TSMC CEO RICK TSAI TO KEYNOTE 10th SEMICON TAIWAN
Programs include CEO Forum, IC Packaging Summit, Keynotes and MEMS Forum
TAIPEI, Taiwan, August 30, 2005 -- SEMICON Taiwan 2005, which opens at the Taipei World Trade Center on September 12, features a wide range of business and technical programs, including a CEO Forum, IC Packaging and Test Summit, Technology & Market Trends Forum, and MEMS Forum.
The event is organized by SEMI, co-sponsored by the Taiwan External Trade Development Council (TAITRA), and endorsed by the Taiwan Semiconductor Industry Association (TSIA). This year marks the 10th anniversary of SEMICON Taiwan.
The opening ceremony on September 12 will feature a keynote address by Rick Tsai, CEO of Taiwan Semiconductor Manufacturing Co. Other guests at the ceremony will include Stan Myers, president and CEO of SEMI, C.J. Hsu, chairman of TAITRA, and Frank Huang, chairman of the TSIA.
The CEO Forum, taking place after the opening ceremony, features Tsai from TSMC, Steve Newberry, CEO of Lam Research, Jerry Cutini, CEO of Aviza Technology, and Frank Huang, chairman of Powerchip Semiconductor.
The SEMI Technology & Market Trends Forum on September 12 provides forecasts and analysis for the semiconductor device and equipment and materials sectors. The forum keynote will be given by John Kispert, executive vice president and CFO of KLA-Tencor Corp.
Other speakers at the Market Forum include Lung Chu, president of Asia Pacific field operations for Cadence Design Systems, speaking on the global IC design chain; George Burns, president of Strategic Marketing Associates, addressing fab capacity and investment trends; and Dan Tracy, senior director of industry research and statistics for SEMI, covering the semiconductor equipment and materials outlook.
The IC Packaging and Test Summit on September 13 will feature a keynote by Tien Wu, president of Americas and Europe, worldwide marketing and sales for ASE Group.
The summit will include a panel discussion moderated by F.J. Wu, president of Chipbond. Panelists include Eelco Berman, senior vice president of Amkor Technology, Gregory Lin, president of ASE Materials, Wun-Yan Chen, a manager with ERSO/ITRI, C.Y. Huang, senior vice president of Siliconware Precision, Jan Vardaman, president of TechSearch, and Shaulong Chin, president of Ardentec.
The SEMI Technology Symposium (STS) on September 13 includes a process technology session with speakers from TSMC, ECI Technology, UMC, and Cadence Design Systems. Topics include advanced CD-SEMs control, monitoring of wet processing chemicals, advanced e-beam inspection, design for manufacturing, and 65nm yield enhancement
The STS packaging and testing technology session features speakers from Dow Chemical Company, Atotech, EV Group, Agilent Technologies, and Credence Systems. Topics covered include new materials for display and packaging applications, flip chip technology, advanced wafer level process technologies, testing of digital consumer ICs, and modular multi-site test systems.
SEMI International Standards will host two events on September 14: the Taiwan Information & Control Committee Meetings and the Taiwan EHS Working Group meetings.
A MEMS Forum, also on September 14, features a keynote address titled “The Integration of MEMS and CMOS”, presented by Claire Chen, manager of mainstream technology marketing at TSMC. Presentations are also scheduled from George Yokoi, senior manager of MEMS business development, Olympus Corporation, Benedetto Vigna, director of the MEMS Development Unit, STMicroelectronics, Chun-Hsun Chu, director of MEMS programs for ERSO/ITRI, and Jean-Christophe Eloy, general manager of Yole Development.
The MEMS Forum will conclude with a panel discussion on “Future MEMS Manufacturing Business Models”, moderated by Christian Schaefer, senior vice president of sales, EV Group.
For more information regarding SEMICON Taiwan 2005, visit www.semi.org/semicontaiwan.
SEMI is a global industry association serving companies that develop and provide manufacturing technology, materials and services to make semiconductors, flat panel displays (FPDs), micro-electromechanical systems (MEMS) and related microelectronics. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org.
Irene Yu/SEMI Taiwan