Industry News Archive Provided by SEMI

Industry News Archive

SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

SEMI posts North American equipment industry billings (Evaluation Engineering - 22 Feb 2017)

Big Changes In Patterning (Semiconductor Engineering - 22 Feb 2017)

MEMS: A Tale Of Two Tough Markets (Semiconductor Engineering - 22 Feb 2017)

SEMI appoints Ajit Manocha as President and CEO (Solid State Technology - Blog - 21 Feb 2017)

SEMI Appoints Ajit Manocha as President and CEO (PR Newswire (EN) - 21 Feb 2017)

Manufacturing Bits: Feb. 21 (Semiconductor Engineering - 21 Feb 2017)

Intel Continues to Drive Semiconductor Industry R&D Spending (EMS Now - 20 Feb 2017)

Semiconductor Process Development: Finding A Faster Way To Profitability (Semiconductor Engineering - 20 Feb 2017)

Get Ready For Nanotube RAM (Semiconductor Engineering - 20 Feb 2017)

Applied Materials says that we're just at the beginning of the OLED adoption cycle (OLED Info - 19 Feb 2017)

Vital Control in Fab Materials Supply-Chains – Part 2 (Blogs - Semiconductor Manufacturing & Design Community - 16 Feb 2017)

Breakthrough in 'wonder' materials paves way for flexible tech (Phys.org - 16 Feb 2017)

China Moves To Top Spot In Fab Equipment Spending (Semiconductor Engineering - 16 Feb 2017)

Progress In Flexible Electronics (Semiconductor Engineering - 16 Feb 2017)

Battling Fab Cycle Times (Semiconductor Engineering - 15 Feb 2017)

3D and 2.5D IC packaging market expected to be worth $170B by 2022 (Solid State Technology - Blog - 14 Feb 2017)

NextFlex Announces Next Set of Projects (Printed Electronics Now - 14 Feb 2017)

Winners & Losers of GloFo's China Deal (EE Times Blogs - 13 Feb 2017)

GlobalFoundries 12-inch wafer production line in Chengdu commences operation (Solid State Technology - Blog - 13 Feb 2017)

TSMC Says Impact from Quake Not Material (Electronic Engineering Times - 13 Feb 2017)

How China's Dealmakers Pulled Off a $207 Billion Global Spree
(Bloomberg - 13 Feb 2017)

Intel $7 Billion Investment in Next-Gen Semiconductor Factory »
(Silicon Semiconductor - 13 Feb 2017)

GLOBALFOUNDRIES Expands to Meet Worldwide Customer Demand: Company invests for capacity growth in the United States, Germany, China and Singapore
(Nanotechnology Now - 10 Feb 2017)

The Week In Review: Manufacturing
(Semiconductor Engineering - 10 Feb 2017)

Intel announces $7B investment in next-gen semiconductor fab in Arizona
(Solid State Technology - 9 Feb 2017)

Fix Processes, Then Silos
(Semiconductor Engineering - 9 Feb 2017)

Toshiba starts construction of Fab 6 and Memory R&D Centre
(New Electronics - 9 Feb 2017)

 

 

SEMICON Korea huge 30th year anniversary event opens today
(Solid State Technology - 8 Feb 2017)

An oxide semiconductor just single atom thick
(Nanowerk - 8 Feb 2017)

Addressing Test Time Challenges
(Semiconductor Engineering - 8 Feb 2017)

Annual silicon volume shipments remain at record highs
(Solid State Technology - Blog - 7 Feb 2017)

Advantest Will Showcase Products, Demonstrations and a Technical Paper at SEMICON Korea, February 8-10 in Seoul
(Digitimes - 7 Feb 2017)

How Germany Hammers Down Renewable Energy Costs: QuickTake Q&A
(Bloomberg - 7 Feb 2017)

SK Hynix Makes Bid to Buy Part of Toshiba’s Memory Chip Arm
(Bloomberg - 7 Feb 2017)

Betting On Wafer-Level Fan-Outs
(Semiconductor Engineering - 6 Feb 2017)

Chip-Package-Board Issues Grow
(Semiconductor Engineering - 6 Feb 2017)

Uncovering Unintended Behavior
(Semiconductor Engineering - 3 Feb 2017)

Friday Quiz: Acquired Companies, Part 3
(EE Times Blogs - 2 Feb 2017)

Global semiconductor sales reach $339 billion in 2016
(Display Plus - 2 Feb 2017)

Work Remains To Enable Connected Cars, Automotive Security
(Semiconductor Engineering - 2 Feb 2017)

Q'comm-NXP Faces Trump, China Hurdles
(Electronic Engineering Times - 2 Feb 2017)

“Escape Room” Game Challenges Physics-Phobes to Face Their Fear
(Scientific American - 2 Feb 2017)

Samsung could set up a plant in US to manufacture home appliances – report
(International Business Times UK - 2 Feb 2017)

Thin, flexible, light-absorbent material for energy and stealth applications
(Nanowerk - 2 Feb 2017)

Gartner Says Samsung and Apple Continued to Lead as Top Global Semiconductor Customers in 2016
(EMS Now - 1 Feb 2017)

Without technology, China's "MIC 225" results for ICs likely to fall woefully short of its goals
(Display Plus - 1 Feb 2017)

Rethinking Stats In Manufacturing Equipment
(Semiconductor Engineering - 1 Feb 2017)

FlexTech announces contract for battery development with ITN Energy Systems
(Solid State Technology - Blog - 31 Jan 2017)

Our Man in China: Ask Yorbe
(EE Times Blogs - 30 Jan 2017)

[SEMICON Korea 2017] Air Products expand nitrogen capacity in Korea’s Pyeongtaek City to support increasing demand of semiconductor industr
(Display Plus - 30 Jan 2017)

New 'made in China' chip on the way as country boosts indigenous tech
(ComputerWorld Malaysia - 30 Jan 2017)

Managing Parasitics For Transistor Performance
(Semiconductor Engineering - 30 Jan 2017)

STMicroelectronics Showcases its Latest Solutions for Smart Driving »
(Silicon Semiconductor - 30 Jan 2017)

Car electrification calls for more standardization, says Silicon Mobility
(EETE Automotive - 27 Jan 2017)

Trump, Brexit Cloud Upbeat 2017
(Electronic Engineering Times - 26 Jan 2017)

Bidding War On H-1B Visas?
(Semiconductor Engineering - 26 Jan 2017)

Foxconn's U.S. Plan Doesn't Add Up
(Bloomberg - 23 Jan 2017)

STATS ChipPAC recognized for patent innovations for the seventh consecutive year by IEEE
(Solid State Technology - Blog - 23 Jan 2017)

Deals Dominate Semiconductors
(Mannerisms - Electronics Weekly Blog - 23 Jan 2017)

X-Fab is Fastest Growing Foundry
(Electronic Engineering Times - 23 Jan 2017)

China responds to US chip threats with a USD 30 bn factory
(Computer World Singapore - 23 Jan 2017)

Why Every Company Is A Technology Company
(Forbes - 23 Jan 2017)

Semiconductor M&A reach peak in 2015-2016, says IC Insights
(Digitimes - 20 Jan 2017)

Tsinghua to Build $30 Billion Memory Fab in China
(Electronic Engineering Times - 19 Jan 2017)

What’s Up MEMS?
(Semiconductor Engineering - 19 Jan 2017)

China Factors Heavily In Policy And Business Considerations
(Semiconductor Engineering - 19 Jan 2017)

5 Takeaways From ISS
(Semiconductor Engineering - 19 Jan 2017)

China Unveils Memory Plans
(Semiconductor Engineering - 19 Jan 2017)

Chip Sales Grew 1.5% in ‘16, Gartner says
(Electronic Engineering Times - 18 Jan 2017)

Future of Chip Research Group Questioned
(Electronic Engineering Times - 18 Jan 2017)

Blog Review: Jan. 18
(Semiconductor Engineering - 18 Jan 2017)

Extending the era of Moore’s Law through lower cost patterning »
(Silicon Semiconductor - 17 Jan 2017)

CEOs Rush to Avoid Trump’s Wrath With Stops at the Gilded Tower
(Bloomberg - 17 Jan 2017)

What Can Go Wrong In Automotive
(Semiconductor Engineering - 17 Jan 2017)

Manufacturing Bits: Jan. 17
(Semiconductor Engineering - 17 Jan 2017)

Commentary: A lesson to be learned from China panel industry headhunting
(Digitimes - 16 Jan 2017)

Outlook for 450 mm wafers fades »
(Silicon Semiconductor - 13 Jan 2017)

Fab investment surging in China, says SEMI
(Digitimes - 13 Jan 2017)

TSMC could build plant in the US, says Chang
(Digitimes - 12 Jan 2017)

SEMI ISS 2017 uncovers new growth, forecast upgrades
(Display Plus - 12 Jan 2017)

EDA in the year 2017 – Part 1
(Chip Design Blogs - 12 Jan 2017)

China Defends Big Chip Bet
(Electronic Engineering Times - 12 Jan 2017)

TSMC Expects Flat Year for Foundry
(Electronic Engineering Times - 11 Jan 2017)

China Expected to Poach More Taiwan Chip Execs
(Electronic Engineering Times - 11 Jan 2017)

SEMI ISS 2017 uncovers new growth, forecast upgrades
(Solid State Technology - Blog - 10 Jan 2017)

Semiconductor eyed for next-generation 'power electronics'
(Phys.org - 10 Jan 2017)

Manufacturing Bits: Jan. 10
(Semiconductor Engineering - 10 Jan 2017)

Blog Review: Jan. 4
(Semiconductor Engineering - 4 Jan 2017)

BRIEF-TSMC orders machinery equipment from Lam Research, Applied Materials
(Business News & Financial News - Reuters - 3 Jan 2017)

Printed Electronics Now’s Top 10 Online Exclusives for 2016
(Printed Electronics Now - 3 Jan 2017)

Chip Sales Grew Sharply in November
(Electronic Engineering Times - 3 Jan 2017)

Bloomberg’s Srinivasan: Move From China Could Harm Chip Makers
(Bloomberg - 3 Jan 2017)

TSMC 7nm ready for customer tape-outs in 2Q17, says report
(Digitimes - 3 Jan 2017)

Yangtze River Storage breaks ground for memory plant
(Digitimes - 2 Jan 2017)

Obama to Urge Protection for Chip Industry
(Electronic Engineering Times - 2 Jan 2017)

Intel Finds Moore’s Law’s Next Step at 10 Nanometers
(IEEE Spectrum - 30 Dec 2016)

LED Technology Breakthroughs in 2016
(LEDInside - 29 Dec 2016)

More Reactive, Less Warming
(Semiconductor Engineering - 29 Dec 2016)

China's Belt and Road initiative vital to Asian job creation
(Nikkei Asian Review - 28 Dec 2016)

IoT Ready to Light Up in 2017
(Electronic Engineering Times - 27 Dec 2016)

Toshio Maruyama of Advantest receives SEMI Marketing Excellence Award
(Digitimes - 27 Dec 2016)

Ten Best Chip CEOs 2016
(Mannerisms - Electronics Weekly Blog - 27 Dec 2016)

TSMC Says 10nm on Track, Countering Reports
(Electronic Engineering Times - 27 Dec 2016)

BRIEF-TSMC orders equipment from Wholetech System, Applied Materials, Tokyo Electron
(Business News & Financial News - Reuters - 26 Dec 2016)

Your Year in Review, Unsung Hero
(EE Times Blogs - 26 Dec 2016)

Samsung to Form QD TV Alliance
(LEDInside - 26 Dec 2016)

Japan Inc. Shows Its Savvy
(Bloomberg - 26 Dec 2016)

A year in review: Top 10 stories of 2016
(Solid State Technology - Blog - 23 Dec 2016)

Japan Is Developing a 'Hydrogen Society' in Mt. Fuji's Shadow
(Bloomberg - 22 Dec 2016)

Moore’s law and the impact on the raw material supply chain
(EMS Now - 22 Dec 2016)

Reflecting Back On 2016: Tools, Designs, Manufacturing
(Semiconductor Engineering - 22 Dec 2016)

Honey, I shrunk the circuit
(ScienceDaily - 21 Dec 2016)

Flexible and Printed Electronics in 2016: The Year in Review
(Printed Electronics Now - 21 Dec 2016)

Foundries See Mixed Future
(Semiconductor Engineering - 21 Dec 2016)

Blog Review: Dec. 21
(Semiconductor Engineering - 21 Dec 2016)

Wafer Works to set up 8-inch fab in China
(Digitimes - 20 Dec 2016)

Chips Execs See Maturing Industry
(Electronic Engineering Times - 20 Dec 2016)

62 new facilities start operation 2017 and beyond
(Solid State Technology - Blog - 19 Dec 2016)

Toshio Maruyama to Receive SEMI Marketing Excellence Award at SEMICON Japan
(EMS Now - 19 Dec 2016)

China’s Memory Drama: Must-See in 2017
(Electronic Engineering Times - 19 Dec 2016)

Uncertainty Grows For 5nm, 3nm
(Semiconductor Engineering - 19 Dec 2016)

China Dominates Planned Chip Fabs
(Electronic Engineering Times - 15 Dec 2016)

Fab Tool Biz Faces Challenges In 2017
(Semiconductor Engineering - 15 Dec 2016)

Inside Advanced Patterning
(Semiconductor Engineering - 15 Dec 2016)

New fab facilities: China dominates, followed by Americas and Taiwan
(Solid State Technology - 14 Dec 2016)

SEMICON China 2017 presents six forums in China’s explosive growth market
(Solid State Technology - 14 Dec 2016)

New Fab Facilities: China Dominates, Followed by Americas and Taiwan
(EMS Now - 14 Dec 2016)

Globalfoundries demoes finfet silicon running at 56Gbit
(Electronics Weekly - 13 Dec 2016)

Semiconductor Equipment Sales Forecast - $40 Billion
(EMS Now - 13 Dec 2016)

Manufacturing Bits: Dec. 13
(Semiconductor Engineering - 13 Dec 2016)

Chip manufacturing equipment market grows 8.7%
(Electronics Weekly - 13 Dec 2016)

TSMC plans 3/5nm fab for 2022
(Electronics Weekly - 12 Dec 2016)

Commentary: Silicon wafer industry headed for consolidation
(Digitimes - 12 Dec 2016)

Engineers integrate internal robotic tactile sensors
(Phys.org - 12 Dec 2016)

China Eyes Chip Market Amid Growing Demand
(Forbes.com - 9 Dec 2016)

Chinese firm scraps German tech deal after US block
(Phys.org - 8 Dec 2016)

A stamp to print electronic inks
(New Electronics - 8 Dec 2016)

What Comes After Moore’s Law And Dennard Scaling?
(Semiconductor Engineering - 8 Dec 2016)

Reflecting Back on 2016: Markets
(Semiconductor Engineering - 8 Dec 2016)

Five suppliers to hold 41% of global semiconductor marketshare in 2016
(Solid State Technology - 7 Dec 2016)

Qualcomm Launches The First 10nm Server Chip
(Forbes.com - 7 Dec 2016)

ClassOne reports record sales, driven by wafer-level packaging and More than Moore technologies
(Semiconductor Today - 7 Dec 2016)

Blog Review: Dec. 7
(Semiconductor Engineering - 7 Dec 2016)

TSMC to build new plant for 5nm and newer processes
(Digitimes - 6 Dec 2016)

Brewer Science unveils temporary wafer bonding technology for advanced packaging
(Display Plus - 6 Dec 2016)

Why China Wants U.S. Memory Chip Technology -- And What Washington Is Doing About It
(Forbes.com - 6 Dec 2016)

Semiconductor Materials: Restructuring in the Supplier Base
(Semiconductor Manufacturing & Design - 6 Dec 2016)

TSMC, IBM Detail 7-nm Work
(Electronic Engineering Times - 6 Dec 2016)

Fabless Industry Shrinks
(Electronics Weekly - 6 Dec 2016)

Global 3Q16 semiconductor equipment billings rise, says SEMI
(Digitimes - 6 Dec 2016)

Manufacturing Bits: Dec. 6
(Semiconductor Engineering - 6 Dec 2016)

China holds mantle of Asia's technology, science power
(Nikkei Asian Review - 6 Dec 2016)

Lawmakers Urge Rejection of Lattice Semi Takeover
(Electronic Engineering Times - 5 Dec 2016)

Taiwan leads semiconductor equipment purchases
(Electronics Weekly - 5 Dec 2016)

China to US: Avoid politics in purchase of Germany's Aixtron
(Phys.org - 2 Dec 2016)

TSMC lands new 28nm chip orders for UFS controllers
(Digitimes - 2 Dec 2016)

Obama Said Poised to Block Chinese Takeover of Germany’s Aixtron
(Bloomberg - 1 Dec 2016)

Third Time Could Be The Charm For Silicon Valley And Japan
(Forbes.com - 1 Dec 2016)

RISC-V Expands its Audience
(Electronic Engineering Times - 1 Dec 2016)

IoT, Architectures, And Security
(Semiconductor Engineering - 1 Dec 2016)

2016 News Archive

2015 News Archive

2014 News Archive

2013 News Archive

2012 News Archive

2011 News Archive