Packaging Material Supplier Landscape Shifting ─ Reshaping Both Technology and Market Trends

Packaging Material Supplier Landscape Shifting ─ Reshaping Both Technology and Market Trends

Sign up now for the SEMI Webinar on January 20-21

Constrained industry growth and the trend towards lower-cost electronics have reshaped the packaging material supplier landscape. Changes in material sets, the emergence of new package types, and cost reduction pressures have resulted in recent consolidation in various material segments. In addition, materials consumption in some segments is declining given the changes in package form factors and the trend towards smaller, thinner packaging.

Source: SEMI Industry Research and Statistics, December 2015

With technologies advancing and the demand of miniaturization of the packaging form factor requirements, the $18 billion semiconductor packaging materials market will undergo steady single-digit unit value growth for many materials segments through 2019.  SEMI is offering a complimentary webinar on January 20 and 21 to discuss the latest technology and market trend in semiconductor packaging.  To register for this event, please click here.

In the webinar, Jan Vardaman of TechSearch International and Dr. Dan Tracy of SEMI examine the impact of packaging technologies on the materials market. The complimentary webinar will cover:

  • The shift in the type of packages required for mobile products (still the growth driver for unit volumes.
  • Fan-out wafer-level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry and the consumption of semiconductor packaging materials in the coming years
  • Overview of trends and issues in the various packaging material segment

Topic on Substrates, Underfill, and WLP dielectric
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided analysis on technology and market trends in semiconductor packaging since 1987.

Topic on Leadframes, Bonding Wire, Die Attach, and Mold Compounds

Dr. Dan P. Tracy is responsible for developing and executing the global strategy for SEMI industry research and statistics products and services. In addition, Dr. Tracy is also responsible for managing market statistics partnerships globally.

The webinar covers some of the key information from the recently published Global Semiconductor Packaging Materials Outlook 2015 to 2019 report

 

Global Update
SEMI
www.semi.org
January 12, 2015