SEMICON Europa 2006 - MEMS Forum agenda


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International MEMS/MST Industry Forum

Monday, 3 April 2006, 09:30–18:15
Arabella Sheraton Grand Hotel—Munich, Germany
In conjunction with SEMICON® Europa 2006

”MEMS Manufacturing in Europe: Where the Technology and the Business are Going”

Agenda:

Conference chair: Felix Rudolf, Colibrys

09:30–09:40

Welcome and Opening Remarks

 
     

09:40–10:15

Keynote speech:

“Texas Instruments DLP® Technology Industry Leader in MEMS Manufacturing”

Don Russell, Product Integration Manager for DLP® Products, Texas Instruments

Session I: MEMS Manufacturing


Session chair: Henning Wicht, Wicht Technologie Consulting

10:15–10:45

3D-MEMS

 

Ulf Meriheinä, VTI Technologies

   

10:45–11:15

”X-FAB and MEMS“

 

Uwe Schwarz, X-FAB

   

11:15–11:45

Coffee break

   

11:45–12:15

“Business Model for MEMS Niche Markets”

 

Sean Neylon, Colibrys

   

12:15–12:45

“Development and Production of MEMS-Sensors for Automotive and Consumer Application”

 

Georg Bischopink, Robert Bosch

   

12:45–13:15

“Dealing with Diversity in More than Moore”

 

Theun Baller, Philips Research

   

13:15–14:15

Lunch break

Session II: MEMS Devices and Processes


Session chair: Markus Gabriel, Suss MicroTec

14:15–14:40

Power-MEMS and RF-MEMS for Wireless Applications

 

Johan Reynaert, IMEC

   

14:40–15:05

Direct Lamination of SU-8 Cavities over MEMS Components

 

Donald W. Johnson, MicroChem; Helge Luesebrink, EVGroup

   

15:05–15:30

Handling and Processing of Thin Semiconductor Substrates by Means of Mobile Electrostatic Carriers

 

Christof Landesberger, Fraunhofer IZM

   

15:30–15:55

Influence of Die Handling on the Packaging Costs

 

Christian Ossmann, Alphasem

   

15:55–16:20

SOI-Wafers—New Opportunities in Sensor Desigs

 

Markku Tilli, Okmetic

   

16:20–16:50

Coffee break

   

Session III: News from Equipment Manufacturers


Session co-chairs: Uwe Behringer, UBC Microelectronics; Peter Ten Berge, ASML

16:50–16:55

High Productivity DRIE Solutions for 3-D-Sip and MEMS Volume Manufacturing

 

JM Thevenoud, Michel Puech, Alcatel Vacuum Technology France

   

16:55–17:00

Cost-Efficient HVM-Process Using Nano Imprint Lithography

 

Marc Beck, Obducat

   

17:00–17:05

Wafer Level Packaging Technology Updates

 

Markus Gabriel, Suss MicroTec Lithography

   

17:05–17:10

High Rate Precision Drive of Silicon For MEMS Applications

 

David Haynes, Leslie Lea, Surface Technology Systems

   

17:10–17:15

Controlled Continuous Flow Vapour Phase Silicon Etching

 

Antony O’Hara, Memsstar Technology

   

17:15–17:20

Wafer Bonding for Vacuum Encapsulation

 

Tony Rogers, Nick Aitken, Applied Microengineering

   

17:20–17:25

Aligned Wafer Bonding in High Volume Manufacturing

 

Thorsten Matthias, EV Group

   

17:25–17:30

All Stress Tensor Component In-Line Metrology for MEMS Manufacturing

 

Wojtek Walecki, Frontier Semiconductor

   

Panel Discussion

17:30–18:15

Market Development Trends and Forecast

Moderator:

Christian Schaefer, PVA TePla

Panelists:

Jean-Christophe Eloy, Yole Developpement

 

Henning Wicht, Wicht Technologie Consulting

 

Invited MEMS Manufacturers

   

18:15

Closing Remarks

   

18:20

Reception, Sponsored by:

Media Sponsor:

Association partner:

   

Programs Committee:

Felix Rudolf (Committee Chairman), Colibrys
Eric Jung, Fraunhofer IZM
Jan Peter Stadler, Robert Bosch
Uwe Behringer,
UBC Microelectronics
Henning Wicht, WTC
Jens Koch, X-FAB
Jean-Christophe. Eloy, Yole Développement
Markus Gabriel, Suss MicroTec
Peter ten Berge, ASML
Christian Schaefer, PVA TePla

Christine Neuy, IVAM

Who should attend:

MEMS/MST companies and R&D institutions, with their equipment, materials and service providers, will get great opportunities for their managers and professionals to network and share learning in technology and market developments for successful MEMS/MST production strategies.

Price:

Before 03 March 2006: SEMI Member euro230/Non-member euro260
After 03 March 2006: euro280
(includes paper proceedings, coffee breaks, lunch and reception)

   

Register here

Venue:

ArabellaSheraton Grand Hotel
Arabellastrasse, 6
D-81925 Munich
Germany
Tel: +49 89 92 64 – 0
Fax: +49 89 92 64 – 86 99
www.arabellasheraton.com

Special rates were negotiated:

Room rates (Superior/ Executive category):
Single room: euro150
Double room: euro175
Breakfast: +22 euro per person

These rates are only valid till 13 March 2006!

Book your hotel room here.