SEMI Publishes 19 New Technical Standards


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SEMI PUBLISHES 19 NEW TECHNICAL STANDARDS

Documents Cover Data Collection, Safety, Common Terminologies

San Jose, Calif., February 7, 2005 -- SEMI has published 19 new technical standards applicable to the semiconductor and flat panel display manufacturing industries. The new standards, developed by technical experts from equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format or can be downloaded from the SEMI website, www.semi.org.

SEMI Standards are published three times a year. The new standards, part of the March 2005 publication cycle, join more than 705 standards that have been published by SEMI during the past 31 years.

Included in the new standards are specifications and guidelines for gases such as argon, hydrogen and nitrous oxide; specifications for sensor/actuator network communications; provisional specifications for SOAP binding for equipment self descriptions; and a guide for the reuse and treatment of water in semiconductor manufacturing.

“SEMI is pleased to release these new specifications designed to improve cost and time-to-market efficiencies for the semiconductor and FPD communities,” said Bettina Weiss, SEMI’s director for International Standards and MEMS. “The development of standards is an important step towards increasing productivity and opening the door for business opportunities around the globe.”

The new standards released today include:

SEMI C56-0305
Specification and Guidelines for Dichlorosilane (SiH2C12)

SEMI C57-0305
Specification and Guidelines for Argon

SEMI C58-0305
Specification and Guidelines for Hydrogen

SEMI C59-0305
Specification and Guidelines for Nitrous Oxide (N20)

SEMI D41-0305
Measurement Method of SEMI Mura in FPD Image Quality Inspection

SEMI D42-0305
Specification for Ultra Large Size Mask Substrate Case

SEMI E54.14-0305
Specification for Sensor/Actuator Network Communications for Profinet

SEMI E54.15-0305
Sensor Actuator Network Communication Specification for SafetyBUS p

SEMI E125.1-0305
Provisional Specification for SOAP Binding for Equipment Self Description (ESDS)

SEMI E132.1-0305
Provisional Specification for SOAP Binding for Equipment Client Authentication and Authorization (ECA)

SEMI E134.1-0305
Provisional Specification for SOAP Binding of Data Collection Management (DCM)

SEMI E138-0305
XML Semiconductor Common Components

SEMI E139-0305
Specification for Recipe and Parameter Management (RaP)

SEMI E142-0305
Specification for Substrate Mapping

SEMI F97-0305
Specification of Facility Package Integration, Monitoring and Control

SEMI F98-0305
Guide for Treatment of Reuse Water in Semiconductor Processing

SEMI M59-0305
Terminology for Silicon Technology

SEMI M60-0305
Test Method for Time Dependent Dielectric Breakdown Characteristics of SiO2 Films for Si Wafer Evaluation

SEMI S23-0305
Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment

The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays and micro-electromechanical systems (MEMS). Several hundred volunteers worldwide participate in the program, which is made up of 17 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.

SEMI is an international industry association serving companies participating in the semiconductor and FPD equipment and materials markets. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org

ASSOCIATION CONTACTS:

Bettina Weiss/SEMI
Tel: 1.408.943.6998
E-mail: bweiss@semi.org

Jonathan Davis/SEMI
Tel: 1.408.943.6937
E-mail: jdavis@semi.org

Following is more detailed information on the new standards published by SEMI:

SEMI C56-0305
Specification and Guidelines for Dichlorosilane (SiH2C12)

The purpose of this document is to provide a series of specifications for different grades of Dichlorosilane (SiH2C12) that are used in the semiconductor industry. Dichlorosilane is a flammable, corrosive, colorless liquid which hydrolizes in the presence of moisture. It oxidizes readily and rapidly to release hydrogen chloride.

SEMI C57-0305
Specification and Guidelines for Argon

The purpose of this document is to provide a series of specifications for different grades of Argon (Ar) that are used in the semiconductor industry. Argon is the most abundant member of the rare gas family. It is monatomic and is characterized by its extreme chemical inactivity.

SEMI C58-0305
Specification and Guidelines for Hydrogen

The purpose of this document is to provide a series of specifications for different grades of Hydrogen (H2) that are used in the semiconductor manufacturing process. Hydrogen vapors are highly flammable, colorless, tasteless, and nontoxic.

SEMI C59-0305
Specification and Guidelines for Nitrous Oxide (N20)

The purpose of this document is to provide a series of specifications for different grades of Nitrous Oxide (N20) that are used in the semiconductor industry. Nitrous oxide is an oxidizing, colorless, liquefied gas, with a vapor pressure of about 745 psig at 70°F.

SEMI D41-0305
Measurement Method of SEMI Mura in FPD Image Quality Inspection

The D41 standard defines the application of the formula derived in SEMI D31 to various test conditions for MURA in FPD image quality inspections, specifically those that cannot be performed visually. D31 has proposed a formula to detect defects and blemishes in flat panel displays using CCD based instruments instead of the human eye. The D41 standard is related to both the measurement method of Semu (a unit of MURA) and the revised definition of Semu. The target display size for this standard is typically from 8-inch (20.3cm) to 30-inch (76.2cm) diagonal.

SEMI D42-0305
Specification for Ultra Large Size Mask Substrate Case

D42 relates to the LCD mask manufacturing process, specifically the ultra large size mask substrate case. The FPD industry is rapidly moving towards the use of large size substrates, which necessitates the use of automatic substrate handling. A standardized mechanical specification for the mask substrate case is required in order to deliver cost reductions in the mask manufacturing process. This standard covers case specification for substrates used throughout FPD mask manufacturing process, from the silica glass substrate to the deposition process.

SEMI E54.14-0305
Specification for Sensor/Actuator Network Communications for Profinet

SEMI E54.14 (PROFINET) is an Ethernet based automation standard for communications within equipment and between equipment and facilities. It enables the operator to run optimized production with the benefit of online access.

Ethernet-based technologies are increasingly popular for enabling system-wide communication and for the distribution of control systems. However, the lack of real-time capabilities has hampered their use in field applications. This problem is addressed through PROFINET, which facilitates the implementation of distributed automation structures, the interfacing of decentralized field devices with the Ethernet, and the operation of motion control applications. In such instances, real-time applications and standard TCP/IP services, such as remote diagnostics, can be used at the same time.

SEMI E54.15-0305
Sensor Actuator Network Communication Specification for SafetyBUS p

The E54.15 safety-related fieldbus standard enables semiconductor manufacturers to maximise the benefits of safety technology by combining the safety fieldbus in programmable safety systems.

The SafetyBUS p protocol is well suited as an enabling technology for sensor bus safety applications within the semiconductor industry. SafetyBUS p is based on the deterministic CAN industrial networking protocol, and is inherently designed for safety.

SEMI compliance requires that a Network Communication Standard (NCS) in E54 supports the SEMI standardized device models (Common Device Model and Specific Device Models). This required the enhancement of the SafetyBUS p protocol specification to support the SEMI NCS and communication of SEMI device object data. This enhancement specification was developed as part of the standardization process and is available from SafetyBUS p Club International.

SEMI E125.1-0305
Provisional Specification for SOAP Binding for Equipment Self Description (ESDS)

E125.1 is related to general purpose equipment data acquisition for Fault Detection and Classification (FDC), run-to-run control, e-diagnostic, health monitoring, utilization tracking, and other applications.

The specification defines the SOAP implementation of E125, making it possible to discover at runtime the physical structure of the equipment, and specifically what data, events, exceptions, and objects are available for data acquisition from each component of the equipment.

The specification uses open software-industry-standard web services technology to improve efficiency in the process of integrating equipment data into engineering and other manufacturing applications. By leveraging industry-standard technologies, the specification broadens the commercial options available to users.

This specification is one in a suite of four specifications from SEMI focused on improving total equipment data throughput independently of the GEM interface. The development of this specification is a key enabler to achieving future FDC, R2R, e-Diagnostics, and OEE goals in manufacturing.

SEMI E132.1-0305
Provisional Specification for SOAP Binding for Equipment Client Authentication and Authorization (ECA)

E132.1 is related to general purpose equipment data acquisition for Fault Detection and Classification (FDC), run-to-run control, e-diagnostic, utilization tracking, and other applications.

This specification uses software-industry-standard authentication (SSL) and web service technologies to specify what applications in the factory are permitted to communicate with equipment. It will have its first application as part of the suite of specifications defining interfaces to enable secure, self-describing, high-throughput equipment data acquisition.

This specification provides the first level of protection against unauthorized access to factory equipment data, which is often sensitive or proprietary in nature. A key component in enabling the construction of secure e-manufacturing systems is the provision of access controls on the equipment.

E132.1 is included in a suite of four specifications focused on enabling secure, self-describing, high-throughput equipment data acquisition independently of the GEM interface. As in the case of E125.1, the development of this specification is a key enabler to achieving future FDC, R2R, e-Diagnostics, and OEE goals in manufacturing.

SEMI E134.1-0305
Provisional Specification for SOAP Binding of Data Collection Management (DCM)

E134.1 is related to general purpose equipment data acquisition for Fault Detection and Classification (FDC), run-to-run control, e-diagnostic, utilization tracking, and other e-manufacturing applications.

The specification defines the SOAP implementation of E134, which defines a standard interface for managing equipment data acquisition independently of the GEM interface, enabling higher-throughput data acquisition without compromising equipment run rates.

Many equipment suppliers are responding to the increased demand for better data access by providing additional data ports on a single tool, using a variety of communication protocols and data formats with varying latencies. Managing the integration of these interfaces on a tool-by-tool and supplier-by-supplier basis would be prohibitively costly in a high-volume production manufacturing facility. E134.1 helps reduce these costs by standardizing the interface and data formats used to collect data from equipment.

Equipment suppliers and device makers will also benefit by building process control and diagnostic applications and solutions based on access to detailed, high-throughput equipment data enabled by E134 implementations. These solutions can be used to streamline equipment support models, improve equipment designs, and increase tool and line yields.

SEMI E138-0305
XML Semiconductor Common Components

E138 is used in association with XML based communication interfaces. It defines the representation of the object error used to report any problems the application encounters while executing the requested service as defined in the Equipment Data Acquisition Standards.

It will be used as a placeholder for those objects and elements that are common to multiple XML based standards. As such, this document can be used with multiple specifications.

By using a generic document that can be pointed to by multiple documents, the users of XML technology do not have to comply with multiple standards that are not related to their specific problem.

SEMI E139-0305
XML Semiconductor Common Components

E139 (RaP) standardizes equipment support for recipe management. Included is the ability for the user to specify adjustable parameters for use by process control systems to optimize process conditions. E139 also provides process traceability, multi-part recipes, and recipe content documentation.

Current communication standards implementations include only primitive recipe management capabilities. As a result, most factories download recipes to the equipment each time they are used. This inefficient use of equipment time can also obstruct time sensitive control signals to the equipment. The users' ability to do process control is also limited by the lack of adjustable parameters.

Cost savings from the RaP standard will be realized in reduced equipment setup time, expanded support for process control, improved recipe identification and accessible content documentation, reduced recipe “hacking” errors (due to lack of adjustable parameters), and elimination of invalid recipes.

Current factories have workarounds for some of the problems addressed by RaP, so initial adoption into existing factories may be slow. However, all device makers are experiencing difficulties and some have had serious losses due to poor recipe management capabilities. This standard will provide significant value to semiconductor manufacturers in areas such as production support and advanced process control.

SEMI E142-0305
Specification for Substrate Mapping

E142 relates to final manufacturing, in particular wafer probe, bump inspection, die attach, wire bond, laser mark, strip test, singulation and final test. The standard permits the reliable exchange of substrate map data. Substrate map data includes bin codes, device IDs and substrate to substrate transfers.

IC manufacturers can now send maps in a standard format to test, assembly and packaging houses. Equipment in the final manufacturing line can share and modify the map data to reflect the processing applied to the substrates. In contrast, today there are approximately 350 map formats that must be delivered to equipment, often in proprietary formats. This represents a large development cost and more importantly is a significant source of processing errors.

This standard addresses the underlying complexity of units of production in the final manufacturing process. It provides a framework so that the advantages of automation, material tracking, adaptive process control, etc. can be realized in final manufacturing.

SEMI F97-0305
Specification of Facility Package Integration, Monitoring and Control

There is a need for communication standards that allow effective data exchange between the Facility Package Unit (FPU), the Facility Management and Control System (FMCS) and the MES. The lack of these standards means more effort is required in the design and construction phase of a factory, as well as during operation.

The F97 standard specifies the requirements of the architecture, common services, data and their semantic meaning in order to integrate FPUs (e.g. chemicals, cooling, power supply, access control) into the FMCS.

This standardization approach will be beneficial to FPU manufacturers, general contractors, end users and control system manufacturers, leading to a substantial cost reduction, faster delivery to ramp-up time, and optimized maintenance concepts.

SEMI F98-0305
Guide for Treatment of Reuse Water In Semiconductor Processing

The F98 guideline standardizes the types of water reuse and reclaim commonly used by wafer fabs. It outlines solutions in terms of equipment, technology, and operational approaches.

Reuse of water offers two major benefits: The first is to meet community requirements for water conservation, and the second is cost saving by reducing the overall quantity of water needed to run the factory. An additional benefit is that reused water can be of a higher purity than incoming water.

SEMI M59-0305
Terminology for Silicon Technology

M59 addresses a list of acronyms, definitions, and symbols related specifically to silicon wafer manufacturing and procurement. It combines terms that were previously in a variety of locations, including a number of ASTM standards and the SEMI polished silicon wafer specification (SEMI M1).

This effort is intended to make it simpler and more cost effective for users of silicon wafers to generate specifications with terms that both the suppliers and customers understand. In addition, the format of the specifications containing the properties defined in this standard is being standardized across the spectrum of available wafers.

SEMI M60-0305
Test Method for Time Dependent Dielectric Breakdown Characteristics of SiO2 Films for Si Wafer Evaluation

The time dependent dielectric breakdown (TDDB) test method for silicon wafers improves the accuracy of defect detection. The standardization of this test method provides fair evaluation results in the quality of silicon wafers, eliminating unnecessary testing and therefore reducing costs. With regard to semiconductor devices, the quality of the silicon wafer improves by using this test method. The yield and the performance of the device also improve.

SEMI S23-0305
Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment

The S23 document addresses the issue of how to achieve energy, utilities and materials conservation on semiconductor manufacturing equipment. This document is important because energy conservation is an effective means of achieving cost reduction in the operation of manufacturing equipment.