SEMICON West TechXPOT Offers Focus on Test, Assembly and Packaging Technologies


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SEMICON WEST 2006 TECHXPOT OFFERS SPECIAL FOCUS ON TEST, ASSEMBLY AND PACKAGING TECHNOLOGIES

Special Exhibit Area Focused on new Technologies and Market Opportunities in Test, Assembly and Packaging at SEMICON West 2006 July 11-13

SAN JOSE, Calif. – May 3, 2006 – SEMI today announced additional details for its upcoming Test, Assembly and Packaging TechXPOT, located in West Hall Level 2 of the Moscone Center during SEMICON West 2006, July 11-13 in San Francisco. Building on the “show-within-a-show” concept, the Test, Assembly and Packaging TechXPOT is a special area focusing on innovations in test, assembly and packaging, with exhibits, displays and exhibitor presentations on the topic. In addition, the Test, Assembly and Packaging TechXPOT will feature presentations from select winners of the fourth annual Technology Innovation Showcase (TIS), as well as two detailed roadmap sessions.

In a continuous effort to build a stronger and higher quality curriculum, SEMI has partnered with leading industry associations and companies including FSA, the International Electronic Manufacturing Initiative (iNEMI), the Microelectronics Packaging and Test Engineering Council (MEPTEC) and TechSearch International to create the Test, Assembly and Packaging TechXPOT at SEMICON West 2006.

“Many major IC device manufacturers call the U.S. home for their research and development facilities. Because of this, test, assembly and packaging is becoming an increasingly strategic consideration, and therefore, a fundamental element of SEMICON West 2006,” said John Ellis, senior director of standards, technology and market research, SEMI. “With this in mind, the Test, Assembly and Packaging TechXPOT offers the perfect forum for showcasing innovative new technologies, networking and discussing market trends.”

A dedicated display area will feature examples of the latest packaging technologies. Additionally, the TechXPOT will house a stage for TIS winners and select exhibitors to present technical content and solutions. Sessions include: test roadmaps and design for test, organized by SEMI; user packaging roadmaps, organized by MEPTEC; fabless roadmaps, organized by FSA; and a lead-free seminar, organized by iNEMI and TechSearch International. Additionally, buses from SEMI headquarters located in San Jose will be available for attendees who would like to attend SEMICON West. The shuttle is free, however registration will be required.

Topics for the first of the two Test, Assembly and Packaging sessions include: Drivers and Challenges for Packaging of Next Generation FPGAs, featuring Tarun Verma, director of packaging technology at Altera; ASICs Packaging Roadmap, featuring Maniam Alagaratnam, vice president of package development at LSI Logic; Critical Package Requirements for Advanced Manufacturing Flow, featuring Bo Chang, packaging engineering director at Cypress; and Mil-Aero Electronics, featuring Tom Clifford, advanced packaging director at Lockheed Martin.

The second Test, Assembly and Packaging session will cover: Modeling for Material Sets in Semiconductor Packaging Assembly, featuring Jack Zhang, Ph.D., materials scientist at Henkel Corporation; Impact of Application Surface on the Development of TIMs, featuring Devesh Mathur, director of global technology at Honeywell; Electronic Packaging Materials, featuring Jonathan Harris, president of CMC Interconnect Technologies; and a Global Semiconductor Packaging Materials Outlook, featuring Dan Tracy, senior director of industry research & statistics at SEMI.

The TechXPOT will house the TIS winners from the test, assembly and packaging markets. TIS winners in test, assembly and packaging are jury-selected for their relevance to the industry, and represent the highest level of innovation in their respective fields. Winners for 2006 include Advanced Material Sciences, Inc. (AMS), Aguila Technologies, Deep Photonics, ICOS Vision Systems, Microbonds, Inc., Segin Semiconductor Solutions, Synova SA and Xradia, Inc.

For more information about the Test, Assembly and Packaging TechXPOT, and SEMICON West 2006, please visit www.semi.org/semiconwest.

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (California), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.

ASSOCIATION CONTACT:

Scott Smith/SEMI
1.408.943.7957
ssmith@semi.org

John Ellis/SEMI
1.512.241.4075
jellis@semi.org