Challenges and Solutions for Integration of Sensors with Flexible, Hybrid, Printed Systems
Dr. Spangler received his Ph.D. in electrical engineering from The University of Michigan in 1988 and is currently the President of Aspen Microsystems, LLC a microsystems product development and intellectual property company with specialization in semiconductor devices, packaging and assembly.
Chip was previously the President and CTO of Aspen Technologies a semiconductor package design and assembly subcontracting company that provided services for customers in medical, industrial, telecom and mil-aero markets. Among these products were ultra high-resolution displays, several DNA analysis products, implantable devices for neuromodulation, and MEMS switch arrays for telecom applications. Prior to this, Chip was employed at Ford Microelectronics where he had responsibility for a number of microelectronic programs including analog IC design, pressure sensors, micro-machined fuel injectors, as well as airbag and chassis accelerometers. His work lead directly to the production of the world's first wafer-level packaged, plastic surface-mount airbag accelerometer.
Dr. Spangler is the author of over 30 technical publications and 9 patents. He is currently an editor for IEEE Journal of Microelectromechanical Systems (JMEMS) and he serves on the board of directors several organizations. He has also been active in organizing a number of technical conferences including the biannual Transducers Conference as well as the Hilton Head Solid State Sensor Workshop.
|Mary Ann Maher|
Mary Ann Maher is the CEO of SoftMEMS LLC. She received her B.S. degree (1982) from Penn State University in Computer Science, and her Ph.D. degree (1989) from Caltech in the area of semiconductor device modeling, developing a new charge-based transistor model. At Caltech, she conducted research in the area of neuromorphic systems, analog circuits and transistor modeling. She pursued post- doctoral studies at the Swiss Center for Electronics and Microtechnology (CSEM) in Neuchatel, Switzerland, where she studied analog memories and low-power analog ICs with on-chip sensors for artificial vision applications. Joining Tanner Research in 1992, she began the simulation and modeling group and launched Tanner’s T-Spice analog circuit simulator product, the MEMS Pro Microsystems, and MCM Pro multi-chip module and packaging design tool suites. She moved to MEMSCAP in 1999 as an Executive Vice President and became the company’s CTO in 2001. She founded SoftMEMS LLC in 2004 to address the need for co-design tools for systems incorporating MEMS sensors, electronics and packaging. Her research interests include analog and low power circuits, MEMS, Sensors,IC and packaging design tools and modeling and simulation of physical systems.*