Learn, Explore and Share at BiTS Workshop


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Learn, Explore, Share at BiTS Workshop 2009

By Fred Taber, BiTS Workshop

The Burn-in and Test Socket Workshop (BiTS), co-sponsored by Advanced Packaging magazine, celebrates its tenth annual gathering, March 8– 11, 2009, at the Hilton Phoenix East/Mesa Hotel in Mesa, Arizona. This workshop and EXPO is dedicated to providing a forum for the latest information about burn-in and test socketing and related fields, and addresses the technical and business challenges facing industry practitioners.

Attendees, authors, and speakers from around the world represent, among others, end users and suppliers of sockets, boards, burn-in systems, handlers, packages and other related equipment, materials and services. The BiTS EXPO features exhibits of the latest products and services by an international mix of companies from socketing and related industries.

Technical Program
Highlighting the BiTS 2009 Technical Program, four renowned industry leaders will deliver signature talks on current issues and future trends. Additionally, tutorials led by expert instructors and more than 30 papers and posters presented by knowledgeable authors will address important and timely burn-in and test related topics.


Following an opening night reception, the invited speakers take the stage. James Forster, Ph.D. CTO of Antares Advanced Test Technologies recognizes the 10th anniversary of BiTS by applying the BiTS archive to a socket industry retrospective and outlook with his talk BiTS and Pieces— Past, Present, and Future. Then, after dinner, David Pfaff, President of Plastronics Socket Company, apropos to these difficult economic times, examines socket economic strategies to reduce cost and leadtime with Flawed Strategies: Why Socket Costs are Killing Your Budget.

Kicking off the technical sessions portion of the program, Brandon Prior, Senior Consultant at Prismark Partners, delivers the keynote address, IC Packaging: Global Trends, Technologies and Next Generation 3D Solutions, in which his IC packaging insight offers a forecast of what's in store for the burn-in and test community. Later that day, the distinguished speaker, Navid Shahriari, director of sort test technology development at Intel, shares his views on the testing business and supplier/customer relationships to accelerate improvements beyond normal evolution with Breaking Traditional Boundaries— OUR Industry Challenges at Test.

Tutorials include: “Sockets 101” and “What’s that Thing under my Socket?”

Two special tutorials, each taught by a leading industry expert, are offered on Sunday, March 9. Whether new to the business or a socket veteran, they provide a seldom seen opportunity to build leading edge skills in learning more about socket technology and PCBs.

Jon Diller, director of international sales and marketing at Interconnect Devices, Inc., teaches Sockets 101: A Broad and Deep Survey of Test Interconnect Solutions, providing a comprehensive study of test socket electrical and mechanical technology, plus insight into the history, future, and commercial aspects. Then, Thomas Bresnan, sales manager at R&D Circuits, is the instructor for What's That Thing Under My Socket?, bringing the printed circuit board shop to the lecture hall by addressing how they are made and how they work.

Technical Sessions: Challenges, Integration, and Components

Technical presentations comprise 7 podium sessions and 2 poster sessions, which begin on Monday, March 9 and run for 2 ½ days, tackle a prominent range of timely and fundamental topics. Organized with a theme for each day, more than 30 papers, featuring the latest work and advancements by authors from around the world, will be presented. Having a single track in the technical program allows attendees to sit in on every session and presentation.

Monday, March 9, Challenges Day, sees presentations covering high current and power along with socket design. Tuesday is Integration Day, and covers test & burn-in operations, PCBs and a mix of other socket science. Closing the workshop on Wednesday, Components Day, are two sessions centered on electrical contacts and materials for sockets.

With numerous meals, breaks and receptions to encourage informal discussions and networking, attendees see benefits beyond the technical sessions and speakers.

BiTS EXPO
At the BiTS EXPO, over 50 companies from around the world will be exhibiting their latest products and services. The EXPO is open for over six hours — all of it exclusive from other events, leaving ample time for attendees and exhibitors to meet and discuss requirements.

Registration and Accommodations
Attendee registration opens soon. Discounted advance attendee and tutorial registration may be made online, by mail or by fax through February 20, 2009. All BiTS 2009 events are held at the Hilton Phoenix East/Mesa Hotel. A limited number of rooms are available at a BiTS 2009 special discount rate.

Visit the BiTS Workshopwebsite for more information and details about the technical program, BiTS EXPO, attendee and exhibitor registration and hotel accommodations.


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Darren Young of Anestel presenting at BiTS 2008

January 6, 2009