Leading Technologists to Examine Semiconductor Manufacturing Industry Challenges at ASMC 2010
Conference Will Feature Industry Leader Keynotes
and 70+ Peer-Reviewed Manuscript Presentations
SAN JOSE, Calif. – May 19, 2010 – The 21st Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2010) will be held July 11-13 at the San Francisco Marriott Marquis in conjunction with SEMICON West 2010 in San Francisco, California. The conference will feature presentations of more than 70 peer-reviewed manuscripts covering critical process technologies and fab productivity.
For over 20 years, ASMC has filled a significant need in the semiconductor industry by providing a venue for industry professionals to network, learn and share knowledge on new and best method semiconductor manufacturing practices and concepts. ASMC is a leading conference that enables collaboration and sharing of technical breakthroughs that provide a valuable source of cost-effective, hands-on solutions to address real-world manufacturing challenges.
This year’s conference features keynotes delivered by industry leaders, including:
Matt Nowak, director of Engineering, VLSI Technology Group, Qualcomm:
“High-Density 3D Through Silicon Stacking – Manufacturing Readiness and Challenges”
- Kelin Kuhn, Intel Fellow; director, Advanced Device Technology, Intel: “CMOS Transistor Scaling Past 32nm and Implications on Variation”
- Bill McClean, president, IC Insights: “Analyzing the IC Market Upturn”
In addition, the conference will offer 10 unique sessions highlighting key topics including:
- Advanced Metrology
- Advanced Process Control
- Advanced Processes and Materials
- Contamination Free Manufacturing
- Defect Inspection I & II
- Design for Manufacturing and Lithography
- Fab Optimization
- Reducing Cost and Maximizing Equipment Productivity
- Yield Enhancement/Methodologies I & II
- Plus an Interactive Poster Session
Conference participants can expect to develop insights and relationships which accelerate innovation, promote successes, and provide a more thorough understanding of standards and benchmarks.
ASMC opens the evening of July 11 with an Interactive Poster Session combined with a Welcome Reception. This initial session offers networking opportunities between authors and conference attendees. During this interactive session, papers will be presented on topics such as Automated Equipment Modeling, High-k/Metal Metrology Methodology, and Yield and Performance Optimization.
ASMC 2008 is presented by SEMI and the IEEE. The 2 ½-day conference is co-sponsored by the IEEE Electron Devices Society (EDS), IEEE Components, Packaging and Manufacturing Technology Society (CPMT), and IEEE Technical Committee on Semiconductor Manufacturing (SMA). Corporate sponsors include Applied Materials, Linde, KLA-Tencor, Nikon, Synopsys, and Tegal.
Online registration for ASMC 2010 is now available at http://www.semiconwest.org/SessionsEvents/ASMC/index.htm. For more information, please visit the website, contact Margaret Kindling at firstname.lastname@example.org or phone 1.202.289.0440. Qualified members of the media should contact Steve Buehler, SEMI Public Relations, at email@example.com for media registration information.
For complete details on SEMICON West 2010 – including exhibition opportunities, the schedule of events, session agendas, and speaker information – please visit the SEMICON West website at www.semiconwest.org.
SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
Steve Buehler SEMI