SEMICON Korea 2008 STS Call for Papers

Bookmark and Share

Call for Papers


SEMI Technology Symposium (STS) 2008
SEMICON® Korea 2008
January 30- February 1, 2008
COEX, Seoul, Korea

Call for Papers (104KB PDF)

Abstract Deadline: September 15, 2007

Semiconductor Equipment and Materials International (SEMI) is soliciting papers from authors around the world for various technical programs held in conjunction with SEMICON® Korea 2008. Individuals are encouraged to submit original papers related to any of the following categories.


Session1. Advanced Lithography

  • Resist Processes and Materials
  • Photomask Processes and Materials
  • Lithography Simulation (Wafer/Mask Processes) and Imaging Fundamentals
  • Resolution Enhancement Methods
  • OPC and Design for Manufacturing
  • Immersion Lithography (Water, High Refractive Index Fluid)
  • Multiple Exposure and Double Patterning Techniques
  • Advanced Metrology Technology for Wafer and Mask
  • Extreme Ultraviolet Lithography
  • Nano-Imprint Lithography
  • Alternative Lithography(E-beam, Interferometric, X-ray, Ion-beam, Self-assembly, Maskless Lithography)
  • Applicaiton of Lithography to Nanotechnology

Session2. Dielectrics, Metals, New Materials and their Processes

  • Advanced Gapfill Technology
  • Interconnection (Cu, Al, W Barrier Metal, Gate Electrode, Salicidation, Optical Interconnection)
  • Dielectric (high k, low k, Gate Dielectric, Ferroelectric, Passivation)
  • 3D Integration and Process Technology (Wafer Bonding, Thinning, TSV, etc)
  • Doping & Heat Treatment Process(I2p, Plasma Doping, GILD, SADS, RTP, Furnace, Damage Control)
  • Epitaxial Growth (Blanket, Selective, Device Integration)
  • SOI Materials & Processes (Wafer Manufacturing, Device Manufacturing)
  • Materials and Processes for Semiconductor Memory Devices (PCM, etc)
  • Nano Process Technology (Quantum Dot/Nanowire/Layer Formation)
  • Semiconductor Process for Solar Cell Application

Session3. Device Technology

  • SoC Technology
  • Advanced CMOS Technology
  • Advanced Memory Technology
  • SOI Devices
  • RF Devices
  • Nano-scale Devices
  • Thin Film Devices
  • Interconnection Technology
  • Process/Device/Interconnection Modeling
  • Device/Interconnection Reliability
  • Organic Devices (OLED/Organic TFT)
  • MEMS/Sensor/Medical/Display Devices

Session4. Etching Technology

  • Deep and Small Contact Etch
  • Mask Etch
  • Gate Etch: Flash Floating Gate Etch, Recessed Gate Etch, Fin-FET Etch
  • STI Etch: STI Etch, ILD Etch
  • New Materials and Novel Metal Etch
  • TSV(Through Silicon Via) Etch for Multiple Chip Package
  • APC/AEC(Advanced Process Control/Advanced Equipment Control) for Plasma Processes
  • Strategy and Development for High thoughput and Low Cost Equipment
  • In-situ Chamber Cleaning and Particle Reduction and Control
  • Chamber Monitoring and In-situ Metrology
  • Soft Treatment Etch
  • Damage Free low k Etch

Session5. Contamination-free Manufacturing and CMP Technology

  • Advanced Wet/Dry Surface Preparation
  • Environmentally Friendly Manufacturing/PFC Emission Reduction
  • Micro-, Nano-contamination Control
  • Yield Enhancement Technology
  • Advances in CMP and ECMP Related Processes and Equipments
  • CMP Consumables and Metrology
  • CMP Modeling and Simulation
  • Post CMP Cleaning

Session6. Elecropackage System and Interconnect Product

  • Advanced Packaging - CSP, BGA, MCM/KGD, COB/COF/COG, Wafer Level Packaging, 3D Packaging, Low K Packaging, MEMS Packaging
  • Interconnections - Wire bonding, TAB, Flip Chip
  • SMT Design, Modeling & Simulation: Electrical, Thermal & Mechanical Management, Reliability simulation
  • Material and Interposer - EMC/Encapsulants, Lead Frames, Polymers, Substrates, Solders, Non Ni-Au finish substrate, Lead-Free Bumping
  • Equipment - Manufacturing Equipment Automation, Inspection, Assembly Cost Reduction

Prospective authors are requested to submit an abstract of 200-250 words and a 100 word biography by September 15, 2007 indicating the category for which the paper is being submitted. All abstract must appear on company letter head which should include complete address, telephone, fax numbers and e-mail address.

Presentations are to be non-commercial in that they will focus on the technical merits rather than on individual company’s product benefits. Selected speakers will be notified by November 30, 2007.

A manuscript and presentation file will be required to submit by December 7, 2007. Please submit the cover sheet, abstracts, and biographies to JoAnn Lee at SEMI Korea.

Accepted papers are subject to co-copyright with SEMI, who reserves the right to republish, re-sell and display submitted material in whole or in part.


JoAnn Lee, SEMI Korea
#4005 Trade Tower
159-1, Samsung-dong, Kangnam-gu
Seoul 135-729 Korea
ph: 82.2.551.3407, fax: 82.2.551.3406