North American Semiconductor Equipment Industry Posts December 2017 Billings
MILPITAS, Calif. — January 23, 2018 — North America-based manufacturers of semiconductor equipment posted $2.39 billion in billings worldwide in December 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.
January 23, 2018 Press Release
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The next SEMI Billing Report is now scheduled for publication on February 22, 2018; 3:00 p.m. PDT (subject to change).
Historical Book-To-Bill Press Release Data (.xls file)
Notice Regarding the Book-to-Bill Report
SEMI will cease publishing the monthly North America Book-to-Bill report this year. The December 2016 report and press release are the last publication. The decision to discontinue the Book-to-Bill report is based on changes in reporting by some participants where the reporting of orders/bookings into the data collection program is no longer a necessary component of their industry analysis.
SEMI will continue publish a monthly billings report and issue a a press release that compares month-to-month and year-over-year trends in billings activity. Additional detailed billings data will also be available in the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that SEMI prepares in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings and bookings data by 24 equipment segments and by 7 end market regions. Beginning with the January 2017 WWSEMS, bookings information will only be available for the back-end equipment segments of the industry.
SEMI continues to track semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1000 fabs worldwide.
The SEMI Billings Report provides a first look at the billings trends for North American Headquartered Semiconductor Equipment Manufacturers. The three-month average global billings are a strong indicator for trends in the worldwide semiconductor industry. SEMI follows the protocol established by the U.S. Department of Commerce in publishing our figures only on a three-month average basis. We do this in order to smooth out the natural volatility in billings. This report is distributed monthly approximately three weeks after the close of each month. Categories covered include front-end (wafer processing/mask/reticle/wafer manufacturing/fab facilities) equipment and final manufacturing (assembly/packaging/test) equipment.
2018 SEMI Billings Report Release Dates
Important: Dates are subject to change; Report is released at 3:00 pm Pacific Time.
|January 23||July 24|
|February 22||August 23|
|March 22||September 20|
|April 24||October 23|
|May 22||November 22|
|June 19||December 18|
Additional Benchmarking Tools
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World Fab Forecast
A comprehensive fab database containing over 1,000 records and details by fab. Includes forecast on a quarterly basis on capacity, construction and equipment spending, wafer size, and technology node. Click here for more information.
Materials Market Data Subscription
An excellent source of regional semiconductor materials data including fab materials and packaging materials from global companies on a quarterly basis. Includes a three-year forecast as well as current and historical revenue data. Click here for more information