Packaging Material Supplier Landscape Shifting ─ Reshaping Both Technology and Market Trends
Sign up now for the SEMI Webinar on January 20-21
Constrained industry growth and the trend towards lower-cost electronics have reshaped the packaging material supplier landscape. Changes in material sets, the emergence of new package types, and cost reduction pressures have resulted in recent consolidation in various material segments. In addition, materials consumption in some segments is declining given the changes in package form factors and the trend towards smaller, thinner packaging.
Source: SEMI Industry Research and Statistics, December 2015
With technologies advancing and the demand of miniaturization of the packaging form factor requirements, the $18 billion semiconductor packaging materials market will undergo steady single-digit unit value growth for many materials segments through 2019. SEMI is offering a complimentary webinar on January 20 and 21 to discuss the latest technology and market trend in semiconductor packaging. To register for this event, please click here.
In the webinar, Jan Vardaman of TechSearch International and Dr. Dan Tracy of SEMI examine the impact of packaging technologies on the materials market. The complimentary webinar will cover:
- The shift in the type of packages required for mobile products (still the growth driver for unit volumes.
- Fan-out wafer-level packaging (FO-WLP) is a disruptive technology that will have a significant impact on the electronics industry and the consumption of semiconductor packaging materials in the coming years
- Overview of trends and issues in the various packaging material segment
Topic on Substrates, Underfill, and WLP dielectric
Topic on Leadframes, Bonding Wire, Die Attach, and Mold Compounds
The webinar covers some of the key information from the recently published Global Semiconductor Packaging Materials Outlook 2015 to 2019 report
January 12, 2015