The workshop technical committee is seeking presentations that provide details of new developments related to test, assembly, and handling of die products for use in electronic products. This year’s workshop will have a special focus on the challenging issues for KGD as the industry moves to finer geometries.

Technical sessions will include discussions of various methods of testing, handling, and providing reliability screens for die delivery for products. User requirements for bare die will be addressed, including component-level and system-level quality and reliability targets. Coverage will be provided for drivers such as lower cost, reduced size, and increased performance in electronic systems that leverage demand for die products.

The annual KGD Packaging & Test Workshop has charted over a decade of progress in the die products industry, and has steadily built a reputation as the industry's most comprehensive workshop focusing on known good die processes and user requirements. Proposals are now being accepted for 30-minute presentations (including Q & A) on the topics listed below. Presentations must be of a non-commercial nature, focusing on the technology and business issues within the die products industry.

The submission deadline is July 23, 2010.

Test
Design for test
RF/ Analog wafer testing
Probes/fine pitch sockets
High performance wafer/die testing
Wafer/die level reliability screening
Test equipment and fixturing
Module test / burn-in
Qualification testing
Failure analysis strategies
OEM quality, reliability and cost tradeoffs

Applications of Die Products
System level case studies
Product design and implementation
Advanced packaging and SMT

Business Issues
Cost-yield tradeoff analysis at component, subsystem and system level
Market trends
Customer requirement identification
Benchmarking
Supply Chain Management

KGD Engineering
Quality monitoring & reliability budgeting
Process flow strategies
Failure diagnosis / analysis for multi-chip packages
Feasibility studies
Thermal issues in stacked packages
Statistical methods

Manufacturing / Assembly
Stacked die/package assembly processes
Advanced wire bonding techniques
Wafer thinning technology limits
Flip chip mounting
Die products shipping/handling methods
Long term storage for die products
Die to Package interconnect

Future Trends and Developments
Die/package roadmaps
Die to die interconnect
Technology and product advances
Built-in test/screens
Technology integration
MEMS & sensor technology