Strategic Opportunities for Semiconductor Materials to be discussed at SMC 2007


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Strategic Opportunities for Semiconductor Materials to be discussed at SMC 2007

Conference to Focus on new Technologies, Markets and Supply Chain Issues for Semiconductor Manufacturing Materials

SAN JOSE, Calif. – October 10, 2006 – The SEMI Strategic Materials Conference (SMC) 2007, to be held at The Ritz-Carlton at Half Moon Bay, January 10-12, 2007, will focus on the semiconductor industry’s need for new materials and how materials manufacturers can remain competitive and profitable in the radically cyclical semiconductor business.

Building on the theme “Silicon to Package: Growth Tracks for Materials Suppliers,” SMC topics include packaging trends, front-end materials, nanomaterials, solar market materials, and immersion lithography. SMC is the only materials-focused forum where industry professionals meet to discuss strategic and business concerns, market data and forecasts, and emerging business opportunities. The two-day conference is presented by SEMI.



Speakers include Chris Scanlan, vice president of Package Development at Amkor Technology; E. Jan Vardaman, president, TechSearch International; Karey Holland, senior managing partner, Techcet Group, LLC.; Rhone Resch, president, Solar Energy Industries Association (SEIA); Nabeel Gareeb

president and CEO, MEMC; Harry Levinson, manager of strategic lithography Technology, Advanced Micro Devices (AMD); Mark Thirsk. managing partner, Linx Consulting LLC; and John Cronin, managing director and chairman, ipCaptital Group.

Highlights include a panel discussion titled “Is the Semiconductor Industry a Good Investment for Materials Suppliers?,” and panelists include: Gerald Ermentrout, vice president and general manager, Electronics Division, at Air Products and Chemicals; Joanne Feeney, managing director, senior research analyst at FTN Midwest Securities Corporation Research; Jim Harrison, director, Global Fab Material at Intel FMO; Donald Lu, executive director Asia-Pacific Investment Research at Goldman Sachs; Stephen Buchwalter, senior manager of Packaging Technology at the IBM Thomas J. Watson Research Center; and Bill Noglows chairman, president and CEO of Cabot Microelectronics Corporation. The panel will be moderated by Carl Johnson of INFRASTRUCTURE. To register or for more information, including an updated conference schedule, visit www.semi.org/smc or call SEMI Customer Service at 1.408.943.6901. Discount registration fees are available for attending both SMC and the SEMI Industry Strategy Symposium (ISS), also held at The Ritz-Carlton, January 7-10.

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.

ASSOCIATION CONTACT:

Scott Smith/SEMI

Tel.: 408.943.7957

E-mail: ssmith@semi.org

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