SEMICON Europa 2006 Opens April 3 in Munich, Germany


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SEMICON EUROPA 2006 OPENS APRIL 3 IN MUNICH, GERMANY

Exposition Hosts, Advanced Manufacturing and Packaging, Nanoelectronics and Photovoltaics

BRUSSELS, Belgium – January 12, 2006 – Leading companies will display their latest manufacturing technologies for semiconductors, micro-electromechanical devices (MEMS) and photovoltaic devices during SEMICON Europa 2006, the annual exposition presented by SEMI. The exhibition will be held at the Munich International Trade Fairs Centre (Messe Muenchen International) in Munich on April 4-6, while conferences and programs will take place on April 3-5, at the Munich International Congress Center (ICM) and at the Hotel Arabella Sheraton.

SEMICON Europa will be celebrating its 30th anniversary in 2006. To commemorate the milestone, the International Reception, held on Tuesday, April 4 at the ICM, will feature Dr. Bertrand Piccard. Piccard, the first person to circumnavigate the earth non-stop by balloon, has now launched “Solar Impulse”, a project to build and fly with a solar airplane around the world.

“Europe’s major strengths lie in innovation and technology development, and the main challenge for our region is to transfer new ideas quickly into profitable products,” said Heinz Kundert, president, SEMI Europe/CIS. “SEMICON Europa 2006 will feature three specific tracks, which are aimed at leading our members and their customers towards making appropriate decisions for their future business”.

The three tracks - Advanced Semiconductor Manufacturing and Packaging, MEMS/Nanotechnology and Photovoltaic – will be represented in the conferences and programs as well as in the two Technology Arenas on the show floor, where companies have the opportunity to present their latest technologies.

For the Advanced Semiconductor track, the Advanced Packaging Conference on Tuesday, April 4 will feature the session “Wafer Level Packaging and Beyond – from samples to volume”. Also in connection with advanced packaging, presentations on lead-free technologies will be held on the show floor at the SEMI Technology Arena II, and include an update on EU regulations and compliance.

Also in the final manufacturing area, the 8th European Manufacturing Test Conference on April 4 will focus on the theme “Probing the Future of Manufacturing Test.” Highlights include presentations on advanced wafer probing, test data management and improving test efficiency.

In the MEMS/Nanotechnology area, the international MEMS/MST Industry Forum on Monday, April 3 will highlight the user-supplier relationship while the Nanoelectronics Forum on April 4 will explore methods of shortening the industrialization cycle from the research lab into the market.

In the “Photovoltaic” track, the 2nd edition of the Advanced Photovoltaic Manufacturing Technology Conference on Wednesday, April 5 will present a session “Strategies to bisect photovoltaic module cost.” This conference attracted over 300 participants at SEMICON Europa 2005. Exhibitors will also have the opportunity to present their photovoltaic technology in the SEMI Technology Arena II located in Hall A3 on the show floor.

In addition, the 10th annual Fab Managers Forum will be held on the first day of SEMICON at the Hotel Arabella Sheraton in Munich.

SEMI is a global industry association serving companies that provide equipment, materials and services used to manufacture semiconductors, displays, nano-scaled structures, micro-electromechanical systems (MEMS) and related technologies. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose (Calif.), Seoul, Shanghai, Singapore, Tokyo and Washington, D.C. For more information, visit www.semi.org.

ASSOCIATION CONTACTS:

Vincent Dubois/SEMI
Tel: 32.2.289.6495
E-mail: vdubois@semi.org

Scott Smith/SEMI
Tel: 1.408.943.7957
E-mail: ssmith@semi.org