SEMICON Europa 2006 - MEMS Forum agenda
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International MEMS/MST Industry Forum
Monday, 3 April 2006, 09:30–18:15
Arabella Sheraton Grand Hotel—Munich, Germany
In conjunction with SEMICON® Europa 2006
”MEMS Manufacturing in Europe: Where the Technology and the Business are Going”
Agenda:
Conference chair: Felix Rudolf, Colibrys
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09:30–09:40 |
Welcome and Opening Remarks | |
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09:40–10:15 |
Keynote speech: “Texas Instruments DLP® Technology Industry Leader in MEMS Manufacturing” Don Russell, Product Integration Manager for DLP® Products, Texas Instruments |
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Session I: MEMS Manufacturing
Session chair: Henning Wicht, Wicht Technologie Consulting
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10:15–10:45 |
3D-MEMS |
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Ulf Meriheinä, VTI Technologies |
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10:45–11:15 |
”X-FAB and MEMS“ |
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Uwe Schwarz, X-FAB |
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11:15–11:45 |
Coffee break |
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11:45–12:15 |
“Business Model for MEMS Niche Markets” |
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Sean Neylon, Colibrys |
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12:15–12:45 |
“Development and Production of MEMS-Sensors for Automotive and Consumer Application” |
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Georg Bischopink, Robert Bosch |
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12:45–13:15 |
“Dealing with Diversity in More than Moore” |
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Theun Baller, Philips Research |
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13:15–14:15 |
Lunch break |
Session II: MEMS Devices and Processes
Session chair: Markus Gabriel, Suss MicroTec
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14:15–14:40 |
Power-MEMS and RF-MEMS for Wireless Applications |
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Johan Reynaert, IMEC |
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14:40–15:05 |
Direct Lamination of SU-8 Cavities over MEMS Components |
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Donald W. Johnson, MicroChem; Helge Luesebrink, EVGroup |
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15:05–15:30 |
Handling and Processing of Thin Semiconductor Substrates by Means of Mobile Electrostatic Carriers |
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Christof Landesberger, Fraunhofer IZM |
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15:30–15:55 |
Influence of Die Handling on the Packaging Costs |
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Christian Ossmann, Alphasem |
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15:55–16:20 |
SOI-Wafers—New Opportunities in Sensor Desigs |
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Markku Tilli, Okmetic |
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16:20–16:50 |
Coffee break |
Session III: News from Equipment Manufacturers
Session co-chairs: Uwe Behringer, UBC Microelectronics; Peter Ten Berge, ASML
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16:50–16:55 |
High Productivity DRIE Solutions for 3-D-Sip and MEMS Volume Manufacturing |
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JM Thevenoud, Michel Puech, Alcatel Vacuum Technology France |
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16:55–17:00 |
Cost-Efficient HVM-Process Using Nano Imprint Lithography |
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Marc Beck, Obducat |
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17:00–17:05 |
Wafer Level Packaging Technology Updates |
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Markus Gabriel, Suss MicroTec Lithography |
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17:05–17:10 |
High Rate Precision Drive of Silicon For MEMS Applications |
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David Haynes, Leslie Lea, Surface Technology Systems |
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17:10–17:15 |
Controlled Continuous Flow Vapour Phase Silicon Etching |
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Antony O’Hara, Memsstar Technology |
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17:15–17:20 |
Wafer Bonding for Vacuum Encapsulation |
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Tony Rogers, Nick Aitken, Applied Microengineering |
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17:20–17:25 |
Aligned Wafer Bonding in High Volume Manufacturing |
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Thorsten Matthias, EV Group |
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17:25–17:30 |
All Stress Tensor Component In-Line Metrology for MEMS Manufacturing |
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Wojtek Walecki, Frontier Semiconductor |
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Panel Discussion
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17:30–18:15 |
Market Development Trends and Forecast |
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Moderator: |
Christian Schaefer, PVA TePla |
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Panelists: |
Jean-Christophe Eloy, Yole Developpement |
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Henning Wicht, Wicht Technologie Consulting |
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Invited MEMS Manufacturers |
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18:15 |
Closing Remarks |
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18:20 |
Reception, Sponsored by:
Media Sponsor:
Association partner: |
Programs Committee:
Felix Rudolf (Committee Chairman), Colibrys
Eric Jung, Fraunhofer IZM
Jan Peter Stadler, Robert Bosch
Uwe Behringer, UBC Microelectronics
Henning Wicht, WTC
Jens Koch, X-FAB
Jean-Christophe. Eloy, Yole Développement
Markus Gabriel, Suss MicroTec
Peter ten Berge, ASML
Christian Schaefer, PVA TePla
Christine Neuy, IVAM
Who should attend:
MEMS/MST companies and R&D institutions, with their equipment, materials and service providers, will get great opportunities for their managers and professionals to network and share learning in technology and market developments for successful MEMS/MST production strategies.
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Price: |
Before 03 March 2006: SEMI Member euro230/Non-member euro260
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Venue:
ArabellaSheraton Grand Hotel
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Special rates were negotiated:
Room rates (Superior/ Executive category):
These rates are only valid till 13 March 2006! |
