CALL FOR PAPERS FOR SEVENTEENTH ANNUAL IEEE/SEMI
ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE
Abstract Deadline: September 22, 2005; ASMC 2006 to be held in Boston, May 22-24
SAN JOSE, Calif., July 5, 2005 -- Abstracts for paper presentations are now being accepted for the seventeenth Annual Advanced Semiconductor Manufacturing Conference and Workshop (ASMC) to be held May 22-24, 2006, in Boston, Massachusetts. The deadline for submitting abstracts is September 22, 2005.
ASMC 2006 is co-sponsored by SEMI®, IEEE, Electron Devices Society (EDS), IEEE Components, Packaging and Manufacturing Technology Society (CPMT). MICRO and Semiconductor Manufacturing Magazine are the media partners for ASMC 2006.
Presentations on original, non-commercial and non-published works are being solicited in the following areas: advanced processes & materials; advanced process control; contamination free manufacturing (CFM); cost reduction, equipment reliability and productivity; discrete and power devices; defect inspection; factory automation and factory dynamics; environmental, health and safety; human resources management and development; industrial engineering; MEMS technology; lithography advances and challenges; time-to-market; yield enhancement and modeling and 300 mm manufacturing.
All presented papers will be considered for the ASMC 2006 Toppan Photomasks, Inc. Best Paper Award, which will be announced following the conference and presented at ASMC 2007.
Papers authored by an individual student or group of students will receive special consideration for the 2006 ASMC—ISMI Outstanding Student Paper competition. The paper may be co-authored by a professor or industry associate, and must follow all ASMC manuscript guidelines. The presentation must be given by a student(s). The student must register for and attend the conference. Students who wish to be considered for this monetary award should include a statement of interest with the abstract submission.
Subject matter experts interested in leading a lunch time roundtable discussion with industry peers should submit a proposal for the topic, target audience and benefits to the attendees.
For more information about the conference or submitting abstracts, including guidelines and requirements, please visit http://www.semi.org/asmc, or contact Margaret Kindling, SEMI Programs, at 1.202.289.0440 or email@example.com.
SEMI is a global industry association serving companies that develop and provide manufacturing technology, materials and services to make semiconductors, flat panel displays (FPDs), micro-electromechanical systems (MEMS) and related microelectronics. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org.
Margaret Kindling/SEMI Programs