SEMI Publishes 13 New Technical Standards


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SEMI PUBLISHES 13 NEW TECHNICAL STANDARDS

Documents Cover Metrology, Substrate Mapping and Safety Guidelines

San Jose, Calif., June 13, 2005 -- SEMI has published 13 new technical standards applicable to the semiconductor, flat panel display (FPD) and MEMS manufacturing industries. The new standards, developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org.

SEMI Standards are published three times a year. The new standards, part of the July 2005 publication cycle, join more than 700 standards that have been published by SEMI during the past 32 years.

Included in the new standards are specifications and guidelines for ellipsometer equipment for use in integrated metrology, sensor/actuator network communications, silicon carbide wafers, and safety in multi-employer work areas.

"SEMI is pleased to announce this new round of specifications designed to reduce production costs and speed time-to-market for the semiconductor and FPD industries," said Bettina Weiss, SEMI director of International Standards and MEMS. "The standards encompass a broad range of technical areas, highlighting the diverse nature of the SEMI International Standards program."

The new standards released today include:

E139.1
XML Schema for the RaP PDE

E141
Guide for Specification of Ellipsometer Equipment for Use in Integrated Metrology

E142.1
XML Schema for Substrate Mapping

E54.16
Specification for Sensor/Actuator Network Communications for LonWorks

E54.17
Specification of Sensor/Actuator Network for A-LINK

F99
Dimensional Specification of a Diaphragm Valve for a Metric PFA Tube

F100
Compliance Test Method for Minimum Flow Coefficient of Diaphragm Valve for Metric PFA Tube

M55.2
Specification for 76.2 mm Round Polished Monocrystalline 4H and 6H Silicon Carbide Wafers

M61
Specification for Silicon Epitaxial Wafers with Buried Layers

PR9
Proposed Guide for Standard Fluidic I/O Design, Fabrication, and Assembly in Microscale Fluidic Systems

S24
Safety Guideline for Multi-Employer Work Areas

T14.1
Specification for the Micro ID of Short Vertical Dimension on 300 mm Wafers

T15
General Specification of Jig ID: Concept

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). About 1,100 volunteers worldwide participate in the program, which is made up of 17 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.

SEMI is a global industry association serving companies that develop and provide manufacturing technology, materials and services to make semiconductors, flat panel displays (FPDs), micro-electromechanical systems (MEMS) and related microelectronics. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Singapore, Tokyo, Shanghai and Washington, D.C. For more information, visit SEMI at www.semi.org.

ASSOCIATION CONTACTS:

Bettina Weiss/SEMI
Tel: 1.408.943.6998
E-mail: bweiss@semi.org

Jonathan Davis/SEMI
Tel: 1.408.943.6937
E-mail: jdavis@semi.org