Over 135 experts and influential leaders from the industry guide and support SEMI Europe.

European Advisory Board Russian Advisory Committee SEMICON Europa Event Committee Semiconductor Technology Programs Committee SEMI Global Photovoltaic Committee European Manufacturing Test Conference (EMTC) Committee	International MEMS/MST Industry Forum Committee Advanced Packaging Conference Committee European Regional Standards Committee ISS Conference SEMI European Award Committee
European Advisory Board Franz Richter (chairman), Thin Materials André-Jacques Auberton-Hervé, Soitec Eicke Weber, FhG ISE Volker Braetsch, Siltronic Eric Maiser, VDMA Productronic Harald Binder, Applied Materials Rob Hartman, ASML Mike Allison, Edwards Heinz-Martin Esser, Ortner Alain Astier, STMicroelectronics Michael Hummel, Texas Instruments Gilbert Declerck, IMEC Werner Mohr, Catrene		SEMI organizes annual Member Forum to meet with members
Russian Advisory Committee Torsten Thieme, Memsfab (Chairman) Alain Astier, ST Microelectronics Evgeny Babayan, GIS Martin Beigl, M+W Zander Jean Paul Beisson, ALTIS Semiconductors Jacques Berg, Tokyo Electron Paul Boudre, Soitec Alois Brandner, Applied Materials Tim Dodkin, Semitool Jarek Dolak, SVCS Valery Dshkhunyan, Angstrem Andrey Golushko, Mikron Alexander Kurliandsky, Electronintorg SP Vladimir Kuznetsov, ASM Vladimir Labunov, BSUR Michael Lev, Camtek Elena Lysyak, SolMic Hermann Marsch, Maicom Quartz Werner Mohr, Infineon Yury Stechishin, RFFED Anatoly Sukhoparov, Angstrem T Manfred Schroeder, EBARA		Russian Advisory Committee kick-off meeting October 2007
SEMICON Europa Event Committee Peter Connock, memstar® Technology, Chairman Felix Rudolf, Colibrys Harald Binder, Applied Materials Albert Lubbers, Fujifilm Electronic Materials Wolfgang Stang, Heraeus Andy Longford, PandA Europe Tim Dodkin, Semitool Davide Appello, STMicroelectronics Otto Kosgalwies, STMicroelectronics Martin Stadler, Teradyne David Brough, Tokyo Electron		Silicon Saxony booth party at SEMICON Europa
Semiconductor Technology Programs Committee Mart Graef, TU Delft (chairman) Brendan O'Neill, Tyndall National Institute Bruno Ghyselen, Soitec David Brough, Tokyo Electron Livio Baldi, Numonyx Ivo Raaijmakers, ASM International Hansjoerg Kranz & Alfred Koenig, Applied Materials Lothar Pfitzner & Richard Oechsner, Fraunhofer IISB Martin Heerschop, GE Capital Michel Brillouet, CEA-Leti Roger de Keersmaecker, IMEC Tom Beens, Umicore Wolfgang Arden, Infineon Stuart Pinkney, Nikon Precision Europe Guy Dubois, STMicroelectronics		SEMICON Europa Executive Summit attracts over 200 top-industry leaders
European Advisory PV Group Committee Harald Binder, Vice President and General Manager EMEA Solar Business, Applied Materials Jim Thompson, Executive Vice President Sales & Marketing, Oerlikon Solar Andreas Guenther, President, Linde Nippon Sanso Europe Dagmar Vogt, Managing Director, ibVogt Group Dieter Manz, CEO, Manz Automation Horst Reichardt, CEO & President, DAS Jürgen Gutekunst, CEO, Rena Karl Hesse, Director Process Design, Wacker Manfred Schröder, President, Ebara Europe Mr. Roth, Founders, Roth & Rau Peter Abel, CEO, PVA TePla Peter Pauli, CEO, Meyer Burger		Q-Cells fab visit
European Manufacturing Test Conference (EMTC) Committee Davide Appello, STMicroelectronics (chairman) Martin Stadler, Teradyne (vice-chair) Stefan Gasteiger, Advantest Klaus-Detlef Paesch, AMD Michael Goldbach, LTX René Segers Roger Barth, Numonyx Ulrich Schoettmer, Verigy
International MEMS/MST Industry Forum Committee Felix Rudolf, Colibrys (chairman) Christian Schaefer, PVA Tepla Erik Jung, Fraunhofer IMZ Jérémie Bouchaud, iSuppli Jean-Christophe Eloy, Yole Développement Peter ten Berge, ASML Uwe Behringer, UBC Microelectronics Uwe Schwarz, X-Fab Mikko Montonen, Okmetic Hans G. Kapitza, Suss MicroTec Thomas Gessner, FhG IZM Gerhard Lammel, Bosch
Advanced Packaging Conference Committee Andy Longford, PandA Europe (chairman) Jens Mueller, IMAPS Europe Chapter Andreas Dill, Oerlikon Andreas Fischer, Bosch Carlo Cognetti, STMicroelectronics Dietrich Toennies, Suss MicroTec Eef Bagerman, NXP Eric Beyne, IMEC Ignas van Dommelen, Elmos Klaus Pressel, Infineon Rolf Aschenbrenner, Fraunhofer IZM Elke Zakel, PAC Tech Christian Ossman, Datacon Philip Homami, F+K Delvotec		SEMICON Europa Packaging conference
European Regional Standards Committee Andy Longford, PandA Europe (chairman) Werner Bergholz, University of Bremen (chairman) Alfred Honold, InReCon Bert Planting, ASML Dirk Ruetterswoerden, M+W Zander FE Gabi Fernholz, VDE-VDI/IT Gordon Ferrier, Air Products Gummaar De Vos, FFEM Jacques Waelpoel, ASML Jean-Marie Collard, Solvay Lothar Pfitzner, Fraunhofer IISB Massimo Carrubba, Numonyx Peter Wagner Roland Bindemann, Freiberger Compound Materials Arnd-Dietrich Weber, SiCrystal Uwe Behringer, UBC Microelectronics Wolfgang Jantz, SemiMap Wolfgang Sievert, Honeywell		ERSC pre-meeting dinner in Dresden
ISS Conference Cor Claeys, IMEC (chairman) André Bachmann, BMG Engineering David Brough, Tokyo Electron Hans Richter, IHP Juergen Schwart, Infineon Maurice Geraets, NXP Paul Boudre, Soitec Peter Connock, memstar® Technology Bernd Haeuser, Bosch		ISS Committee in Zurich
SEMI European Award Committee Mart Graef, TU Delft (chairman) Elmar Cullmann, Suss MicroTec Giorgio De Santi, Numonyx Heiner Ryssel Klaus-Dieter Lang, Fraunhofer IZM Michel Brillouet, CEA-LETI Peter Kuecher, Fraunhofer CNT Lode Lauwers, IMEC Brendan Bold, X-Fab Jean-Pierre Joly, INES Karl-Heinz Stegemann, Signet Solar		Gilbert Declerck, IMEC, receives European SEMI Award 2008