Call for Papers Now Open For SEMICON Europa 2006 Programs
Topic Areas Include Manufacturing Test, MEMS and IC Packaging
Brussels, Belgium, August 23, 2005 -- Original papers in the areas of manufacturing test, MEMS and IC packaging are being sought for inclusion in the technical programs at SEMICON Europa 2006, to be held at the International Congress Center, Munich, Germany, from April 3-7, 2006.
Papers are being solicited for the 8th European Manufacturing Test Conference (EMTC), the International MEMS/MST Industry Forum and the Advanced Packaging Conference.
Abstracts of between 200 and 400 words and brief (100 word) speaker biographies are due October 10. Selected presenters will be advised by December 12.
Submissions are welcome from all persons directly or indirectly involved in the semiconductor industry, including IC manufacturers, academic research institutes, equipment manufacturers and materials suppliers. SEMI in particular encourages applications related presentations, i.e. covering joint projects between users and suppliers. Papers should be non-commercial and focus on the technical/economical merits of a process rather than on individual company product benefits.
For further information, including submission requirements and a complete list of topic areas, visit:
Alternatively, contact Johanna Turpeinen, SEMI Europe, at +32 2 289 64 96.
SEMI is a global industry association serving companies that develop and provide manufacturing technology, materials and services to make semiconductors, flat panel displays (FPDs), micro-electromechanical systems (MEMS) and related microelectronics. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org.
Vincent Dubois/SEMI Europe