SEMICON Europa 2010 to Focus on Latest Nano-Manufacturing Innovations

Bookmark and Share

SEMICON Europa 2010 to Focus on Latest Nano-Manufacturing Innovations

Event Serves as a Platform for Technical Advances, Business Strategy and Emerging Applications

Brussels, Belgium – August 24, 2010 – SEMI today announced the lineup of keynote speakers and program highlights for SEMICON Europa 2010, which takes places in Dresden, Germany from October 19-21. All of the European fabs will present at the event, including GLOBALFOUNDRIES, Infineon, Intel, STMicroelectronics and X-Fab, as well as leading R&D organizations in SEMICON Science Park.

SEMICON Europa features the most advanced and innovative electronics platform in Europe. Key segments addressed include: semiconductor front-end and back-end, MEMS/MST, and Secondary Equipment and Advanced Packaging. This year, for the first time, the Plastics Electronics Conferencewill be co-located with SEMICON Europa, which will include topics like organic electronics, displays, organic photovoltaics, and lighting.

Driving advancements in semiconductor and related industries requires industry professionals to exchange technical and market information. Forty-one programs and eventsare scheduled in conjunction with SEMICON Europa this year, including: 12 technology conferences, 13 free technology and standardization sessions, 4 executive and networking events and 12 technical courses. Eight keynote speakers are scheduled for SEMICON Europa, including:

  • Jiri Marek, Bosch, on “Trends for Automotive Micromechanical Sensors”
  • Rob Oreilly, Analog Devices, on “Monolithic to Multi Chip: Smart Partitioning Adds Customer Value”
  • Peter Robinson, CSR, on “System Design, Drives Package Design, Drives Silicon Design”
  • Leopold Beer, Bosch Sensortec, on “Revolution and Evolution of Consumer MEMS Applications”
  • Raimund Schwarz, Osram Opto Semiconductors, on “High-Brightness Phosphor Converted White LEDs – Challenges and Solutions”
  • Jean Chazelas, Thales, on “RF and Optoelectronic System Applications of Compound Semiconductors”
  • Robert Chau, Intel, on “III-V and III-V on Si for Future Nanoelectronics”
  • Andreas Fischer, Robert Bosch, on “Substitute Materials for High-Lead Solders”

Program highlights at SEMICON Europa include the 14th Fab Managers Forum, with sessions on Fab Automation and Control, Advanced Technologies, Secondary Equipment Technology and Services, Fab/Equipment Life Cycle Planning and more.

With more co-located events than previous years, SEMICON Europa will feature more advanced test and packaging technology than ever before. The 12th European Manufacturing Test Conference (EMTC) with the theme of “Mapping Digital Test and Diagnosis Approaches on the Emerging Integrated Analog Mixed Signal Arena” takes place at SEMICON Europa. Under the theme “Enabling Packaging Technologies for System Integration,” the Advanced Packaging Conference features sessions on: Packaging for Systems, Alternative Device Packaging, Embedded Wafer-Level Packaging, and Packaging and Materials. In addition, the International MEMS/MST Industry Forum features a theme of “MEMS Goes Everywhere!” with sessions on MEMS Applications, Manufacturing Strategies and Challenges, MEMS Technologies Process, and a Market Review.

Front-end semiconductor sessions include Materials, Automation and Process Control, Metrology, Lithography, Refurbished Equipment, and 450mm. The business programs include the traditional Market Briefing which will address the LED market in addition to semiconductor, MEMS and photovoltaic. The 4th Executive Summit will debate the topic, “Trends Changing the European Semiconductor Landscape: Are We at a Tipping Point?”

In addition, through a SEMI partnership with the Continuation Education Institute Europe, SEMICON Europa is offering 12 CEI-Europe technical courses.

“SEMICON Europa offers a wide range of programs that address Europe’s manufacturing issues and opportunities,” said Heinz Kundert, president of SEMI Europe. “This year’s event continues the transformation of SEMICON into a manufacturing communication platform through programs put together by committees of industry experts.” Sponsors for the event include: MAX, Multitest, TEL, Henkel, Nanium, and CEI.

For more detailed information about keynote speaker addresses, technical programs and short courses, or to register to attend the exposition, please visit

About SEMI

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit

Association Contacts

Carlos Lee

SEMI Europe / PV Group


Mobile: + 32.473.300433

Deborah Geiger

SEMI Headquarters


Phone: 408.943.7988

# # #