Semiconductor Processing Technology (SPT)

Semiconductor Processing Technology (SPT)

September 16-18, 2008

SEMI Headquarters, 3081 Zanker Road, San Jose, CA
For directions to SEMI Headquarters, click here.

To register, click here.

Instructor:

Peter S. Gwozdz, Ph.D.


Dr. Peter Gwozdz, an industry consultant, was the Director for the Center for Electronic Materials at San Jose State University from 1988 to 2003. From 1980 to 1988, he was at AMD, where he was a Director of Bipolar Technology Development. He has over 15 years of industry experience in process sustaining and development at Silicon Valley semiconductor companies and holds a Ph.D. in physics from the University of Illinois on defects in silicon.

During the three days hours of the course will be 8:30am-4:30pm. Continental breakfast and lunch are provided each day.

Having an understanding of semiconductor processing technology is a must. To measure the downstream impact of equipment and materials problems, you need to know the fundamental steps in the process, from front end through final test. You need to be familiar with each step so you can support your customers and their problems.

This course covers semiconductor processing technology in detail, in a language you can understand. The course instructor presents the basics of wafer manufacturing for integrated circuit technology. To round out the picture, this seminar briefly ties in testing and packaging technology, device physics, CMOS transistor explanation, memory and logic, factory management, microcontamination, yield and much more. In-class team assignments enable you to practice what you learn. SEMI instructional videos are shown each day to help you visualize the wafer fab environment.

This is an introductory course with adequate time for questions. If you are new to the industry, you will feel comfortable asking the instructor to repeat things that you do not understand. You may have very specific technical questions about how your products relate to other parts of the wafer fab; the instructor, with two decades of hands-on engineering experience, enjoys taking the time to answer all of your questions. You may not understand all the technical answers to questions asked by others, but you will appreciate hearing the “buzz words” associated with the products that are produced by the other participants.

This course has been held at SEMI expositions and “in-house” at member companies since 1993. The course workbook is continuously updated with equipment photographs as samples of modern wafer manufacturing practice.

You Will Learn:

  • How to recognize key pieces of fab equipment
  • How this equipment works
  • How this equipment fits into the grand scheme of "Silicon Magic"
  • How your equipment and materials fit into the big picture
  • What happens to ICs if your products are not working right
  • Case studies of actual problems due to equipment and materials issues

Who Should Attend:


Field service engineers, equipment maintenance personnel, sales, finance, marketing personnel, managers and others who do not have extensive formal training in semiconductor technology. Companies of any size will benefit by sending employees to this course.

Course Outline:


Day 1: Overview

 
  • Wafers, chips and boards
  • Silicon planar technology
  • Wafer fab overview
  • Examples of fab equipment
  • Cluster tools
  • Downstream problems; case studies
  • Packaging overview
  • Introduction to transistors
  • CMOS
  • Damascene copper
  • Roadmap
  • Memories

Day 2: Wafer Fab Modules

 
  • Wafer Manufacture
  • Oxidation
  • Photolithography
  • Etch
  • Doping
  • Diffusion
  • Ion implantation
  • CVD
  • Epitaxy
  • PVD
  • Copper electroplating
  • CMP

Day 3: Cross Disciplinary Topics

  • A CMOS process flow
  • Plasma processing
  • Planarization
  • Trench filling & tungsten plug
  • LOCOS
  • Self aligned gate
  • Multilayer metal
  • Yield
  • Line balance and manufacturing cost
  • Reliability
  • Semiconductor metrology
  • Contamination control
  • Future directions

Course Materials:

SEMI Semiconductor Processing Technology course by Dr Peter Gwozdz, both in notebook format and in CD format (pdf files). Participants may follow the course presentation using either the notebook or the CD.

Class time:

8:00am – Continental Breakfast
8:30am – Class Starts
4:30pm – Class Ends
Continental breakfast and lunch are provided each day.

Registration Fee:


Member: $1,395
Non-Member: $1,795

REGISTER