SEMICON Japan 2010 to Feature LED, MEMS, 3D Packaging
SEMICON Japan 2010 to Feature Next Generation Technology Pavilion Showcasing Latest Innovations in LED, MEMS, 3D Packaging Manufacturing
New co-location with Automotive Telecommunications Technology Tokyo event
TOKYO, Japan. – September 8, 2010– SEMICON Japan 2010, the world's largest exhibition for semiconductor manufacturing and related processing technology, will feature a "Next Generation Technology Pavilion" consisting of five focused exhibit areas, with manufacturing equipment, materials, and technologies for LED and MEMS manufacturing, nanoimprint technology, and 3D IC packaging innovations. Held December 1-3 at the Makuhari Messe in Chiba, Japan, SEMICON Japan 2010 will also co-locate with Automotive Telecommunications Technology Tokyo to bridge the gap between microelectronics and emerging automotive applications.
As the backdrop to this year’s event, the semiconductor industry is rebounding to one of its most successful years in history, including one of the largest increases in capital spending in over 20 years. Forecasts for the worldwide semiconductor market average growth of 30 percent and another 9 percent in 2011, finally pushing revenues to exceed $300 billion. SEMI forecasts Japan market sales of $4.70 billion for equipment and $9.05 billion for materials in 2011, up from only $2.23 and $7.60 billion, respectively, in 2009. Additionally, the region is estimated remain the largest market for semiconductor materials through 2011.
The Next Generation Technology Pavilion will showcase the latest developments and research in emerging technologies, including exhibitors from Nagoya University, Tohuku University, Tokyo Institute of Technology and other leading research institutions. The pavilion is supported by Japan Institute of Electronics Packaging, Japan LED Association (JLEDS), The Japan Society of Applied Physics (JSAP) and Japan Institute of Electronics Packaging (JIEP).
Automotive Telecommunications Technology Tokyo (ATTT) is the first international exhibition focused on automotive telecommunications systems, applications, and technologies. The exhibition will showcase the future role of telematics in vehicle transportation, safety, communications, and other areas.
Other new exhibition features at SEMICON Japan 2010 include a Secondary Equipment and Services Pavilion, showcasing equipment and services companies providing technologies and solutions for the secondary equipment market that is rapidly expanding in Asia.
SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Bangalore, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
Deborah Geiger/SEMI HQ
Expositions Department/SEMI Japan
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