Global 200mm Fab Outlook to 2018
Coverage: 200mm front-end fabs (forecast to 2018)
Publication Date: October 2015
Principal Analyst: Christian Gregor Dieseldorff
Format: Microsoft® Excel® file (.xls) and .pdf
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This report consists of the following:
This presentation provides comprehensive analysis of the worldwide 200mm fab installed base, latest trends, and future expansions into 2018, which are driven by device volume forecast from mobile applications and the IoT (Internet of Things).
A detailed data file that includes company profiles, latest fab statuses, installed base and expansion plans by geographic regions, technology nodes, wafer transactions, and product types, spanning multiple years.
The SEMI Worldwide 200mm Fab Outlook Report to 2018 uses a bottom-up approach methodology. All data for this report and Excel data are based on credible sources which include public announcements, SEC filings, and direct input from semiconductor suppliers around the world. The report provides high-level summaries, tables, graphs and in-depth analyses of equipment spending to 2018. The database, covers current wafer fab capacity status and plans, technology, and products by fab. These two resources are invaluable tools for gaining in-depth insights into how the Internet of Things is giving a second wind to 200mm semiconductor manufacturing in 2016, 2017 and beyond.
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