Today’s innovations in consumer electronics are increasingly driven by performance and form factor achievements delivered by assembly and packaging technologies.  SEMI serves this segment by helping connect the industry with new technologies and solutions, through industry standards and statistics that aid planning and cost reduction, and through other programs and services that help members profitably grow.

• Productivity Transfer Propels the Growth of the China Packaging Industry
• Japanese Companies Continue to Dominate the Packaging Materials Market
• SEMICON China 2010: Packaging and Assembly Symposium (March 18)
• Growing Packaging Materials Market under Pressure
• Packaging and Enabling Technologies to Support Market Expansion (SEMICON Japan)
• Packaging Application: Industrial Sectors which Keep Creating New Applications-- Auto/Mobile (SEMICON Japan)
• Advanced Packaging Conference at SEMICON Europa 2009
• When the Package is the Product, Will 3D Integration be the Holy Grail? (SEMICON West)
• Industry Leaders Outline 3D TSV Revolution
• Design Rules and Roadmaps Needed to Enable TSV Adoption
• US Election 2008 SEMI Position Statement
• Packaging Materials: Market Challenges and Opportunities
• New Driver of Innovation: Assembly and Packaging (SEMICON Singapore) 

The SEMI International Standards Program is one of the key services offered  for the benefit of the worldwide semiconductor, PV and flat panel display (FPD) industries. Standards afford a way to meet the challenges of increasing productivity while enabling business opportunities around the globe. The program, started over 35 years ago in North America, was expanded in 1985 to include programs in Europe and Japan.  For more information about the SEMI International Standards Program, click here.

SEMI covers the global semiconductor assembly and packaging equipment and materials market through market data subscriptions.  For more information, visit Market Information.

• 3D Integration: A Progress Report (510kb PDF)
• Global Semiconductor Packaging Materials Outlook 

• US Election 2008 SEMI Position Statement
• Innovation at Risk
• Dynamic Export Control Discussions Continue
  

For more information contact: info@semi.org