ASMC 2007

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Collaborate. Innovate. Accelerate.

18th Annual IEEE/SEMI® Advanced Semiconductor Manufacturing Conference
11-12 June 2007, Stresa, Italy

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About ASMC

Semiconductor industry growth relies on continuous improvement and rapid evaluation and implementation of the latest process innovations. The dynamic nature of the semiconductor industry makes information sharing across sectors a vital aspect of innovation and continuous improvement.

For nearly two decades, ASMC has facilitated this sharing by presenting methodologies, approaches and techniques required to achieve world-class semiconductor manufacturing. The conference increases knowledge of semiconductor production methods, encourages open communication between participants and promotes strategic relationships between users and suppliers needed to achieve manufacturing excellence and improve global competitiveness.

Those responsible for directing, managing, designing, supplying and implementing semiconductor manufacturing performance improvements find ASMC a valuable source of cost effective, hands-on solutions and innovations.


  • ASMC features peer-reviewed and approved manuscripts that cover a wide range of fab performance issues:
  • Advanced Metrology
  • Advanced Processes and Materials
  • Advanced Process Control
  • Contamination Free Manufacturing (CFM)
  • Cost Reduction, Equipment Reliability and Productivity
  • Defect Inspection and Reduction
  • Design for Manufacturability (DFM)
  • Factory Automation and Dynamics
  • Industrial Engineering
  • Time to Market

Who Should Attend

  • chief technology officers
  • fab managers
  • process engineers
  • product managers
  • other supplier and IDM technical experts.

Sponsor Opportunities

For information on sponsorship opportunities, please contact Margaret Kindling at mkindling@semi.orgor call

Best Paper Awards

Best paper awards are presented each year to the best overall ASMC paper and the best student ASMC paper.
The ASMC 2006 Toppan PhotomaskBest Paper Award is presented to: “Smaller is Better? Maximization of Good Chips Per Wafer by Co-Optimization of Yield and Chip Area” Hanno Melzner, Infineon Technologies

The ASMC 2006 ISMIBest Student Paper Award is presented to: "Robust Real-Time Thin Film Thickness Estimation" Choon Meng Kiew and Arthur Tay, National University of Singapore, Jay H. Lee, Georgia Institute of Technology

Contact Us

If you have any questions regarding ASMC 2007, please contact Margaret Kindling at mkindling@semi.orgor call To order the CD-ROM of the ASMC 2006 technical proceedings, please contact SEMI customer service at 1.408.943.6901.


Our special appreciation to the ASMC committee members who have volunteered countless hours in support of ASMC 2007. Please click here for a complete list of committee members



SEMI would like to thank the following ASMC 2007 sponsors.















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