SEMICON Europa 2006 - Lead-free


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Lead-Free Solutions for Assembly and Packaging

Wednesday 5 April 2006, 10:30-17:00 (Day 1)
Thursday 6 April 2006, 10:00-15:00 (Day 2)
SEMI Technology Arena in Hall A3 – New Munich Trade Fair Centre, Germany
In conjunction with SEMICON Europa 2006

As the 1 July 2006 deadline for the implementation of the EU Directive on the "Restriction of Use of Hazardous Substances" (RoHS) approaches, SEMI Europe and ELFNET join their efforts and competencies by offering two days of presentations on technology and industry solutions to ban lead in electronic components and equipment manufacture and assembly.

On Wednesday 5 April morning, the first session offers an update of EU’s EHS (Environment, Health & Safety) regulatory and legislative framework and on corresponding directives. Following on Wednesday 5 April afternoon and Thursday 6 April, a series of technical presentations will be made by the most technology advanced companies in the lead-free area.

Solutions to important issues identified by the experts of the ELFNET network for the adoption of lead-free processes in microelectronics packaging and assembly will be detailed and exemplified.

Agenda

Wednesday 5th April

Update on EU Legislation on Environment Health & Safety

Chairperson: Pierre Lucas – SEMI Europe

 

10:30 - 11:00

Keynote Speech by representative of the European Commission or Industry (to be confirmed)

 

11.00 – 11.30

Keith Huckle
Dow Corning

REACH - so what happens next?

11.30 – 12.00

Aimee Bordeaux
SEMI

The Regulatory Landscape of PFOS/PFAS/PFOA

12.00 – 12.30

Julian Lageard
Intel Corporation

New energy efficiency requirements and beyond

12.30 – 13.00

Paul Goodman
ERA

Latest developments in approaches to compliance with the RoHS Directive

     

Supply Chain Issues I

 

Chairperson: Andy Longford, PandA Europe

 

13:15 - 13:35

Jeremy Pearce,
ELFNET Coordinator

ELFNET Project Overview

13:35 - 13:55

John Jones (IGG)
Component Obsolescence Group

Obsolescence

13:55 - 14:15

Dietmar Vieth

FarnellinOne

Component Supply

     

Supply Chain Issues II

 

Chairperson: Jeremy Pearce, ELFNET Coordinator

 

14:30 - 14:50

Walter Huck
IEC TC97

Marking & Labelling

14:50 - 15:10

Tom Perrett,
Soldertec

Compliance Testing

15:10 - 15:30

Gerd Schulz,

ZVEI

Materials Declaration

     

Lead-Free Standards

 

Chairperson: Knut Aune, Abelia

 

16:45 - 16:05

Valentine Menuet
IECQ Representative

IECQ HSPM Certification

16:05 - 16:25

Lars Wallin
IPC, US

IPC “lead free” Standards

16:25 - 16:45

Bob Pfahl

iNEMI

Overview of iNEMI Projects on Pb-Free and RoHS Compliance

16.45 – 17.00

Andy Longford
PandA Europe

Lead-Free applicable to Semiconductor Standards

Thursday 6th April

Design

 

Chairperson: Jacob Klerk, Philips

 

10:00 - 10:20

Trygve Torma
NERA Networks

Large & Complex Boards

10:20 - 10:40

Thomas Ahrens
Fraunhofer-IST

Lead-Free Best Practice for SME’s

10:40 - 11:00

Paul Connelly
Avantec

SnAgCu Formulations

     

Materials

 

Chairperson: Jan Eite Bullema, TNO

 

11:15 - 11:35

Antonello Vicenzo
Politecnico de Milano

Tin Whiskers

11:35 - 11:55

Per Johander
IVF Industrial R&D Corporation

Laminates

11:55 - 12:15

Clemens Schmetterer
University of Vienna

Lead-Free Solder Alloy Properties

     

Process

 

Chairperson: Dag Andersson, IVF Industrial R&D Corporation

 

12:30 - 12:50

Erik Veninga
TNO

Hand Soldering

12:50 - 13:10

Anders Ekelof
Ericsson AB

Rework & Repair

13:10 - 13:30

Toni Mattila
Helsinki University of Technology

The Role of Intermetallics

     

Reliability

 

Chairperson: Claire Ryan, University of Limerick

 

13:45 - 14:05

Guenter Grossmann
EMPA

State-of-the-Art in Lead-Free Reliability

14:05 - 14:25

Bart Vandervelde
IMEC

Lead-Free Reliability Data

14:25 - 14:45

Clive Simmonds
BAE Systems

Aerospace & Defence Sector Perspective

     

In cooperation with:

Link to ELFNET website

ELFNET SEMICON Europa program page

Price:
(for each day)

Before 03 March 2006 – SEMI-Member euro20 / Non-Member euro30
After 03 March 2006 – euro40

   

Register here