the $2 million* Solve for Tomorrow Contest
(Bloomberg - 24 Feb 2016)

What’s Next For DRAM?
(Semiconductor Engineering - 24 Feb 2016)

Semiconductor M&A Is Poised to Rise
(Bloomberg - 23 Feb 2016)

Semiconductor capital spending rebound fails to materialize in 2015
(Solid State Technology - Blog - 23 Feb 2016)

A Winning Formula
(Semiconductor Engineering - 22 Feb 2016)

Germany and Israel collaborate on laser of unrivalled precision
(Phys.org - 22 Feb 2016)

How Healthy Is The Chip Market?
(Semiconductor Engineering - 22 Feb 2016)

The Big Shift
(Semiconductor Engineering, Feb 18)

Memory Lane: Far From A Leisurely Stroll
(Semiconductor Engineering, Feb 18)

The Economics Of Moore’s Law
(Semiconductor Engineering, Feb 18)

Punchy proteins could help advance drug delivery, MEMS devices (w/video)
(Nanowerk, Feb 17)

Europe launches three pilot lines for photonics
(EE Times Europe Analog, Feb 17)

Urban Miners Hunt for Gold in Piles of Electronic Trash
(Bloomberg, Feb 16)

Fairchild rejects Chinese takeover bid
(EE Times Europe Analog, Feb 16)

Partnership to deliver next-generation lithography process
(New Electronics, Feb 15)

Vertical Nanolasers Open Optical Ports Out of Silicon
(Electronic Engineering Times, Feb 15)

Silicon wafer shipments rise 3% in 2015, says SEMI
(Digitimes, Feb 15)

TSMC: Earthquake hit harder than originally thought
(Evertiq, Feb 15)

2016FLEX to Gather over 600 Experts in Flexible Hybrid Electronics
(EMS Now, Feb 12)

SEMICON Southeast Asia 2016 comes back to Penang
(Solid State Technology - Blog, Feb 11)

2016FLEX to Focus on Latest Advances in Flexible and Printed Electronics
(Printed Electronics Now, Feb 10)

SEMI launches new integrated packaging assembly and test group
(Solid State Technology, Feb 10)

Blog Review: Feb. 10
(Semiconductor Engineering, Feb 10)

Future Intel chip tech will sacrifice speed gains for power efficiency
(Computer World Singapore, Feb 09)

Future Intel chip tech will sacrifice speed gains for power efficiency
(PCWorld, Feb 09)

EUV Gets $500M Center
(Electronic Engineering Times, Feb 09)

Strong Taiwan quake appears to have little effect on chip industry
(Computer World Singapore, Feb 08)

Call for Papers issued for SEMICON Russia
(Solid State Technology - Blog, Feb 08)

China’s Impact On The Semiconductor Market
(Semiconductor Engineering, Feb 08)

Yield and cost challenges at 16nm and beyond
(Solid State Technology, Feb 08)

ASE update on the Feb 6, 2016 Taiwan earthquake
(Bloomberg, Feb 08)

Himax Technologies, Inc. Headquarters and Manufacturing Facilities Little Affected by February 6th Earthquake
(Bloomberg, Feb 08)

Taiwanese earthquake halts production
(Evertiq, Feb 08)

Taiwan Quake: TSMC, UMC Assess Impact; Expect Recovery in Days
(Electronic Engineering Times, Feb 07)

Taiwan’s Electronics Makers Unruffled After Earthquake, Say Business As Usual
(International Business Times, Feb 06)

Earthquake hits key Taiwan Science Park
(Digitimes, Feb 06)

What’s happening in the China market?
(Solid State Technology, Feb 05)

Interview (Part 2 of 2): Leti Is A Catalyst For The FD-SOI Ecosystem, CEO Marie Semeria Explains Where They’re Headed
(Semiconductor Manufacturing & Design, Feb 05)

TSMC's 300mm Chinese Wafer Fab Wins Approval
(Electronic Engineering Times, Feb 03)

FinFETs Flow at Samsung, TSMC
(Electronic Engineering Times, Feb 03)

Taiwan approves TSMC plans for $3 bn plant in China
(Phys.org, Feb 03)

North American Equipment Industry Posts December Book-to-Bill Ratio of 0.99 »
(Silicon Semiconductor, Feb 02)

Scientists present smallest man-made lattice structure
(Nanowerk, Feb 02)

A heat-seeking slingshot: Liquid droplets show ability to cool extremely hot surfaces
(Phys.org, Feb 01)

Global semiconductor sales top $335B in 2015
(Solid State Technology - Blog, Feb 01)

Be-leaf it or not, scientists have proven a battery can be made using a leaf
(Electronic Products Magazine, Feb 01)

ISS Europe 2016: Reaching into a new era
(Solid State Technology - Blog, Feb 01)

Revolutionising nanomaterial production
(New Electronics, Feb 01)

Chip Sales Dipped Slightly in 2015
(Electronic Engineering Times, Feb 01)

Foundries takeover 200mm fab capacity by 2018
(Solid State Technology - Blog, Feb 01)

Japan Takes Economic Action, Lifting Stocks Around the Globe
(Forbes.com, Jan 29)

Are Chips Getting More Reliable?
(Semiconductor Engineering, Jan 28)

Exploring the world of quantum dots
(Phys.org, Jan 28)

Engineers develop hand-held pen-sized microscope to identify cancer cells outside the lab
(International Business Times UK, Jan 27)

North American semiconductor equipment industry posts December 2015 book-to-bill ratio of 0.99
(Solid State Technology, Jan 27)

TI to Shutter Scotland Fab
(Electronic Engineering Times, Jan 27)

UMC Raises 2016 Capex to $2.2 Billion on Improving Outlook
(Electronic Engineering Times, Jan 27)

Why LED lighting is so important to the chip market
(Electronics Weekly, Jan 27)

Blog Review: Jan. 27
(Semiconductor Engineering, Jan 27)

CES 2016 Highlights Top Trends
(Printed Electronics Now, Jan 26)

SMIC to Benefit from $3 Billion Investment
(Electronic Engineering Times, Jan 26)

China semiconductor acquisitions surge; SEMICON China brings the new market into focus
(Solid State Technology - Blog, Jan 26)

SEMICON Korea opening: Memory and mobility drive IC manufacturing
(Solid State Technology, Jan 26)

SEMICON Korea Opening: Memory and Mobility Drive IC Manufacturing
(U.S. Tech Interactive, Jan 26)

Semiconductor Acquisitions Surge in China, SEMICON China Brings the New Market into Focus
(EMS Now, Jan 26)

Japanese companies must adapt to survive
(Nikkei Asian Review, Jan 26)

Manufacturing Bits: Jan. 26
(Semiconductor Engineering, Jan 26)

NBC LEARN DEBUTS SIX-PART VIDEO SERIES, “NANOTECHNOLOGY: SUPER SMALL SCIENCE” Produced by NBC Learn in partnership with the National Science Foundation, and narrated by NBC News/MSNBC’s Kate Snow, series highlights leading research in nanotechnology
(Nanotechnology Now, Jan 25)

Chip Stacks Take New Tacks
(Electronic Engineering Times, Jan 25)

Semiconductor R&D Spending Slows
(Electronic Engineering Times, Jan 25)

Synaptics Deal Shows China's Heightened Appetite For Foreign Chipmakers
(Forbes.com, Jan 22)

Industry Road Map Under Construction
(Semiconductor Engineering, Jan 21)

Chasing China's 'Big Fund'
(EE Times India: Electronics Design & Engineering, Jan 21)

Deep UV: the road to mass production
(Compound Semiconductor, Jan 21)

Semiconductor R&D growth slows in 2015, says IC Insights
(Digitimes, Jan 21)

Coming To A Fab Near You?
(Semiconductor Engineering, Jan 21)

Obama Delivers Unique State-of-the-Union Speech
(Semiconductor Engineering, Jan 21)

Predictions For 2016: Semiconductors, Manufacturing And Design
(Semiconductor Engineering, Jan 21)

EUV Improves But Not Ready
(Electronic Engineering Times, Jan 20)

Will 5nm Happen?
(Semiconductor Engineering, Jan 20)

China’s Chip Jackpot Teases
(Electronic Engineering Times, Jan 19)

Qualcomm sets up joint venture in China for server chips
(Computerworld, Jan 18)

Qualcomm Enters $280M Joint Venture with Chinese Province
(Electronic Engineering Times, Jan 18)

Pfeiffer Vacuum presents innovative vacuum solutions at the trade fairs Semicon Korea and Semicon China
(Solid State Technology - Blog, Jan 18)

Pfeiffer Vacuum presents vacuum solutions at Semicon Korea and Semicon China »
(Silicon Semiconductor, Jan 18)

Qualcomm sets up joint venture in China for server chips
(Computerworld Hong Kong, Jan 18)

Qualcomm and Guizhou Province create 280 million USD joint venture
(Microwave Engineering Europe, Jan 18)

TSMC expects to launch 5nm node 2 years after 7nm
(Digitimes, Jan 18)

SEMI Awards Honor Process and Technology Integration Achievements
(EMS Now, Jan 15)

SEMI Awards honor process and technology integration achievements
(Solid State Technology - Blog, Jan 14)

Advanced Packaging Is Real. Now What?
(Semiconductor Engineering, Jan 14)

TSMC Boosts 2016 Capex to About $9.5 Billion
(Electronic Engineering Times, Jan 14)

3D XPoint Steps Into the Light
(Electronic Engineering Times, Jan 14)

Thinking Outside The Chip
(Semiconductor Engineering, Jan 14)

Advanced packaging industry: What’s new on the market?
(Solid State Technology, Jan 13)

Growth and a changing ecosystem at SEMI ISS 2016
(Solid State Technology, Jan 13)

Blog Review: Jan. 13
(Semiconductor Engineering, Jan 13)

Chip Forecasts, Drivers Diverge
(Electronic Engineering Times, Jan 12)

Manufacturing Bits: Jan. 12
(Semiconductor Engineering, Jan 12)

Collaboration is the centerpiece to push the limits of lithography
(Solid State Technology - Blog, Jan 11)

Viewpoints: 2016 outlook
(Solid State Technology - Blog, Jan 11)

Equipment Sales Were Mixed Bag In 2015
(Semiconductor Engineering, Jan 11)

What to Expect in 2016 in the Chipworld
(Semiconductor Manufacturing & Design, Jan 11)

Four Reasons 2016 Will Be a Strong Year for M&A
(Forbes.com, Jan 11)

What to Expect in 2016 in the Chipworld
(Semiconductor Manufacturing & Design, Jan 11)

Four Reasons 2016 Will Be a Strong Year for M&A
(Forbes.com, Jan 11)

Global semiconductor revenue fell marginally in 2015, says Gartner
(IBTimes, Jan 07)

A wild ride in 2015 – and two steps forward in 2016
(Solid State Technology - Blog, Jan 07)

Changes In Chip Design
(Semiconductor Engineering, Jan 07)

2016 Global Technology Predictions from IHS Analysts »
(Silicon Semiconductor, Jan 06)

Should We Have AI Anxiety?
(Electronic Engineering Times, Jan 06)

Rich, thin televisions vie for crown at CES
(Phys.org, Jan 05)

Belle Wei appointed to SEMI Foundation board of trustees
(Solid State Technology, Jan 05)

Fairchild says Chinese bid could be better
(EE Times Europe Analog, Jan 05)

Fairchild’s Board Backs Bid From Chinese Firms
(Electronic Engineering Times, Jan 05)

MEMS fabrication on the cheap
(EE Times Europe Analog, Jan 05)

How Printed Electronics Continues to Reshape the Electronics Industry
(Design News, Jan 05)

A Year in Review: A look back at the top stories from 2015
(Solid State Technology, Jan 04)

Intel Completes Acquisition of Altera
(Scientific Computing, Jan 04)

The top 20 news articles on analog, MEMS and sensors in 2015
(EE Times Europe Analog, Jan 04)

CEO Outlook: 2016
(Semiconductor Engineering, Jan 04)

Why We Are Running Out of Helium And What We Can Do About It
(Forbes.com, Jan 01)
 

2015 News Archive

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