New Standards Improve Quality Control and Increase Reliability

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New Standards Improve Quality Control and Increase Reliability

SEMI published eight new technical standards including guidelines for precursors used in low-K CVD processes, a guide for equipment training best practices, and a test method to determine the strength of wafer-wafer bonds. The new standards, part of the November 2007 publication cycle, join more than 770 standards published by SEMI during the past 34 years.

As the MEMS industry grows and technical requirements become clearer, it is important for suppliers and MEMS producers to collaborate in developing standards. Two new MEMS related standards: SEMI MS4, a Standard Test Method for Young’s Modulus Measurements; and, SEMI MS5, a Test Method to Determine Strength of Wafer-Wafer Bond, add to the growing volume of MEMS related standards.

The new standards were developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program. About 1,100 volunteers worldwide participate in the SEMI Standards program, which is made up of 17 global technical committees. Visit us at

SEMI Standards are available for purchase on CD or can be downloaded from View the complete list at:

Do you need to copy and paste SEMI Standards into purchase orders, manuals, presentations, or need to distribute these materials outside of your organization? The SEMI International Standards Super License is right for you. This annual subscription includes the full set of SEMI Standards on CD with shared drive/intranet posting permission, plus copyright release permission on the standards. Get more information.

The November 1, 2007 SEMI International Standards Publication includes:

  • SEMI C62: Guideline for Porogen Precursors Used in Low-K CVD Processes. Benefits: minimizes the risk of supplying inconsistent material to the industry, reduces equipment contamination, and minimizes the costs associated with material qualifications.
  • SEMI C63: Guideline for Organosilicate Precursors Used in Low-K CVD Processes. Benefits: same as SEMI C62, for organosilicate precursors.
  • SEMI E54.20: Standard for Sensor/Actuator Network Communications for EtherCAT. Benefits: breaks performance and topology barriers imposed by legacy field bus systems, can be 50 to100 times faster than many field bus systems, and helps integrate measurement, motion control, safety and I/O networks. With support from large OEMs and device vendors in North America, Asia and Europe, EtherCAT may become the de-facto standard for the semiconductor, FPD and MEMs industries.
  • SEMI E150: Guide for Equipment Training Best Practices. Benefits: facilitates the gap between awareness of performance-based equipment training and realizing its benefits through practice, with more effective training resulting. Also, represents best practices by the American Society of Training and Development (ASTD) and the International Society for Performance Improvement (ISPI).
  • SEMI F104: Particle Test Method Guidelines for Evaluation of Components Used In Ultrapure Water and Liquid Chemical Distribution Systems. Benefits: increase ability to select components that contribute the least amount of particles to the chemical stream during use, resulting in higher purity demands. Also, reduces startup time, overall system cost, and allows particle monitoring of vendors’ liquid components.
  • SEMI F105: Guide for Metallic Material Compatibility in Gas Distribution Systems. Benefits: for chemical delivery systems (especially PVD, CVD, and Etch), reduces contamination due to chemical incompatibilities, which can lead to wafer defects and yield loss. Except for 316 stainless steel, the compatibility of metals with gases had never been documented.
  • SEMI MS4: Standard Test Method for Young’s Modulus Measurements. Benefits: for the MEMS manufacturing process, provides a uniform test method for material property quality—improving quality control, increasing product reliability, and reducing manufacturing cost.
  • SEMI MS5: Test Method to Determine Strength of Wafer-Wafer Bonds. Benefits: also for the MEMS manufacturing process, same as SEMI MS4, only applicable to the automotive, navigational, and medical devices.