SEMI Announces Eight New Technical Standards
SEMI Announces Eight New Technical Standards
Documents Include Anti-Counterfeiting, Thin-Film PV, and 450 mm Wafers
SAN JOSE, Calif. – July 1, 2010 – SEMI has published eight new technical standards applicable to the semiconductor, MEMS, FPD and photovoltaic (PV) manufacturing industry. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available through the SEMIViews Standards product, available at: www.semi.org/semiviews.
The new standards, part of the July 2010 publication cycle, join more than 790 standards that have been published by SEMI during the past 36 years.
“Today’s release of these eight new SEMI International Standards covers a wide range of applications, including display, PV, and 450 mm wafers,” said James Amano, Director, SEMI International Standards. “These standards address issues that are active today, and those that will arise when and if the industry moves to larger-diameter silicon.”
The list of new SEMI Standards being released includes:
SEMI T20.3, Specification for Service Communication for Authentication of Semiconductors and Related Products;
SEMI E158, Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling;
SEMI M76, Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers;
SEMI D60, Test Method of Surface Scratch Resistance for FPD Polarizing Film and Its Materials;
SEMI E156, Mechanical Specification for 450 mm AMHS Stocker to Transport Interface;
SEMI E157, Specification for Module Process Tracking;
SEMI D59, 3D Display Terminology; and
SEMI PV4, Specification for Range of 5th Generation Substrate Sizes for Thin Film Photovoltaic Applications.
The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays, photovoltaic systems and micro-electromechanical systems (MEMS). More than 3,000 volunteers worldwide participate in the program, which is made up of 20 global technical committees. Visit www.semi.org/standards for further details about SEMI Standards.
SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
Editor’s Note: Following is detailed information about several of the new SEMI standards.
SEMI T20.3: Large quantities of semiconductor device products are distributed in the business world to be embedded into various electronics products such as television sets, computers, automobiles or their components, and so on. The electronic component supply network is frequently contaminated by counterfeit and tainted product. The risk of procuring contaminated goods increases when authorized (certified) distribution networks run out of product. This may occur with supply shortfalls or terminated products. Then, purchasing policy may also force procurement from non-certified distributors.
A product may be substituted by counterfeiting the item secretly anywhere in a chain of distribution. If the authentic products have specific identification, e.g., an unpredictable random code issued by some authentication organization, on them most (but not all) counterfeits can be detected anywhere in the distribution chain.
When authentication is practiced consistently at key points in the trade stream, and when it is left open for any party to participate, it drives unintended counterfeit purchases to a minimum in a way that can be deployed easily and relatively inexpensively in a wide variety of settings.
The semiconductor industry has lacked standardized methods to validate the integrity of goods from non-certified distributors or suppliers. The purpose of this specification is to describe the system architecture aspect of an authentication process to establish the trusted identity of products or objects.
This specification is one element of a suite of standards aimed at enabling automated, reliable, and secure product authentication for the semiconductor industry, thereby reducing the presence of illegal counterfeit items in the marketplace.
This specification provides any interested party (without restriction) the communication protocols to check the authentication of a product within the supply chain.
SEMI M76: Silicon process test wafers (or developmental wafers) are silicon wafers suitable to perform development and characterization of semiconductor fabrication processes and equipment. This document details wafer required properties by category to assist manufacturers in choosing the appropriate wafer type for a given application. For example, there are wafers used for development of lithographic and patterning equipment and processes, for furnace and thermal processes development, and for films, such as dielectrics and metals deposition. Material removal from the silicon wafers, particle measurement, and contamination effects resulting from subsequent fabrication processes can be studied.
Silicon wafer standards reduce product development cost by setting common technical specifications for equipment and silicon manufacturers. Process test wafer standards reduce development costs and enable availability of a uniform global wafer supply for R&D with lower investment. Use of a standard process test wafer reduces or even eliminates duplication of efforts and provides a common basis for new equipment characterization. Specifying wafers by category assists manufacturers in choosing the most cost effective wafers for a given application
SEMI E156: SEMI standard E156 relates to the storage and transport of 450 mm FOUP (wafer carrier) in a semiconductor factory. Several suppliers will design the stocker and any type of AMHS systems in a semiconductor factory. SEMI Standard E156 provides the dimensional interface between the stocker and any type of AMHS systems. It allows for interoperability among any type of products supplied by different suppliers.
When the stocker and the AMHS system are designed based on SEMI Standard E156, suppliers and customers can save the time to discuss the interface specification between the stocker and the AMHS system. This allows for suppliers to focus on product design and verification and reduces the cost and time for a customer to qualify a product.
As the semiconductor industry transitions to 450 mm, the development of the standardized the stocker interface to the AMHS system requires global cooperation. As an international effort, SEMI standard E156 allows AMHS and carrier suppliers to efficiently collaborate on the development of 450 mm FOUP storage and transportation systems for semiconductor factories. By standardizing the interface dimensions of the stocker and the AMHS systems, SEMI E156 signifies faster product qualification which will lead to better factory integration and lower cost of ownership.
SEMI E157: More and more detailed process information is required to enable fabs to continue to evolve product technologies and manufacturing efficiencies. The front-end process equipment in 300 mm fabs uses “recipes” to control wafer processing. In the past it was sufficient for the fabs to associate the process data and results with the recipe as a whole. The next generation of process advancements requires a more granular view of the process execution. These recipes are typically defined as a set of small execution “steps”. Recipe definitions vary widely across different equipment types and the reporting of process data and results during recipe execution varies widely as well. This variation makes it extremely complicated to analyze data from recipe to recipe, equipment to equipment or across equipment types. This new software standard provides a common paradigm for equipment to report data associated with recipe step execution without requiring equipment to change existing recipe definitions.
This is a small step toward defining a common process recipe model. Automated process control (APC) solutions are much more complex and expensive because of the variability in the ways the equipment allows the factory automation systems to affect changes in the process parameters and recipe execution. Reducing this variability makes APC solutions much more cost effective. Better APC solutions will allow manufacturers to more quickly release new technologies and improve efficiencies to reduce costs.
SEMI D59: This terminology standard is directly related to the FPD supply chain as well as retail and their consumers. 3D display is being commercialized very quickly. However, there were many terminologies related to 3D displays that were not clearly defined. Communication problems happen often. SEMI D59 defines the basic and most necessary terms of the 3D display (especially for those different from 2D displays). In addition, establishment of other related terminologies will follow later.
After the 3D display terminology becomes an international standard, the parties in the supply chain do not need to spend unnecessary effort and cost to explain them to their consumers and suppliers. Only when the terminology is defined may a 3D display measurement method be established.
FPD-based 3D displays (both with and without special glasses) are becoming more and more important. However, there are many terms related to 3D displays which are not clearly defined. This causes communication problems between parties in the supply chain. Therefore, standardization of 3D display terminology will accelerate industry development.
SEMI PV4: The thin film photovoltaic industry now uses varying substrate sizes. It is commonly said that unification of the substrate into one size is difficult, considering variation of usage and handling of the panel, and so on. From an equipment standpoint, developing equipment for all the substrate size variation is a big waste for the industry.
The expectation is that this standard will reduce equipment (including AMHS) cost, improving time to market, and making wider opportunity of the selection of equipment by giving a guideline on range of substrate size. This standard may also be a reference for transportation of panels as well as installation at the final site.
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