SEMI® Semiconductor Materials Market Research
Semiconductor Materials Market Information
Our semiconductor materials data collection program assembles revenue data for six material segments shipped to North America, Japan, Europe, Korea, Taiwan, China and Rest of World. Additionally, SEMI works with other organizations to cover the rest of the semiconductor materials market. This is the only source of regional materials data, including fab materials and packaging materials from global companies on a quarterly basis.
|Fab Materials||Packaging Materials|
|- Silicon||- Leadrames|
|- SOI||- Substrates|
|- Photomasks||- Bonding Wire|
|- Resist||- Die Attach|
|- Ancillaries||- Mold Compounds|
|- Gases||- Encapsulants|
|- Chemicals||- Ceramic Packages|
|- Targets||- Other|
The following material briefs provide a technology overivew as well as a market summary for various materials used in the production of semiconductor devices. The data presented in these documents are based on our Materials Market Data Subscription report.
SEMI Materials Brief: Semiconductor Anti-Reflective Coatings (PDF)
SEMI Materials Brief: Bonding Wire (PDF)
SEMI Materials Brief: Chemical Mechanical Planarization Materials (PDF)
SEMI Materials Brief: Semiconductor Photoresists Developers (PDF)
SEMI Materials Brief: Organic Substrates (PDF)
SEMI Materials Brief: Die Attach Materials (PDF)
SEMI Materials Brief: Encapsulant Materials (PDF)
SEMI Materials Brief: Leadframes (PDF)
SEMI members: Please create a profile to access resources. If you already have a profile, please log-in with your credentials.
Not a SEMI member? Click here to learn more about SEMI membership
Materials Market Data Subscription
The Material Market Data Subscription includes current revenue data along with two years of historical data and a three-year forecast. Each material segment reports revenue for seven market regions (North America, Europe, ROW, Japan, Taiwan, Korea, and China). The report features detailed historical data for: silicon, photoresist, photoresist ancillaries, process gases and leadframes. The report is published six weeks after the close of each quarter.
Silicon Reclaim Wafer Characterization Summary (Report)
This analysis covers silicon wafer reclaim for the semiconductor market. Reclaim is defined as the removal of several microns of the silicon wafer and subsequent re-polishing of the wafer surface. Market estimates for reclaim wafers include semiconductor applications including equipment and IC manufacturing markets.
Photomask Characterization Summary (Report)
SEMI has conducted a supply-side market characterization of the photomask market. Seven region of the world are covered in this summary including North America, Japan, Europe, Taiwan, Korea, China, and Rest of World. Market size estimates reflect the merchant and captive market, and excludes license, royalty, and equipment revenues. In addition to the interviews, a comprehensive literature review, including company financial reports, was conducted.
Global Semiconductor Packaging Materials Outlook
Global Semiconductor Packaging Materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets. Packaging materials markets are quantified, new opportunities are highlighted, and forecasts through 2015 are presented.
- Market Info
- Events & Tradeshows