SEMICON China set for March 21-23 in Shanghai

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Exposition Includes Seminars and Workshops Covering EHS, Finance, IC Design, Standards and Nanotechnology

SHANGHAI, China – February 28, 2006 – Online visitor registration is available for SEMICON China 2006, the three-day exhibition and technical symposium focusing on semiconductor full supply chain manufacturing technology. The exposition returns March 21-23, 2006 to the Shanghai New International Expo Center (SNIEC), which is located in the center of the high-tech manufacturing center of Pudong. The expo is presented by SEMI and co-located with electronica and ProductronicaChina.

Launched in 1988, SEMICON China has become the largest and most comprehensive exhibition and technical conference dedicated to semiconductor manufacturing technology in China.

Featuring more than 1,118 companies from 19 countries, occupying more than 1,822 booths in 16,398 square meters of exhibit space, SEMICON China is the largest exposition in China to showcase new and innovative equipment, materials and technology used to make advanced semiconductors. In addition to the three exhibition days, SEMICON China 2006 will feature technical and market briefing programs focusing on the latest trends in semiconductor and flat-panel display manufacturing.

“With renewed spending in the regional semiconductor industry, SEMICON China 2006 is attracting great interest with a full range of offerings, resulting in the most comprehensive and successful SEMICON China event to date,” said Mark Ding, president of SEMI China. “In addition to the already extensive exposition curriculum, there are a variety of in-depth technical programs, the SEMI International Standards Workshop and the first IC Design Suppliers Pavilion.”

The inaugural IC Design Suppliers Pavilion, co-hosted by FSA, SEMI and SICA, will be held in conjunction with SEMICON China 2006, and will host 120 booths featuring semiconductor suppliers that offer products and services to the IC design industry. Primary areas of focus within the IC Design Suppliers Pavilion include assembly/packaging, burn-in/test/failure analysis, business information systems, consulting/research, design software and management systems, equipment, foundry, IP, photomask and supply chain management.

The SEMI Technical Symposium (STS) is organized under the direction of a SEMICON China Technical Program Committee, chaired by Youfan Liu, program manager, Metrology and Equipment Development, Assembly Capital Development, Intel Corporation. The symposium offers a thorough Back-end technology overview in sessions covering a wide range of topics within the packaging and test technology arenas.

The SEMI International Standards Workshop, being held on March 21, will provide an overview and discussion on topics including material terminology, standardized technology for advanced mask fabrication, accessory service for electrical gas products and an introduction to SEMI Nano and MEMS Standards Activities. Speakers taking part in the standards workshop include experts from SEMI, Materials & Metrology, The Institute of Microelectronics of Chinese Academy of Sciences, The Southwest Research & Design Institute of Chemical Industry and the Beijing Institute if Chemical Regents.

A full day session on Environmental Stewardship and Safety in China and Emerging Markets on March 21 will host speakers from Applied Materials, SMIC, Intel etc., who will cover key topics such as ergonomics, EHS performance, facilities management and Silane safety.

SEMI, along with CASPA and FSA will host two separate sessions of design programs in conjunction with the FSA International Collaboration Series at SEMICON China 2006 on March 21. This event will offer up-to-date information on design tools and technologies. There will be a number of featured speakers from Marvell, Cadence, Synopsys, TSMC, etc., representing fabless, equipment, foundry, EDA and IP companies.

The Semiconductor Market Forum will be held on March 22, and is co-organized by SEMI and FSA. Distinguished speakers include industry leaders from Qualcomm, TSMC, Novellus and Advantest.

In conjunction with the ECS, SEMI will once again host the ITSC, which runs concurrently with SEMICON China 2006. Topics covered include advanced processing, manufacturing science, reliability, device physics and modeling, chemical mechanical polishing and photolithography.

Additional information regarding SEMICON China 2006 programs is available on the SEMI Website at, or by calling SEMI (in Shanghai) at +86.21.6448.5666.

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit


Scott Smith/SEMI
Tel: 1.408.943.7957

Mark Ding/SEMI
Tel: 86.21.6448.5666