Semiconductor Equipment and Materials Industry Timeline

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Semiconductor Equipment and Materials Industry Timeline



The transistor is invented at Bell Laboratories by the team of William Shockley, John Bardeen and Walter Brattain.




Bell Labs researchers apply photolithography used for printed circuit boards to the fabrication of silicon based transistors. (Source: Computer History Museum’s Silicon Engine Timeline)



Jack Kilby of Texas Instruments demonstrates a “solid circuit” that incorporates both active and passive components on the same substrate.




Robert Noyce of Fairchild Semiconductor patents a monolithic IC that can be manufactured in high volume.




Dedicated semiconductor test equipment begins to appear on the commercial market.




The semiconductor device industry surpasses $1 billion in sales for the first time. (Source: Semiconductor Industry Association)




Gordon Moore observes that transistor density is doubling every 18 months. It soon becomes knows as Moore’s Law, and drives technology innovation across the industry.




The SEMI organization is founded by Bill Hugle, Fred Kulicke and John Dannelly.




The first SEMICON show is held at the San Mateo Fairgrounds in California. The show features 80 exhibitors and is attended by 2,800 people.




Sam Marshall, the founder of Solid State Technology magazine, organizes SEMI’s first technical symposium at SEMICON in San Mateo.




The SEMI Standards program is established following meetings between silicon suppliers to try and set common wafer diameters.


SEMI launches SEMICON East at the Nassau Coliseum in New York, with 120 exhibitors participating.




SEMICON Europa debuts in Zurich, Switzerland, with 378 exhibitors and 1,800 attendees.




SEMICON Japan has its debut in Tokyo in November, featuring more than 200 exhibitors and 4,500 visitors.




SEMI holds its first Information Services Seminar (ISS) in Scottsdale, Arizona, providing a vital service to smaller SEMI members who cannot otherwise afford to collect industry forecast information.




The inaugural SEMI Awards are held, with 11 individuals recognized for their achievement in advancing equipment and materials technology.




Bill Reed is appointed president of SEMI.




Japan overtakes the U.S. as the world’s leading semiconductor producer.




SEMI establishes the U.S. Japan Trader Partners Conference to ease trade friction between the U.S. and Japanese semiconductor industry. Later the event is renamed ITPC.




SEMI and the Semiconductor Equipment Association of Japan (SEAJ) enter into an agreement to exchange market data on a monthly basis.

A group of U.S.-based chipmakers form SEMATECH to solve common manufacturing problems.

Shigeo Takayama is elected the first Japanese member of the SEMI board of directors. The same year, Gustav Wirz becomes the first European to be elected to the SEMI board.

In November, SEMICON Korea is held for the first time at the Korean Exhibition Center (KOEX) in Seoul.




The first SEMICON China exhibition takes place in August at the Shanghai Exhibition Center.




The global semiconductor equipment market exceeds $10 billion in sales for the first time.

SEMICON Singapore debuts, offering the Southeast Asia region its own expo focused on IC test, assembly and packaging.




Standardization efforts get underway in preparation for an expected transition from 200mm to 300mm wafers.




The SEMICON Taiwan exhibition debuts in Taipei, Taiwan.




The National Medal of Technology, America’s highest honor for technological innovation, is awarded to James C. Morgan, chairman and CEO of Applied Materials.

Stan Myers, formerly president and CEO of Siltec, is appointed president of SEMI.




Worldwide semiconductor materials sales reach $21 billion, exceeding the size of the equipment market for the first time.