Industry News Archives 2013

SEMI provides this archive of news and information from industry news sources as a resource. Due to the nature of dated material on the internet, SEMI does not guarantee that links are maintained by the news provider.

First quarter 2013 reports slight decrease in silicon wafer shipments
(Solid State Technology, May 09

GLOBALFOUNDRIES Singapore General Manager KC Ang Appointed As SEMI Singapore RAB Chairman
(TMCnet.com, May 09)

Overcapacity plagues China's LED industry
(TMCnet.com, May 09)

EV Group Rolls Out Next-Generation EVG120 Automated Resist Processing System For Micro- And Nano-Electronics Production; Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor Applicat
(Solid State Technology, May 08)

Japan Fair Trade Commission Approves ASML Acquisition of Cymer
(Solid State Technology, May 07)

GlobalFoundries' Fab 8 facility to be completed by 2013-end
(Solid State Technology, May 06)

Semiconductor assembly, test services revenue rises 2.1% in 2012: report
(Solid State Technology, May 06)

SEMICON Singapore 2013 to Spotlight Trends and Challenges in Technology and Workforce Development
(TMCnet.com, May 03)

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner
(Digitimes, May 03)

The bright future of Taiwan optoelectronics industry
(Digitimes, May 03)

Semiconductor Industry to Recognize Philip Yeo and Lee Kok Choy at SEMICON Singapore 2013
(EMS Now, May 02)

Semiconductor Research Corporation, National Science Foundation Introduce Compact Modeling Initiative for Nanotechnology Era
(Nanowerk, May 01)

Infineon and GloFo sign production cooperation
(Evertiq, May 01)

Focus of SEMI Europe Networking Day: Embedded Packaging Technologies Enabling Product Differentiation
(EMS Now, May 01)

Chip design is crucial to Europe, says Cadence v-p
(Electronics Weekly, Apr 29)

U.S. Semiconductor Industry Cites Data Showing Support for 1 Million-Plus US Jobs
(Solid State Technology, Apr 26)

Only 4 IC foundries to compete in advanced process market, says Globalfoundries
(Digitimes, Apr 25)

Worldwide semiconductor foundry market grew 16.2% in 2012: Gartner
(Solid State Technology, Apr 25)

Confronting sub-20nm front-end challenges with the “duck and weave”
(Solid State Technology, Apr 24)

Critical Updates from Industry Leaders on EUV, 3D Transistors and 450mm Manufacturing Targeted for SEMICON West 2013
(Solid State Technology, Apr 24)

Continued low booking levels for equipment manufacturers [Updated]
(PV Magazine, Apr 24)

Cause of LED Efficiency Droop Finally Revealed
(Science Daily, Apr 23)

Continued low booking levels for equipment manufacturers
(PV Magazine, Apr 23)

EU details concerns about alleged smartcard chip cartel
(Information Technology World, Apr 22)

Applied Materials back on top in chip equipment
(EE Times, Apr 22)

FinFET challenges and solutions – custom, digital, and signoff
(EE Times, Apr 22)

SEMI reports March book-to-bill ratio of 1.14
(Solid State Technology, Apr 19)

Top 30 MEMS companies of 2012
(Solid State Technology, Apr 19)

What is encapsulation?

Senate Immigration Reform Bill Would Help Spur Semiconductor Industry Growth, Innovation
(PR Newswire, Apr 17)

Examining the MEMS gyroscope patent landscape
(Solid State Technology, Apr 17)

India's semiconductor consumption grows to 20%
(Solid State Technology, Apr 17)

Memory makers see better profits as chip pricing improves
(Digitimes, Apr 17)

Intel Forecasts Second-Quarter Sales That May Top Estimates
(Bloomberg, Apr 16)

Semiconductor R&D: A state of transition
(Solid State Technology, Apr 11)

Memory, foundry and LED markets drive fab spending in southeast Asia
(Solid State Technology, Apr 11)

Panel industry yet to be affected by rising tensions in Korea, says Amtran chairman
(Digitimes, Apr 11)

PARC goes xerographic: Is that any way to make a computer?
(Phys.Org, Apr 10)

Intel Honors 19 Companies with Preferred Quality Supplier and Achievement Awards
(TMCnet.com, Apr 09)

Intel Honors Eight Companies with Supplier Continuous Quality Improvement Award
(TMCnet.com, Apr 09)

SEMI Reports 2012 Global Semiconductor Materials Sales of $47.1 Billion
(Solid State Technology, Apr 09)

Flexible electronics could transform the way we make and use electronic devices
(Phys.Org, Apr 09)

Processes below 40nm account for 27% of global wafer capacity, says IC Insights
(Digitimes, Apr 09)

Old science might make better LEDs and solar cells
(Electronics Weekly, Apr 08)

3-D chips getting cool
(EE Times, Apr 08)

Accidental discovery may lead to improved polymers
(Phys.Org, Apr 05)

ST heads EU MEMS project
(New Electronics, Apr 05)

 

Bruker introduces new AFM semiconductor characterization solution
(Solid State Technology, Apr 04)

TI recognizes 12 suppliers with annual excellence award
(PR Newswire, Apr 04)

Father of the FinFET lands Kaufman award
(EE Times, Apr 04)

Cellphone’s 40th anniversary is no midlife crisis
(EE Times Blogs, Apr 03)

Applied Materials' Randhir Thakur Named IEEE Fellow for Groundbreaking Contributions to Microchip Fabrication
(Investing & Stock Research - Businessweek, Apr 03)

Globalfoundries claims 3D chip breakthrough with TSVs
(Electronics Weekly, Apr 02)

Four PV Industry Leaders in Europe Honored for Standards Accomplishments
(EMS Now, Apr 02)

TSMC to install 20nm fab equipment ahead of schedule, says report
(Digitimes, Apr 02)

ARM, TSMC tape out 64-bit core for FinFET process
(EE Times, Apr 01)

Chip market growth limited to Americas, Asia-Pacific
(EE Times, Apr 01)

Policymakers Agree on Need to Elevate PV Trade Dialogue
(EMS Now, Mar 29)

Slideshow: Solar plane warms up for U.S. tour
(EE Times, Mar 29)

Escape the Moore's-Law Traffic Jam
(HBR Blog Network, Mar 28)

Top25 Semiconductor Supplier Ranking
(Evertiq, Mar 28)

Congress must legislate to avoid a helium crisis: Kemp
(Business News & Financial News - Reuters, Mar 27)

SEMI Europe Honors Four PV Industry Leaders
(PCB007 IConnect007, Mar 26)

Globalfoundries partners with ASML for chip tape-outs
(Display Plus, Mar 26) 

SEMI Europe Honors Four PV Industry Leaders
(PCB007 IConnect007, Mar 26)

Globalfoundries partners with ASML for chip tape-outs
(Display Plus, Mar 26)

New International PV Technology Roadmap Updates Path towards Continuous Solar Cost Reduction
(Sun & Wind Energy, Mar 25)

North American Semiconductor Equipment Industry Posts February 2013 Book-to-Bill Ratio of 1.10
(EMS Now, Mar 25)

3D physical simulation tools provide superior FinFet predictability
(EE Times, Mar 25)

Chipmaking equipment sales down but looking up
(EE Times, Mar 25)

Solarcon India 2013 to highlight the importance of PV manufacturing in India
(PV Magazine, Mar 22)

SEMI, SEAJ book-to-bill ratios almost flat in February 2013
(Digitimes, Mar 22)

Critical process technologies and fab productivity addressed at ASMC 2013
(Solid State Technology, Mar 20)

Semiconductor Cos Nibble at Indian Carrots; Two Proposals Received to Set Up Fabrication Units
(Solid State Technology, Mar 19)

SEMICON West 2013 Spotlights Industry R&D Challenges and Opportunities
(TMCnet.com, Mar 19)

ASML, Globalfoundries partner to tape out 28nm and 20nm chips
(Digitimes, Mar 19)

Kulicke & Soffa Launches Chinese-language Website
(Solid State Technology, Mar 19)

US collaboration to advance thin film technologies
(PV Magazine, Mar 15)

Over 100 Leading Tech Executives Urge President Obama and Congress to Enact High-Skilled Immigration Reform
(Solid State Technology, Mar 15)

U.S. Solar Market Grew 76% in 2012
(Forbes, Mar 14)

European project to use nanoimprinting for highly efficient solar cells
(New Electronics, Mar 14)

Flexible displays unlikely to hit markets in 2013
(Digitimes, Mar 14)

Intel leads unexpectedly large decline in semiconductor market inventory
(Solid State Technology, Mar 13)

Global Semiconductor Equipment Sales $36.9 Billion in 2012
(PCB007 IConnect007, Mar 13)

Will PV tariffs level the playing field between the US and China?
(PV Magazine, Mar 13)

Sharp Samsung Alliance -- An Alliance of Mutual Benefits
(EMS Now, Mar 13)

India: Domestic PV manufacturing capacity reaches 2 GW
(PV Magazine, Mar 13)

Printed electronics sector takes hard look at the flexible future
(Solid State Technology, Mar 12)

Commentary: Nuclear dispute creates opportunity for LED lighting firms
(Digitimes, Mar 12)

Govt in talks to set up chip fabrication units [Mint, New Delhi]
(Investing & Stock Research - Businessweek, Mar 12)

New products to be presented at Semicon China 2013
(Solid State Technology, Mar 11)

Graphene researchers create 'superheated' water that can corrode diamonds
(Phys.Org, Mar 11)

-Thinfilm - Press Coverage: 2013 FlexTech Report
(Solid State Technology, Mar 11)

Applied Materials Named to Ethisphere's 2013 World's Most Ethical Companies List
(TMCnet.com, Mar 11)

Bruker Introduces 3D Optical Microscope
(Solid State Technology, Mar 08)

LED firms in Greater China need to accelerate standardization, says expert
(Digitimes, Mar 08)

Rolith and SUSS MicroTec announce installation of 2nd generation nanolithography tool
(PV Magazine, Mar 08)

'Key' EUV milestone, DSA progress, more reported at SPIE Advanced Lithography
(Solid State Technology, Mar 07)

Fab Spending Forecast: Equipment spending is expected to remain flat in 2013
(Solid State Technology, Mar 06)

Researcher finds Moore's Law and Wright's Law best predict how tech improves
(Phys.Org, Mar 06)

Key EUV milestone, DSA progress, more reported at SPIE Advanced Lithography
(Nanowerk, Mar 06)

EV Group to develop equipment to enable covalent bonds at room temperature
(Solid State Technology, Mar 05)

Memory markets gain steam
(EE Times, Mar 05)

Corning says flexible displays three years away
(Solid State Technology, Mar 05)

First-time participant Swagelok Northwest ranks fifth in Oregon's 100 best companies to work list
(PR Newswire, Mar 04)

Global chip sales start brightly in 2013
(EE Times, Mar 04)

A Single European Semiconductor Strategy Is on Its Way
(Semiconductor Packaging News, Mar 04)

Developing and strengthening 3D IC manufacture in Europe
(EETE Power Management Design, Mar 01)

SEMI proposes a way out of solar trade wars
(PV Magazine, Mar 01)

Single European Semiconductor Strategy on the Way
(TMCnet.com, Mar 01)

STMicroelectronics is first $1 billion MEMS company
(Solid State Technology, Feb 27)

Nano 'beads on a string' could advance battery technology
(Phys.Org, Feb 27)

KLA-Tencor Announces Two Additions to Litho/Etch Process Control Portfolio
(Semiconductor Packaging News, Feb 27)

First conflict-free tin metal from Congo due in March
(Reuters Global Markets News, Feb 26)

Connecting (quantum) dots: Spin technique moves researchers closer to creating first viable high-speed quantum computer
(Phys.Org, Feb 26)

Scientists develop multicolor LEDs without heavy metals
(Solid State Technology, Feb 25)

Direct growth of InGaN on silicon
(Semiconductor Today, Feb 25)

North American Semiconductor Equipment Industry Posts January 2013 Book-to-Bill Ratio of 1.14
(EMS Now, Feb 25)

With Silicon Valley outposts, Samsung draws line in the sand
(Phys.Org, Feb 22)

SEMI book-to-bill ratio rises below parity
(Digitimes, Feb 22)

Intel's new Penang building largest outside the U.S.
(ComputerWorld Singapore, Feb 21)

New ITRPV Edition Focuses on Materials and Enabling Technologies
(EMS Now, Feb 21)

Call for Papers Open for SEMICON Europa 2013
(Solid State Technology, Feb 21)

Five IC suppliers to hold one-third of 300mm wafer capacity in 2013
(Solid State Technology, Feb 20)

DJ: Jan Chip Equip Orders Down 25.2%; BB Ratio 1.18 -SEAJ
(Nikkei.com, Feb 19)

Semiconductor 'Nano-Shish-Kebabs' Created With Potential for 3-D Technologies
(Science Daily, Feb 19)

Production process doubles speed and efficiency of flexible electronics
(Phys.Org, Feb 19)

EU tariffs against Chinese could cost European solar industry €27.8 billion
(Pv Tech, Feb 19)

Infineon ships power ICs from floppy 300-mm wafers
(EE Times, Feb 19)

SEMI Announces Silicon Innovation Forum to Bridge Funding Gaps for Early-Stage Companies
(EMS Now, Feb 18)

Applied Materials makes further cuts to solar business operations
(Pv Tech, Feb 14)

Yoshida in Japan: Renesas' cuts are GloFo's gain
(EE Times, Feb 14)

New room-temperature process could lead to less expensive solar cells and other electronic devices
(Phys.Org, Feb 13)

Market for supercapacitors to grow 30% year on year and reach $11 billion within ten years
(EE Times Europe Analog, Feb 13)

Chip engineers prepare for 450mm wafer transition
(EE Times Europe, Feb 13)

TSMC enjoys sales bonanza
(EE Times, Feb 08)

MEMS technology helps to track bird migration and behavior
(EE Times Europe, Feb 08)

New atomic layer deposition process for nitride LED reflector structures
(Semiconductor Today, Feb 07)

Semiconductor Industry Posts Near-Record Sales Total in 2012
(EMS Now, Feb 06)

GloFo, Samsung in race to 14nm
(EE Times, Feb 06)

MEMS Enabling a Health & Medical Revolution
(Design News, Feb 05)

Samsung ramps venture efforts
(EE Times, Feb 04)

Semiconductor industry posts near-record sales total in 2012, says SIA
(Digitimes, Feb 04)

SEMI and PVMC sign memorandum of understanding
(Semiconductor Today, Feb 04)

SEMI Honors JC Kim with SEMI Sales and Marketing Excellence Award
(EMS Now, Feb 04)

€11.2-million European project to take flexible OLEDs from lab to fab
(EE Times Europe, Feb 04)

€11.2-million European project to take flexible OLEDs from lab to fab
(EE Times Europe, Feb 04)

Semiconductor industry to recover this year
(PC World, Feb 03)

Counterfeiting costs lives
(EE Times Blogs, Feb 01)

Capitol Connection: A roadmap for semi industry's future
(EE Times, Feb 01)

2013 IC Market Forecast
(Semiconductor Packaging News, Feb 01)

New pilot line for polymer electronics at Fraunhofer IAP
(+Plastic Electronics, Feb 01)

Taiwan's flat-panel industry posts negative growth in 2012
(Solid State Technology, Feb 01)

FlexTech Alliance Announces 2013 FLEXI Award Winners, Recognizing Accomplishments in Flexible and Printed Electronics
(PR Newswire, Feb 01)

Japanese solar companies set to visit New Delhi
(PV Magazine, Feb 01)

Samsung, Hynix cautious about 2013 capex plans
(Digitimes, Feb 01) 

SEMI Honors JC Kim with SEMI Sales and Marketing Excellence Award
(TMCnet.com, Jan 31)

SEMI and U.S. Photovoltaic Manufacturing Consortium sign MOU to enable focus on standards and roadmap development
(Display Plus, Jan 31)

Mature fabs still process 40% of all silicon
(Display Plus, Jan 31)

SEMI honors JC Kim with SEMI Sales and Marketing Excellence Award
(Solid State Technology, Jan 30)

EU project to take flexible OLEDs from lab to fab
(Electronic Products Magazine, Jan 30)

KLA-Tencor Announces New eS805 Electron-Beam Inspection System
(Nanowerk, Jan 30)

SEMI and U.S. Photovoltaic Manufacturing Consortium Sign MOU to Enable Focus on Standards and Roadmap Development |
(TMCnet.com, Jan 30)

SEMI and U.S. Photovoltaic Manufacturing Consortium sign MOU to enable focus on standards and roadmap development
(Nanowerk, Jan 29)

UMC, Stats ChipPac team for 3-D IC demo
(EE Times, Jan 29)

London Calling: Flash Forward to make the most miniaturized chips?
(EE Times, Jan 29)

Samsung Employee Dies Following Chemical Leak
(International Business Times, Jan 28)

Chinese IC market boom predicted
(EE Times, Jan 28)

North America fab tool book-to-bill continues growth, says SEMI
(Digitimes, Jan 28) 

Semiconductor Equipment Demand Jumps (Finally)
(Printed Circuit Design & Fab Magazine, Jan 25)

Excess chip inventory set to hurt Q1
(EE Times, Jan 25)

Intel's 450-mm wafer spend starts in 2013
(EE Times, Jan 24)

TSMC demands suppliers deliver equipment in advance for 28nm node
(Digitimes, Jan 24)

Penn keeps predicting chip market growth
(EE Times, Jan 23)

Can the DRAM Market Return to Growth This Year?
(EMS Now, Jan 23)

Japan Raises Economic View for First Time in 8 Months
(Bloomberg, Jan 23)

Flexible solar cell reaches 20.4% efficiency
(EE Times, Jan 22)

Image sensors out of a spray can: Organic sensors increase light sensitivity of cameras
(Phys.Org, Jan 22)

New semiconductor research center established at UCLA Engineering with $35 million in funding
(Nanowerk, Jan 21)

New semiconductor research center established at UCLA Engineering with $35 million in funding
(Nanowerk, Jan 21)

Prediction for 2013 – Business
(EE Times Blogs, Jan 18)

LED manufacturing investment declines as industry contemplates future directions
(Solid State Technology, Jan 18)

Semiconductor Industry Forms Unique Partnership with Government and Universities to Develop Next-Generation Chip Technology
(TMCnet.com, Jan 18)

$194 Million U.S. university research center network focused on next-generation microelectronics
(Nanowerk, Jan 17)

Commentary: LED consolidations in 2012 to show effects in 2013
(Digitimes, Jan 17)

Global Leaders Convene at LED Korea to Discover, Learn and See the Latest Manufacturing Innovations
(TMCnet.com, Jan 16)

Semiconductor Leaders See Massive Industry Transformation
(TMCnet.com, Jan 16)

Fifth Annual SOLARCON India Exhibition Returns to Bangalore in 2013
(TMCnet.com, Jan 16)

SEMI publishes HB-LED standard relating to sapphire substrates
(LEDs Magazine, Jan 15)

ISS 2013: Semiconductor leaders see massive industry transformation
(Solid State Technology, Jan 15)

Fabless model shows no sign of collapse
(EE Times Blogs, Jan 14)

SEMI Releases Third Quarter 2012 Worldwide Photovoltaic Equipment Market Statistics Report
(EMS Now, Jan 14)

Applied Materials to Receive 2013 IEEE Corporate Innovation Recognition Award
(TMCnet.com, Jan 14)

Air-channels and nanoporous structure boost output from nitride LEDs
(Semiconductor Today, Jan 14)

Worldwide PV bookings remain flat in third quarter of 2012
(Pv Tech, Jan 11)

Reports: Globalfoundries hints at $10-bn fab location
(EE Times, Jan 11)

IPC Conflict Minerals Seminar Proceedings Now Available
(PCB007 IConnect007, Jan 10)

CES Day One Recap
(Forbes.com, Jan 08)

PV market to flourish in Asia in 2013
(PV Magazine, Jan 07)

Intel works with Plastic Logic on bendy tablet
(Electronics Weekly, Jan 07)

Consumer Electronics Show 2013 news roundup (Electronics Weekly, Jan 07)

SIA: November chip sales best of the year
(Solid State Technology, Jan 04)

MEMS, iPhone mics, and impressive growth
(EE Times, Jan 04)

CES show to see changing of guard in tech sector
(Phys.Org, Jan 04)

2013: 450mm is the next big opportunity
(Solid State Technology, Jan 03)

2013: The year of the diamond?
(Solid State Technology, Jan 03)

Chip market to turn up in 2013
(EE Times Europe Analog, Jan 03)

2013: Outlook for secondary equipment
(Solid State Technology, Jan 03)

2013: Continued strength in 200mm
(Solid State Technology, Jan 03)

2013: Next-generation 3-D NAND flash technology
(Solid State Technology, Jan 02)

2013: Facing unprecedented precision engineering challenges
(Solid State Technology, Jan 02)

2013: Thriving in the transition to 450mm
(Solid State Technology, Jan 02)

Building the internet of things with MEMS and 3D advances
(Solid State Technology, Jan 02)

Fab Equipment Spending Shrinks Back to Flat
(Solid State Technology, Jan 02)

EUROPEAN 3D TSV SUMMIT: Join The Presentation By Multitest Experts
(Semiconductor Packaging News, Jan 02)

Medical diagnostics to benefit from organic electronics
(+Plastic Electronics, Jan 01)